MC10H125 Quad MECL−to−TTL Translator Description The MC10H125 is a quad translator for interfacing data and control signals between the MECL section and saturated logic section of digital systems. The 10H part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in propagation delay, and no increase in power−supply current. Outputs of unused translators will go to low state when their inputs are left open. http://onsemi.com MARKING DIAGRAMS* 16 MC10H125L AWLYYWW Features • Propagation Delay, 2.5 ns Typical • Voltage Compensated • Improved Noise Margin 150 mV 1 CDIP−16 L SUFFIX CASE 620A (Over Operating Voltage and Temperature Range) • MECL 10K Compatible • Pb−Free Packages are Available* 16 MC10H125P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 1 10H125 ALYWG SOEIAJ−16 CASE 966 1 20 10H125G AWLYYWW 20 1 PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 12 1 Publication Order Number: MC10H125/D MC10H125 2 4 3 6 5 7 10 12 11 14 13 15 1 VBB* GND = Pin 16 VCC ( +5.0 Vdc) = Pin 9 VEE ( −5.2 Vdc) = Pin 8 VBB 1 16 GND Ain 2 15 Din Ain 3 14 Din Aout 4 13 Dout Bout 5 12 Cout Bin 6 11 Cin Bin 7 10 Cin VEE 8 9 VCC Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables. *VBB to be used to supply bias to the MC10H125 only and bypassed (when used) with 0.01 mF to 0.1 mF capacitor to ground (0 V). VBB can source < 1.0 mA. Figure 1. Logic Diagram Figure 2. Pin Assignment Table 1. DIP CONVERSION TABLES 16−Pin DIL to 20−Pin PLCC 16 PIN DIL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 20 PIN PLCC 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 20−Pin DIL to 20−Pin PLCC 20 PIN DIL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 20 PIN PLCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 http://onsemi.com 2 MC10H125 Table 2. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 5.0 V) Characteristic −8.0 to 0 Vdc VCC Power Supply (VEE = −5.2 V) 0 to +7.0 Vdc VI Input Voltage (VCC = 5.0 V) 0 to VEE Vdc TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range −55 to +150 −55 to +165 °C °C − Plastic − Ceramic Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 3. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V +5%; VCC = 5.0 V + 5.0 %) (Note 2) 0° 25° 75° Min Max Min Max Min Max Unit − 44 − 40 − 44 mA Positive Power Supply Drain Current − 63 − 63 − 63 mA − 40 − 40 − 40 mA IinH Input Current − 225 − 145 − 145 mA ICBO Input Leakage Current − 1.5 − 1.0 − 1.0 mA VOH High Output Voltage 2.5 − 2.5 − 2.5 − Vdc − 0.5 − 0.5 − 0.5 Vdc Symbol IE Characteristic Negative Power Supply Drain Current ICCH ICCL IOH = −1.0 mA VOL Low Output Voltage IOL = +20 mA VIH High Input Voltage (Note 1) −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage (Note 1) −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc IOS Short Circuit Current VBB Reference Voltage VCMR Common Mode Range (Note 3) 60 150 60 150 50 150 mA −1.38 −1.27 −1.35 −1.25 −1.31 −1.19 Vdc − − −2.85 to +0.3 V Typical VPP Input Sensitivity (Note 4) 150 mV 1. When VBB is used as the reference voltage. 2. Each MECL 10H™ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. 3. Differential input not to exceed 1.0 Vdc. 4. 150 mVp−p differential input required to obtain full logic swing on output. http://onsemi.com 3 MC10H125 Table 4. AC CHARACTERISTICS 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit tpd Propagation Delay 0.8 3.3 0.85 3.35 0.9 3.4 ns tr Rise Time (Note 5) 0.3 1.2 0.3 1.2 0.3 1.2 ns tf Fall Time (Note 5) 0.3 1.2 0.3 1.2 0.3 1.2 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Output Voltage = 1.0 V to 2.0 V. RL = 500 W to GND and CL = 25 pF to GND. Refer to Figure 1. APPLICATION TTL RECEIVER CHARACTERISTIC TEST *CL includes fixture capacitance CL* RL AC TEST LOAD GND Figure 1. TTL Output Loading Used for Device Evaluation APPLICATION INFORMATION The MC10H125 incorporates differential inputs and Schottky TTL “totem pole” outputs. Differential inputs allow for use as an inverting/non−inverting translator or as a differential line receiver. The VBB reference voltage is available on Pin 1 for use in single−ended input biasing. The outputs of the MC10H125 go to a low−logic level whenever the inputs are left floating, and a high−logic output level is achieved with a minimum input level of 150 mVp−p. An advantage of this device is that MECL−level information can be received, via balanced twisted pair lines, in the TTL equipment. This isolates the MECL−logic from the noisy TTL environment. Power supply requirements are ground, +5.0 V and −5.2 V. http://onsemi.com 4 MC10H125 ORDERING INFORMATION Package Shipping † MC10H125FN PLLC−20 46 Units / Rail MC10H125FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H125FNR2 PLLC−20 500 / Tape & Reel MC10H125FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H125L CDIP−16 25 Unit / Rail MC10H125M SOEIAJ−16 50 Unit / Rail MC10H125MG SOEIAJ−16 (Pb−Free) 50 Unit / Rail MC10H125MEL SOEIAJ−16 2000 / Tape & Reel MC10H125MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H125P PDIP−16 25 Unit / Rail MC10H125PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC10H125 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 6 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H125 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c 0.10 (0.004) M CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 B M L 16X 0.25 (0.010) E F C K T N SEATING PLANE G 16X 0.25 (0.010) M D T A http://onsemi.com 7 M J T B MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 MC10H125 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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