BC817-16 / -25 / -40 NPN SURFACE MOUNT SMALL SIGNAL TRANSISTOR Please click here to visit our online spice models database. Features Mechanical Data • • • • • • • • • Ideally Suited for Automated Insertion Epitaxial Planar Die Construction For Switching, AF Driver and Amplifier Applications Complementary PNP Types Available (BC807) Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4) Qualified to AEC-Q101 Standards for High Reliability Case: SOT-23 Case Material: Molded Plastic, “Green” Molding Compound, Note 4. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating) Solderable per MIL-STD-202, Method 208 Pin Connections: See Diagram Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.008 grams (approximate) • • • • • • C E B Top View Maximum Ratings Device Schematic @TA = 25°C unless otherwise specified Characteristic Collector-Emitter Voltage Emitter-Base Voltage Collector Current Peak Collector Current Peak Emitter Current Symbol VCEO VEBO IC ICM IEM Value 45 5.0 800 1000 1000 Unit V V mA mA mA Symbol PD RθSB RθJA TJ, TSTG Value 310 320 403 -65 to +150 Unit mW °C/W °C/W °C Thermal Characteristics Characteristic Power Dissipation at TSB = 50°C (Note 1) Thermal Resistance, Junction to Substrate Backside (Note 1) Thermal Resistance, Junction to Ambient Air (Note 1) Operating and Storage Temperature Range Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic (Note 2) Current Gain Group -16 -25 -40 DC Current Gain Current Gain Group -16 -25 -40 Collector-Emitter Saturation Voltage Base-Emitter Voltage VCE(SAT) VBE Min 100 160 250 60 100 170 — — Collector-Emitter Cutoff Current ICES — Emitter-Base Cutoff Current IEBO — Max 250 400 600 — — — 0.7 1.2 100 5.0 100 fT 100 — MHz CCBO — 12 pF Gain Bandwidth Product Collector-Base Capacitance Notes: 1. 2. 3. 4. Symbol hFE Unit Test Condition — VCE = 1.0V, IC = 100mA — VCE = 1.0V, IC = 300mA V V nA µA nA IC = 500mA, IB = 50mA VCE = 1.0V, IC = 300mA VCE = 45V VCE = 25V, Tj = 150°C VEB = 4.0V VCE = 5.0V, IC = 10mA, f = 50MHz VCB = 10V, f = 1.0MHz 2 Device mounted on Ceramic Substrate 0.7mm; 2.5cm area. Short duration pulse test used to minimize self-heating effect. No purposefully added lead. Halogen and Antimony Free. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. BC817-16 / -25 / -40 Document number: DS11107 Rev. 18 - 2 1 of 4 www.diodes.com April 2009 © Diodes Incorporated BC817-16 / -25 / -40 500 IC, COLLECTOR CURRENT (mA) PD, POWER DISSIPATION (mW) 400 300 200 100 400 300 200 100 RθSB = 320°C/W 0 0 0 100 200 TSB, SUBSTRATE TEMPERATURE (° C) Fig. 1 Power Dissipation vs. Substrate Temperature (Note 1) 1,000 hFE, DC CURRENT GAIN 60 40 2 VCE = 1V 150° C T A = 25° C -50° C 100 20 0 10 0 10 20 VCE, COLLECTOR-EMITTER VOLTAGE (V) Fig. 3 Typical Collector Current vs. Collector-Emitter Voltage 0.5 VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V) 1 VCE, COLLECTOR-EMITTER VOLTAGE (V) Fig. 2 Typical Collector Current vs. Collector-Emitter Voltage 80 1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 4 Typical DC Current Gain vs. Collector Current 0.1 1,000 typical limits at TA = 25° C fT, GAIN-BANDWIDTH PRODUCT (MHz) IC, COLLECTOR CURRENT (mA) 100 0 0.4 IC / IB = 10 0.3 0.2 25° C 0.1 150° C -50° C 100 10 0 0.1 100 1,000 1 10 IC, COLLECTOR CURRENT (mA) Fig. 5 Typical Collector-Emitter Saturation Voltage vs. Collector Current BC817-16 / -25 / -40 Document number: DS11107 Rev. 18 - 2 2 of 4 www.diodes.com 1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 6 Gain-Bandwidth Product vs. Collector Current April 2009 © Diodes Incorporated BC817-16 / -25 / -40 Ordering Information (Note 5) Part Number BC817-xx-7-F Case SOT-23 Packaging 3000/Tape & Reel *xx = gain group, e.g. BC817-16-7-F. Notes: 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information Date Code Key Year 1998 Code J Month Code 1999 K 2000 L Jan 1 Feb 2 2001 M 2002 N Mar 3 2003 P YM K6x K6x = Product Type Marking Code: K6A = BC817-16 K6B = BC817-25 K6C = BC817-40 YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September) 2004 2005 R S Apr 4 May 5 2006 T 2007 U Jun 6 Jul 7 2008 V 2009 W Aug 8 2010 X 2011 Y Sep 9 2012 Z Oct O 2013 A Nov N 2014 B 2015 C Dec D Package Outline Dimensions A B C H K M K1 D J F L G SOT-23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00 K1 0.400 L 0.45 0.61 0.55 M 0.085 0.18 0.11 0° 8° α All Dimensions in mm Suggested Pad Layout Y Z C X BC817-16 / -25 / -40 Document number: DS11107 Rev. 18 - 2 Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 2.0 C 1.35 E E 3 of 4 www.diodes.com April 2009 © Diodes Incorporated BC817-16 / -25 / -40 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2009, Diodes Incorporated www.diodes.com BC817-16 / -25 / -40 Document number: DS11107 Rev. 18 - 2 4 of 4 www.diodes.com April 2009 © Diodes Incorporated