MC10E195, MC100E195 5VECL Programmable Delay Chip Description The MC10E/100E195 is a programmable delay chip (PDC) designed primarily for clock de-skewing and timing adjustment. It provides variable delay of a differential ECL input transition. The delay section consists of a chain of gates organized as shown in the logic symbol. The first two delay elements feature gates that have been modified to have delays 1.25 and 1.5 times the basic gate delay of approximately 80 ps. These two elements provide the E195 with a digitally-selectable resolution of approximately 20 ps. The required device delay is selected by the seven address inputs D[0:6], which are latched on chip by a high signal on the latch enable (LEN) control. Because the delay programmability of the E195 is achieved by purely differential ECL gate delays the device will operate at frequencies of > 1.0 GHz while maintaining over 600 mV of output swing. The E195 thus offers very fine resolution, at very high frequencies, that is selectable entirely from a digital input allowing for very accurate system clock timing. An eighth latched input, D7, is provided for cascading multiple PDC’s for increased programmable range. The cascade logic allows full control of multiple PDC’s, at the expense of only a single added line to the data bus for each additional PDC, without the need for any external gating. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. The 100 Series contains temperature compensation. http://onsemi.com PLCC−28 FN SUFFIX CASE 776 MARKING DIAGRAM* 1 MCxxxE195FNG AWLYYWW xxx A WL YY WW G = 10 or 100 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Features • • • • • • • • • Meets or Exceeds JEDEC Spec EIA/JESD78 IC 2.0 ns Worst Case Delay Range ≈20 ps/Delay Step Resolution >1.0 GHz Bandwidth On Chip Cascade Circuitry PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input 50 kW Pulldown Resistors ESD Protection: Human Body Model; > 2 kV, Machine Model; > 200 V • • • • Latchup Test Moisture Sensitivity Level: Pb = 1; Pb−Free = 3 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 368 devices Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 10 1 Publication Order Number: MC10E195/D MC10E195, MC100E195 LOGIC DIAGRAM AND PINOUT ASSIGNMENT D2 D3 D4 D5 D6 D7 NC 25 24 23 22 21 20 19 Table 1. PIN DESCRIPTION PIN D1 26 18 NC D0 27 17 NC LEN 28 16 VCC VEE 1 15 VCCO IN 2 14 Q IN 3 13 Q VBB 4 12 VCCO MC10E195 MC100E195 NC EN 9 10 ECL Signal Input ECL Input Enable ECL MUX Select Inputs ECL Signal Output ECL Latch Enable ECL Min Delay Set ECL Max Delay Set ECL Cascade Signal Reference Voltage Output Positive Supply Negative Supply No Connect Table 2. TRUTH TABLE 11 CASCADE NC 8 CASCADE 7 SET MAX 6 SET MIN 5 FUNCTION IN/IN EN D[0:7] Q/Q LEN SET MIN SET MAX CASCADE, CASCADE VBB VCC, VCCO VEE NC *All VCC and VCCO pins are tied together on the die. Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. Pinout: 28-Lead PLCC (Top View) EN. L Q = IN EN H Q Logic Low LEN L Pass Through D[0:10] LEN H Latch D[0:10] SETMIN L Normal Mode SETMIN H Min Delay Path SETMAX L Normal Mode SETMAX H Max Delay Path VBB 11 IN IN EN * 1.25 0 0 1 1 0 1 1 0 1 1 0 4 GATES 1 8 GATES 1 0 16 GATES 1 0 1 * 1.5 0 1 VEE 1 Q Q CASCADE LEN LEN SET MIN SET MAX 7 BIT LATCH Q LATCH D CASCADE CASCADE D0 * delays are 25% or 50% longer than * standard (standard ≈ 80 ps) D1 D2 D3 D4 D5 D6 Figure 2. Logic Diagram − Simplified http://onsemi.com 2 D7 MC10E195, MC100E195 Table 3. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range 0 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm PLCC−28 PLCC−28 63.5 43.5 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board PLCC−28 VEE PECL Operating Range NECL Operating Range Tsol Wave Solder Pb Pb−Free Condition 2 VI v VCC VI w VEE 22 to 26 °C/W 4.2 to 5.7 −5.7 to −4.2 V V 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 MC10E195, MC100E195 Table 4. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 1) 0°C Symbol Characteristic Min 25°C Typ Max 130 156 Min 85°C Typ Max 130 156 Min Typ Max Unit 130 156 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3980 4070 4160 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 2) 3050 3210 3370 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage (Single−Ended) 3830 3995 4160 3870 4030 4190 3940 4110 4280 mV VIL Input LOW Voltage (Single−Ended) 3050 3285 3520 3050 3285 3520 3050 3302 3555 mV VBB Output Voltage Reference 3.62 3.74 3.65 3.75 3.69 3.81 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 2.2 4.6 2.2 4.6 2.2 4.6 V IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 0.3 150 0.5 0.25 0.3 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. Table 5. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 4) 0°C Symbol Characteristic Min 25°C Typ Max 130 156 Min 85°C Typ Max 130 156 Min Typ Max Unit 130 156 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 5) −1020 −930 −840 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 5) −1950 −1790 −1630 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage (Single−Ended) −1170 −1005 −840 −1130 −970 −810 −1060 −890 −720 mV VIL Input LOW Voltage (Single−Ended) −1950 −1715 −1480 −1950 −1715 −1480 −1950 −1698 −1445 mV VBB Output Voltage Reference −1.38 −1.27 −1.35 −1.25 −1.31 −1.19 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 6) −2.8 −0.4 −2.8 −0.4 −2.8 −0.4 V IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 0.3 150 0.5 0.065 0.3 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V. 5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. 6. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. http://onsemi.com 4 MC10E195, MC100E195 Table 6. 100E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 7) 0°C Symbol Characteristic Min 25°C Typ Max 130 156 Min 85°C Typ Max 130 156 Min Typ Max Unit 150 179 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 8) 3975 4050 4120 3975 4050 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 8) 3190 3295 3380 3190 3255 3380 3190 3260 3380 mV VIH Input HIGH Voltage (Single−Ended) 3835 3975 4120 3835 3975 4120 3835 3975 4120 mV VIL Input LOW Voltage (Single−Ended) 3190 3355 3525 3190 3355 3525 3190 3355 3525 mV VBB Output Voltage Reference 3.62 3.74 3.62 3.74 3.62 3.74 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 9) 2.2 4.6 2.2 4.6 2.2 4.6 V IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 0.3 150 0.5 0.25 0.5 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V. 8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. 9. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. Table 7. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 10) 0°C Symbol Characteristic Min 25°C Typ Max 130 156 Min 85°C Typ Max 130 156 Min Typ Max Unit 150 179 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 11) −1025 −950 −880 −1025 −950 −880 −1025 −950 −880 mV VOL Output LOW Voltage (Note 11) −1810 −1705 −1620 −1810 −1745 −1620 −1810 −1740 −1620 mV VIH Input HIGH Voltage (Single−Ended) −1165 −1025 −880 −1165 −1025 −880 −1165 −1025 −880 mV VIL Input LOW Voltage (Single−Ended) −1810 −1645 −1475 −1810 −1645 −1475 −1810 −1645 −1475 mV VBB Output Voltage Reference −1.38 −1.26 −1.38 −1.26 −1.38 −1.26 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 12) −2.8 −0.4 −2.8 −0.4 −2.8 −0.4 V IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 0.3 150 0.5 0.25 0.5 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V. 11. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. 12. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. http://onsemi.com 5 MC10E195, MC100E195 Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 13) 0°C Symbol Min Characteristic Typ fMAX Maximum Toggle Frequency tPLH tPHL Propagation Delay IN to Q; Tap = 0 IN to Q; Tap = 127 EN to Q; Tap = 0 D7 to CASCADE 1210 3200 1250 300 1360 3570 1450 450 tRANGE Programmable Range tPD (max) − tPD (min) 2000 2175 Dt Step Delay (Note 14) 55 115 250 505 1000 17 34 68 136 272 544 1088 D1 D0 Lin Linearity (Note 15) tSKEW Duty Cycle Skew tJITTER Random Clock Jitter (RMS) ts Setup Time th Hold Time tR Release Time tjit Jitter tr tf Output Rise/Fall Time 25°C Max Min Typ 85°C Max Min Typ Max > 1.0 D0 High D1 High D2 High D3 High D4 High D5 High D6 High 1510 3970 1650 700 105 180 325 620 1190 1240 3270 1275 300 1390 3630 1475 450 2050 2240 55 115 250 515 1030 17.5 35 70 140 280 560 1120 D1 D0 1540 4030 1675 700 105 180 325 620 1220 1440 3885 1350 300 1590 4270 1650 450 2375 2580 65 140 305 620 1240 21 42 84 168 336 672 1344 D1 D0 1765 4710 1950 700 ps ps ps 120 205 380 740 1450 ps tPHL−tPLH (Note 16) ±30 ±30 ±30 <5 <5 <5 D to LEN D to IN (Note 17) EN to IN (Note 18) 200 800 200 0 200 800 200 0 200 800 200 0 LEN to D IN to EN (Note 19) 500 0 250 500 0 250 500 0 250 EN to IN (Note 20) SET MAX to LEN SET MIN to LEN 300 800 800 300 800 800 <5 20−80% (Q) 20−80% (CASCADE) Unit GHz 125 300 225 450 125 300 ps ps ps 300 800 800 <5 325 650 ps 225 450 <5 325 650 125 300 225 450 ps 325 650 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 13. 10 Series: VEE can vary −0.46 V / +0.06 V. 100 Series: VEE can vary −0.46 V / +0.8 V. 14. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations of asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range. 15. The linearity specification guarantees to which delay control input the programmable steps will be monotonic (i.e. increasing delay steps for increasing binary counts on the control inputs Dn). Typically the device will be monotonic to the D0 input, however under worst case conditions and process variation, delays could decrease slightly with increasing binary counts when the D0 input is the LSB. With the D1 input as the Least Significant Bit (LSB), the device is guaranteed to be monotonic over all specified environmental conditions and process variation. 16. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output. 17. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set. 18. This setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than ±75 mV to that IN/IN transition. 19. This hold time is the minimum time that EN must remain asserted after a negative going IN or positive going IN to prevent an output response greater than ±75 mV to that IN/IN transition. 20. This release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets the specified IN to Q propagation delay and transition times. http://onsemi.com 6 MC10E195, MC100E195 ADDRESS BUS (A0−A6) D1 D7 D6 D5 D4 D1 D0 D0 E195 Chip #1 LEN VEE VCC LEN VCCO VEE E195 Chip #2 VCC VCCO CASCADE VBB CASCADE VCCO EN EN VBB SET MAX Q SET MIN Q IN CASCADE IN Q CASCADE Q IN SET MAX IN SET MIN INPUT D3 D2 D7 D6 D5 D4 D3 D2 A7 OUTPUT VCCO Figure 3. Cascading Interconnect Architecture Cascading Multiple E195’s Chip #1 on the other hand will have both SET MIN and SET MAX de-asserted so that its delay will be controlled entirely by the address bus A0−A6. If the delay needed is greater than can be achieved with 31.75 gate delays (1111111 on the A0−A6 address bus) D7 will be asserted to signal the need to cascade the delay to the next E195 device. When D7 is asserted the SET MIN pin of chip #2 will be de-asserted and the delay will be controlled by the A0−A6 address bus. Chip #1 on the other hand will have its SET MAX pin asserted resulting in the device delay to be independent of the A0−A6 address bus. When the SET MAX pin of chip #1 is asserted the D0 and D1 latches will be reset while the rest of the latches will be set. In addition, to maintain monotonicity an additional gate delay is selected in the cascade circuitry. As a result when D7 of chip #1 is asserted the delay increases from 31.75 gates to 32 gates. A 32 gate delay is the maximum delay setting for the E195. To expand this cascading scheme to more devices one simply needs to connect the D7 input and CASCADE outputs of the current most significant E195 to the new most significant E195 in the same manner as pictured in Figure 3. The only addition to the logic is the increase of one line to the address bus for cascade control of the second PDC. To increase the programmable range of the E195 internal cascade circuitry has been included. This circuitry allows for the cascading of multiple E195’s without the need for any external gating. Furthermore this capability requires only one more address line per added E195. Obviously cascading multiple PDC’s will result in a larger programmable range however this increase is at the expense of a longer minimum delay. Figure 3 illustrates the interconnect scheme for cascading two E195’s. As can be seen, this scheme can easily be expanded for larger E195 chains. The D7 input of the E195 is the cascade control pin. With the interconnect scheme of Figure 3 when D7 is asserted it signals the need for a larger programmable range than is achievable with a single device. An expansion of the latch section of the block diagram is pictured below. Use of this diagram will simplify the explanation of how the cascade circuitry works. When D7 of chip #1 above is low the cascade output will also be low while the cascade bar output will be a logical high. In this condition the SET MIN pin of chip #2 will be asserted and thus all of the latches of chip #2 will be reset and the device will be set at its minimum delay. Since the RESET and SET inputs of the latches are overriding any changes on the A0−A6 address bus will not affect the operation of chip #2. TO SELECT MULTIPLEXERS BIT 0 D0 BIT 1 Q0 D1 BIT 2 Q1 D2 BIT 3 Q2 D3 BIT 4 Q3 D4 BIT 5 Q4 D5 BIT 6 Q5 D6 BIT 7 Q6 D7 Q7 LEN LEN LEN LEN LEN LEN LEN LEN Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset Reset SET MIN SET MAX Figure 4. Expansion of the Latch Section of the E195 Block Diagram http://onsemi.com 7 CASCADE CASCADE MC10E195, MC100E195 1600 30 DELAY VARIATION (ps) 25 20 PROPAGATION DELAY (ps) Note: All Taps Selected SET = H, Temp. = 0°C 15 10 5 0 −5 −10 −15 −5.5 −5.3 −5.1 −4.9 −4.7 −4.5 1575 1550 1525 1500 1475 1450 1425 1400 1375 1350 1325 1300 −4.3 0 10 20 30 40 50 60 70 80 90 VEE, (V) Temperature (°C) Figure 5. Change in Delay vs. Change in Supply Voltage Figure 6. Delay vs. Temperature (Fixed Path) 100 4400 PROPAGATION DELAY (ps) PROPAGATION DELAY (ps) 4300 4200 4100 4000 3900 3800 3700 3600 3600 85°C 2800 0°C 2000 3500 3400 0 10 20 30 40 50 60 70 80 90 100 1200 0 64 32 Temperature (°C) Figure 7. Delay vs. Temperature (Max. Delay). Figure 8. 100E195 Temperature Effects on Delay. 3900 84 3400 80 DELAY (ps) PROPAGATION DELAY (ps) 88 76 72 2900 2400 1900 68 64 128 96 Tap Delay 0 10 20 30 40 50 60 70 80 90 1400 100 0 20 40 60 80 100 Temperature (°C) Tap Selection Figure 9. Delay vs. Temperature (Per Gate). Figure 10. E195 Delay Linearity. http://onsemi.com 8 120 MC10E195, MC100E195 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 11. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping † MC10E195FN PLCC−28 37 Units / Rail MC10E195FNG PLCC−28 (Pb−Free) 37 Units / Rail MC10E195FNR2 PLCC−28 500 / Tape & Reel MC10E195FNR2G PLCC−28 (Pb−Free) 500 / Tape & Reel MC100E195FN PLCC−28 37 Units / Rail MC100E195FNG PLCC−28 (Pb−Free) 37 Units / Rail MC100E195FNR2 PLCC−28 500 / Tape & Reel MC100E195FNR2G PLCC−28 (Pb−Free) 500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 9 MC10E195, MC100E195 PACKAGE DIMENSIONS PLCC−28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 776−02 ISSUE E −N− 0.007 (0.180) B Y BRK T L−M M 0.007 (0.180) U M N S T L−M S S N S D Z −M− −L− W 28 D X V 1 A 0.007 (0.180) R 0.007 (0.180) C M M T L−M T L−M S S N S N S 0.007 (0.180) H N S S G J 0.004 (0.100) −T− SEATING T L−M S N T L−M S N S K PLANE F VIEW S G1 M K1 E S T L−M S VIEW D−D Z 0.010 (0.250) 0.010 (0.250) G1 VIEW S S NOTES: 1. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10_ 0.410 0.430 0.040 −−− http://onsemi.com 10 MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10_ 10.42 10.92 1.02 −−− 0.007 (0.180) M T L−M S N S MC10E195, MC100E195 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10E195/D