BC847BLP 45V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features Mechanical Data • • • • • • • Complementary PNP Type Available (BC857BLP) Ultra-Small Leadless Surface Mount Package “Lead Free”, RoHS Compliant (Note 1) Halogen and Antimony Free "Green" Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability • • • Case: DFN1006-3 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.0009 grams C DFN1006-3 B B C E Bottom View Device Symbol E Top View Device Schematic Ordering Information (Note 3) Product BC847BLP-7 BC847BLP-7B Notes: Marking 1F 1F Reel size (inches) 7 7 Tape width (mm) 8mm 8mm Quantity per reel 3,000 10,000 1. No purposefully added lead. 2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information BC847BLP-7 BC847BLP-7B 1F 1F Top View Dot Denotes Collector Side Top View Bar Denotes Base and Emitter Side BC847BLP Document number: DS30525 Rev. 11 - 2 1 of 5 www.diodes.com 1F = Product Type Marking Code February 2011 © Diodes Incorporated BC847BLP Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Symbol VCBO VCEO VEBO IC Value 50 45 6.0 100 Unit V V V mA Value 250 500 -55 to +150 Unit mW °C/W °C Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient (Note 4) Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic (Note 5) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage DC Current Gain Symbol BVCBO BVCEO BVEBO hFE Min 50 45 6 200 Typ — — — 350 80 200 Max — — — 450 250 600 Collector-Emitter Saturation Voltage VCE(sat) — Base-Emitter Saturation Voltage VBE(sat) Base-Emitter Voltage — — 700 900 — — mV VBE(ON) 580 — 640 725 700 770 mV Collector-Cutoff Current ICBO — — — — 15 5.0 nA µA Gain Bandwidth Product fT 100 — — MHz CCBO — 3.0 — pF Collector-Base Capacitance Notes: Unit V V V — mV Test Condition IC = 10μA, IB = 0 IC = 10mA, IB = 0 IE = 1μA, IC = 0 VCE = 5.0V, IC = 2.0mA IC = 10mA, IB = 0.5mA IC = 100mA, IB = 5.0mA IC = 10mA, IB = 0.5mA IC = 100mA, IB = 5.0mA VCE = 5.0V, IC = 2.0mA VCE = 5.0V, IC = 10mA VCB = 30V VCB = 30V, TA = 150°C VCE = 5.0V, IC = 10mA, f = 100MHz VCB = 10V, f = 1.0MHz 4. Device mounted on FR-4 PCB. 5. Short duration pulse test used to minimize self-heating effect. BC847BLP Document number: DS30525 Rev. 11 - 2 2 of 5 www.diodes.com February 2011 © Diodes Incorporated BC847BLP 350 IC/IB = 20 300 250 V(CE)SAT, COLLECTOR-EMITTER SATURATION VOLTAGE (mV) PD, POWER DISSIPATION (mW) 300 200 150 100 50 RθJA = 500 °C/W 250 200 TA = 125ºC 150 TA = 85ºC TA = 150ºC 100 TA = -55ºC 50 TA = 25ºC 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Dissipation vs. Ambient Temperature (Note 4) 1,000 TA = -55ºC 800 TA = 25ºC TA = 85ºC 600 400 TA = 150ºC TA = 125ºC 200 VCE = 5V 0 0 4 6 8 2 IC, COLLECTOR CURRENT (mA) Fig. 3 Typical Base-Emitter Turn-On Voltage vs. Collector Current 10 100 IC, COLLECTOR CURRENT (mA) Fig. 2 Typical Collector-Emitter Saturation Voltage vs. Collector Current 1 150 10 V(BE)SAT, BASE-EMITTER SATURATION VOLTAGE (V) VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (mV) 0 0 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 10 100 IC, COLLECTOR CURRENT (mA) Fig. 4 Typical Base-Emitter Saturation Voltage vs. Collector Current hFE, DC CURRENT GAIN 1,000 100 10 1 0.1 100 10 1,000 IC, COLLECTOR CURRENT (mA) Fig. 5 Typical DC Current Gain vs. Collector Current 1 BC847BLP Document number: DS30525 Rev. 11 - 2 3 of 5 www.diodes.com February 2011 © Diodes Incorporated BC847BLP Package Outline Dimensions DFN1006-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.35 ⎯ ⎯ L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 0.40 ⎯ ⎯ All Dimensions in mm A A1 D b1 E e b2 L2 L3 L1 Suggested Pad Layout C X1 X G2 G1 Dimensions Z G1 G2 X X1 Y C Value (in mm) 1.1 0.3 0.2 0.7 0.25 0.4 0.7 Y Z BC847BLP Document number: DS30525 Rev. 11 - 2 4 of 5 www.diodes.com February 2011 © Diodes Incorporated BC847BLP IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com BC847BLP Document number: DS30525 Rev. 11 - 2 5 of 5 www.diodes.com February 2011 © Diodes Incorporated