A Product Line of Diodes Incorporated ZXLD1370 60V HIGH ACCURACY BUCK/BOOST/BUCK-BOOST LED DRIVER-CONTROLLER WITH AEC-Q100 Description Pin Assignments The ZXLD1370 is an LED driver controller IC for driving external MOSFETs to drive high current LEDs. It is a multi-topology controller enabling it to efficiently control the current through series connected LEDs. The multitopology enables it to operate in buck, boost and buckboost configurations. TSSOP-16EP The 60V capability coupled with its multi-topology capability enables it to be used in a wide range of applications and drive in excess of 15 LEDs in series. The ZXLD1370 is a modified hysteretic controller using a patent pending control scheme providing high output current accuracy in all three modes of operation. High accuracy dimming is achieved through DC control and high frequency PWM control. The ZXLD1370 uses two pins for fault diagnosis. A flag output highlights a fault, while the multi-level status pin gives further information on the exact fault. Features • • • • • • • • • 0.5% typical output current accuracy 6 to 60V operating voltage range LED driver supports Buck, Boost and Buck-boost configurations Wide dynamic range dimming o 20:1 DC dimming o 1000:1 dimming range at 500Hz Up to 1MHz switching High temperature control of LED current using TADJ AEC-Q100 Grade 1 Available in “Green” Molding Compound (No Br, Sb) with lead Free Finish/ RoHS Compliant (Note 1) Note 1: EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/products/lead_free.html. Typical Application Circuit Curve showing LED current vs. TLED Buck-boost diagram utilizing thermistor and TADJ ILED REF Rth 100% TH1 TAD 10% 70˚C 85˚C TLED Thermal network response in Buck configuration with: Rth = 2kΩ and TH1=10kΩ (beta =3900) ZXLD1370 Document number: DS32165 Rev. 4 - 2 1 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Pin Descriptions Pin Name Pin Type (Note 2) ADJ 1 I REF 2 O TADJ 3 I SHP 4 I/O STATUS 5 O SGND PGND 6 7 P P N/C 8 - N/C 9 GATE 10 O VAUX 11 P VIN 12 P ISM 13 I FLAG 14 O PWM 15 I GI 16 I PAD P EP Notes: Description Adjust input (for dc output current control) Connect to REF to set 100% output current. Drive with dc voltage (125mV<VADJ< 2.5V) to adjust output current from 10% to 200% of set value. The ADJ pin has an internal clamp that limits the internal node to less than 3V. This provides some failsafe should they get overdriven Internal 1.25V reference voltage output Temperature Adjust input for LED thermal current control Connect thermistor/resistor network to this pin to reduce output current above a preset temperature threshold. Connect to REF to disable thermal compensation function. (See section on thermal control.) Shaping capacitor for feedback control loop Connect 100pF ±20% capacitor from this pin to ground to provide loop compensation Operation status output (analog output) Pin is at 4.5V (nominal) during normal operation. Pin switches to a lower voltage to indicate specific operation warnings or fault conditions. (See section on STATUS output.) Status pin voltage is low during shutdown mode Signal ground (Connect to 0V) Power ground - Connect to 0V and pin 8 to maximize copper area Not Connected internally – recommend connection to pin 7, (PGND), to maximize PCB copper for thermal dissipation Not Connected internally – recommend connection pin 10 (GATE) to permit wide copper trace to gate of MOSFET Gate drive output to external NMOS transistor – connect to pin 9 Auxiliary positive supply to internal switch gate driver Connect to VIN, or auxiliary supply from 6V to 15V supply to reduce internal power dissipation (Refer to application section for more details) Decouple to ground with capacitor close to device (refer to Applications section) Input supply to device (6V to 60V) Decouple to ground with capacitor close to device (refer to Applications section) Current monitor input. Connect current sense resistor between this pin and VIN The nominal voltage across the resistor is 225mV Flag open drain output Pin is high impedance during normal operation Pin switches low to indicate a fault, or warning condition Digital PWM output current control Pin driven either by open Drain or push-pull 3.3V or 5V logic levels. Drive with frequency higher than 100Hz to gate output ‘on’ and ‘off’ during dimming control. The device enters standby mode when PWM pin is driven with logic low level for more than 15ms nominal (Refer to application section for more details) Gain setting input Used to set the device in Buck mode or Boost, Buck-boost modes Connect to ADJ in Buck mode operation For Boost and Buck-boost modes, connect to resistive divider from ADJ to SGND. This defines the ratio of switch current to LED current (see application section). The GI pin has an internal clamp that limits the internal node to less than 3V. This provides some failsafe should they get overdriven Exposed paddle. Connect to 0V plane for electrical and thermal management 2. Type refers to whether or not pin is an Input, Output, Input/Output or Power supply pin. ZXLD1370 Document number: DS32165 Rev. 4 - 2 2 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Functional Block Diagram D LOAD RS VIN VAUX L VIN ISENSE FLAG Error report STATUS Fast current monitor Accurate current monitor TADJ Error amp REF R1 Reference Demand current source GI Frequency & hysteresis control R2 VAUX ADJ + COMPIN - Gate driver PWM SGND ZXLD1370 Document number: DS32165 Rev. 4 - 2 3 of 36 www.diodes.com PGND March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Absolute Maximum Ratings (Voltages to GND Unless Otherwise Stated) Symbol VIN VAUX VISM VSENSE VGATE IGATE VFLAG VPWM, VADJ, VTADJ, VGI, VPWM TJ TST Parameter Input supply voltage relative to GND Auxiliary supply voltage relative to GND Current monitor input relative to GND Current monitor sense voltage (VIN-VISM) Gate driver output voltage Gate driver continuous output current Flag output voltage (Note 3) Rating -0.3 to 65 -0.3 to 65 -0.3 to 65 -0.3 to 5 -0.3 to 20 18 -0.3 to 40 Unit V V V V V mA V Other input pins (Note 3) -0.3 to 5.5 V Maximum junction temperature Storage temperature 150 -55 to 150 °C °C These are stress ratings only. Operation outside the absolute maximum ratings may cause device failure. Operation at the absolute maximum rating for extended periods may reduce device reliability. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Package Thermal Data Package Typical Unit Junction-to-Ambient, θJA (Note 4) Thermal Resistance TSSOP-16 EP 50 °C/W Junction-to-Case, θJC TSSOP-16 EP 23 °C/W Recommended Operating Conditions Symbol Parameter Performance/Comment Normal operation Functional (Note 5) Normal operation Functional VIN Input supply voltage range VAUX Auxiliary supply voltage range (Note 6) VISM VSENSE Current sense monitor input range Differential input voltage External dc control voltage applied to ADJ pin to adjust output current Reference external load current Recommended switching frequency range (Note 7) Temperature adjustment (TADJ) input voltage range Recommended PWM dimming frequency range (Note 4) PWM pulse width in dimming mode PWM pin high level input voltage PWM pin low level input voltage Operating Junction Temperature Range Gain setting ratio for boost and buck-boost modes VADJ IREF fmax VTADJ fPWM tPWMH/L VPWMH VPWML TJ GI Notes: VVIN-VISM, with 0 ≤ VADJ ≤ 2.5 DC brightness control mode from 10% to 200% REF sourcing current To achieve 1000:1 resolution To achieve 500:1 resolution PWM input high or low Ratio= VGI/VADJ Min 8 6.3 8 6.3 6.3 0 Max Unit 60 V 60 V 60 450 V mV 0.125 2.5 V 1 mA 300 1000 kHz 0 VREF V 100 100 0.002 2 0 -40 0.20 500 1000 10 5.5 0.4 125 0.50 Hz Hz ms V V °C 3.For correct operation SGND and PGND should always be connected together. 4. Measured on High Effective Thermal Conductivity Test Board" according JESD51. 5. The functional range of VIN is the voltage range over which the device will function. Output current and device parameters may deviate from their normal values for VIN and VAUX voltages between 6.3V and 8V, depending upon load and conditions. 6. VAUX can be driven from a voltage higher than VIN to provide higher efficiency at low VIN voltages, but to avoid false operation; a voltage should not be applied to VAUX in the absence of a voltage at VIN. 7. The device contains circuitry to control the switching frequency to approximately 400kHz. The maximum and minimum operating frequency is not tested in production. ZXLD1370 Document number: DS32165 Rev. 4 - 2 4 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Electrical Characteristics (Test conditions: VIN = VAUX = 12V, TA = 25°C, unless otherwise specified.) Symbol Parameter Supply and reference parameters Under-Voltage detection threshold VUVNormal operation to switch disabled Under-Voltage detection threshold VUV+ Switch disabled to normal operation IQ-IN Quiescent current into VIN IQ-AUX Quiescent current into VAUX ISB-IN Standby current into VIN. ISB-AUX Standby current into VAUX. Internal reference voltage VREF Change in reference voltage with output ΔVREF current Conditions Min Typ Max VIN or VAUX falling 5.2 5.6 6.3 VIN or VAUX rising 5.5 6 6.5 1.5 150 90 0.7 1.25 3 300 150 10 1.263 PWM pin floating. Output not switching PWM pin grounded for more than 15ms No load Sourcing 1mA Sinking 100 µA VREF_LINE Reference voltage line regulation VIN = VAUX , 6.5V<VIN = <60V Reference temperature coefficient VREF-TC DC-DC converter parameters External dc control voltage applied to ADJ DC brightness control mode VADJ pin to adjust output current (Note 8) 10% to 200% VADJ ≤ 2.5V ADJ input current (Note 8) IADJ † VADJ = 5.0V GI Voltage threshold for boost and buckVGI VADJ = 1.25V boost modes selection (Note 8) VGI ≤ 2.5V GI input current (Note 8) IGI † VGI = 5.0V PWM input current IPWM VPWM = 5.5V PWM pulse width PWM input low tPWMoff (to enter shutdown state) Thermal shutdown upper threshold Temperature rising. TSDH (GATE output forced low) Thermal shutdown lower threshold Temperature falling. TSDL (GATE output re-enabled) High-Side Current Monitor (Pin ISM) Measured into ISM pin and Input Current IISM VISM = 12V Accuracy of nominal VSENSE threshold VSENSE_acc voltage VADJ = 1.25V Over-current sense threshold voltage VSENSE-OC Notes: 8. 1.237 -5 Units V V mA µA µA µA V mV 5 -60 -90 +/-50 0.125 1.25 10 300 dB ppm/°C 2.5 V 100 5 nA µA 0.8 V 100 5 nA µA 36 100 µA 15 25 ms 150 ºC 125 ºC 11 20 µA ±0.25 ±2 % 350 375 mV The ADJ and GI pins have an internal clamp that limits the internal node to less than 3V. This provides some failsafe should those pins get overdriven. ZXLD1370 Document number: DS32165 Rev. 4 - 2 5 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Electrical Characteristics (Continued) (Test conditions: VIN = VAUX = 12V, TA = 25°C, unless otherwise specified.) Symbol Parameter Output Parameters VFLAGL FLAG pin low level output voltage IFLAGOFF FLAG pin open-drain leakage current STATUS Flag no-load output voltage VSTATUS (Note 9) RSTATUS Output impedance of STATUS output Driver output (PIN GATE) VGATEH High level output voltage VGATEL Low level output voltage VGATECL High level GATE CLAMP voltage IGATE Dynamic peak current available during rise or fall of output voltage Time to assert ‘STALL’ flag and warning on STATUS output (Note 13) LED Thermal control circuit (TADJ) parameters VTADJH Upper threshold voltage tSTALL VTADJL Lower threshold voltage ITADJ TADJ pin Input current Notes: Conditions Min Typ Max Units V µA 4.2 4.5 0.5 1 4.8 3.3 3.6 3.9 3.3 3.3 1.5 3.6 3.6 1.8 3.9 3.9 2.1 0.6 0.9 1.2 Output sinking 1mA VFLAG=40V Normal operation Out of regulation (VSHP out of range) (Note 10) VIN under-voltage (VIN < 5.6V) Switch stalled (tON or tOFF> 100µs) Over-temperature (TJ > 125°C) Excess sense resistor current (VSENSE > 0.32V) Normal operation No load Sourcing 1mA (Note 11) 10 10 kΩ 11 V Sinking 1mA, (Note 12) VIN = VAU X= VISM = 18V IGATE = 1mA Charging or discharging gate of external switch with QG = 10nC and 400kHz 12.8 Onset of output current reduction (VTADJ falling) Output current reduced to <10% of set value (VTADJ falling) VTADJ = 1.25V 0.5 V 15 V ±300 GATE low or high V mA 100 170 µs 560 625 690 mV 380 440 500 mV 1 µA 9. In the event of more than one fault/warning condition occurring, the higher priority condition will take precedence. E.g. ‘Excessive coil current’ and ‘Out of regulation’ occurring together will produce an output of 0.9V on the STATUS pin. The voltage levels on the STATUS output assume the Internal regulator to be in regulation and VADJ<=VREF. A reduction of the voltage on the STATUS pin will occur when the voltage on VIN is near the minimum value of 6V. 10. Flag is asserted if VSHP<2.5V or VSHP>3.5V 11. GATE is switched to the supply voltage VAUX for low values of VAUX (i.e. between 6V and approximately 12V). For VAUX>12V, GATE is clamped internally to prevent it exceeding 15V. 12. GATE is switched to PGND by an NMOS transistor 13. If tON exceeds tSTALL, the device will force GATE low to turn off the external switch and then initiate a restart cycle. During this phase, ADJ is grounded internally and the SHP pin is switched to its nominal operating voltage, before operation is allowed to resume. Restart cycles will be repeated automatically until the operating conditions are such that normal operation can be sustained. If tOFF exceeds tSTALL, the switch will remain off until normal operation is possible. ZXLD1370 Document number: DS32165 Rev. 4 - 2 6 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Typical Characteristics – Buck Mode – RS = 150mΩ – L = 33µH - ILED = 1.5A 1.500 1 LED 3 LEDs 5 LEDs 7 LEDs 9 LEDs 11 LEDs 13 LEDs 15 LEDs LED Current (A) 1.490 1.480 1.470 1.460 1.450 1.440 1.430 6.5 11 15.5 20 24.5 29 33.5 38 42.5 47 51.5 Input Voltage (V) Figure 1: Load Current vs. Input Voltage & Number of LED 56 60.5 1000 1 LE D 3 LE Ds 5 LE Ds 7 LE Ds 9 LE Ds 11 LE Ds 13 LE Ds 15 LE Ds Switching Frequency (kHz) 900 800 TA = 25°C VAU X = VIN 700 600 500 400 300 200 100 0 6.5 11 15.5 11 15.5 20 24.5 29 33.5 38 42.5 47 51.5 Input Voltage (V) Figure 2: Frequency vs. Input Voltage & Number of LED 20 24.5 56 60.5 56 60.5 100% 95% Efficiency 90% 85% 80% 75% 70% 65% 60% 6.5 ZXLD1370 Document number: DS32165 Rev. 4 - 2 29 33.5 38 42.5 47 Input Voltage (V) Figure 3: Efficiency vs. Input & Number of LED 7 of 36 www.diodes.com 51.5 March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Typical Characteristics – Buck Mode – Rs = 300mΩ - L = 47µH - ILED = 750mA 0.740 0.735 LED Current (A) TA = 25°C V AUX = VIN 0.730 0.725 0.720 2 LEDs 0.715 6.5 11 3 LEDs 15.5 5 LEDs 20 7 LEDs 9 LEDs 11 LEDs 24.5 29 33.5 38 42.5 Input Voltage (V) Figure 4: I LED vs. Input & Number of LED 13 LEDs 47 51.5 15 LEDs 56 60.5 1000 2 LEDs 3 LEDs 5 LEDs 7 LEDs 9 LEDs 11 LEDs 13 LEDs 15 LEDs 900 Switching Frequency (kHz) 800 TA = 25°C VAU X = VIN 700 600 500 400 300 200 100 0 6.5 11 15.5 20 24.5 29 33.5 38 42.5 47 Input Voltage (V) Figure 5: Frequency ZXLD1370 - Buck Mode - L47 μH 51.5 56 60.5 100% 95% Efficiency 90% 85% 80% 75% TA = 25°C VAU X = VIN 70% 2 LEDs 3 LEDs 5 LEDs 7 LEDs 9 LEDs 11 LEDs 13 LEDs 15 LEDs 65% 60% 6.5 11 ZXLD1370 Document number: DS32165 Rev. 4 - 2 15.5 20 24.5 29 33.5 38 42.5 47 Input Voltage (V) Figure 6: Efficiency vs. Input Voltage & Number of LED 8 of 36 www.diodes.com 51.5 56 60.5 March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Typical Characteristics – Boost mode – ILED = 350mA – RS = 150mΩ – GIRATIO = 0.23 0.400 0.350 TA = 25°C VAU X = VIN LED Current (A) 0.300 0.250 0.200 0.150 0.100 0.050 3 LEDs 0.000 6.5 10 4 LEDs 13.5 17 6 LEDs 8 LEDs 10 LEDs 12 LEDs 20.5 14 LEDs 24 27.5 31 34.5 38 Input Voltage (V) Figure 7: ILED vs. Input Voltage & Number of LED 16 LEDs 41.5 45 48.5 500 3 LEDs 4 LEDs 6 LEDs 8 LEDs 10 LEDs 12 LEDs 14 LEDs 16 LEDs Switching Frequency (kHz) 450 TA = 25°C VAU X = VIN 400 350 300 250 200 150 100 50 Boosted voltage across LEDs approaching VIN 6.5 100% 10 3 LEDs 13.5 17 24 27.5 31 34.5 38 41.5 Input Voltage (V) Figure 8: Frequency vs. Input Voltage & Number of LED 4 LEDs 20.5 6 LEDs 8 LEDs 10 LEDs 12 LEDs 14 LEDs 45 48.5 16 LEDs 95% Efficiency 90% 85% 80% TA = 25°C VAU X = VIN 75% 70% 65% 60% 6.5 10 ZXLD1370 Document number: DS32165 Rev. 4 - 2 13.5 17 20.5 24 27.5 31 34.5 38 41.5 Input Voltage (V) Figure 9: Efficiency vs. Input Voltage & Number of LED 9 of 36 www.diodes.com 45 48.5 March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Typical Characteristics – Buck-Boost mode – RS=150mΩ - ILED = 350mA - GIRATIO = 0.23 0.370 3 LEDs 4 LEDs 5 LEDs 6 LEDs 7 LEDs 8 LEDs 0.365 LED Current (A) 0.360 0.355 0.350 0.345 0.340 0.335 0.330 6.5 8 9.5 11 12.5 14 Input Voltage (V) Figure 10: LED Current vs. Input Voltage & Number of LED 15.5 17 800 3 LEDs 4 LEDs 5 LEDs 6 LEDs 7 LEDs 8 LEDs Switching Frequency (kHz) 700 600 500 400 300 200 100 0 6.5 8 9.5 11 12.5 14 15.5 Input Voltage (V) Figure 11: Switching Frequency vs. Input Voltage & Number of LED 17 100% 3 L EDs 4 L EDs 5 L EDs 6 L EDs 7 L EDs 8 L EDs 95% Efficiency 90% 85% 80% 75% 70% 65% 60% 6.5 ZXLD1370 Document number: DS32165 Rev. 4 - 2 8 9.5 11 12.5 14 Input Voltage (V) Figure 12: Efficiency vs. Input Voltage & Number of LED 10 of 36 www.diodes.com 15.5 17 March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information The ZXLD1370 is a high accuracy hysteretic inductive buck/boost/buck-boost controller designed to be used with an external NMOS switch for current-driving single or multiple series-connected LEDs. The device can be configured to operate in buck, boost, or buck-boost modes by suitable configuration of the external components as shown in the schematics shown in the device operation description. DEVICE OPERATION a) Buck mode – the most simple buck circuit is shown in Figure 13 LED current control in buck mode is achieved by sensing the coil current in the sense resistor Rs, connected between the two inputs of a current monitor within the control loop block. An output from the control loop drives the input of a comparator which drives the gate of the external NMOS switch transistor M1 via the internal Gate Driver. When the switch is on, current flows from VIN, via Rs, LED, coil and switch to ground. This current ramps up until an upper threshold value is reached. At this point GATE goes low, the switch is turned off and the current flows via Rs, LED, coil and D1 back to VIN. When the coil current has ramped down to a lower threshold value, GATE goes high, the switch is turned on again and the cycle of events repeats, resulting in continuous oscillation. Figure 13. Buck configuration The average current in the LED and coil is equal to the average of the maximum and minimum threshold currents. The ripple current (hysteresis) is equal to the difference between the thresholds. The control loop maintains the average LED current at the set level by adjusting the thresholds continuously to force the average current in the coil to the value demanded by the voltage on the ADJ pin. This minimizes variation in output current with changes in operating conditions. The control loop also attempts to minimize changes in switching frequency by varying the level of hysteresis. The hysteresis has a defined minimum (typ 5%) and a maximum (typ 30%), the frequency may deviate from nominal in extreme conditions. Loop compensation is achieved by a single external capacitor C2, connected between SHP and SGND. Gate Voltage ~15 V 0V V VIN V -225mV VIN ISM Voltage Coil/LED current 225mV/R s 0A t OFF t ON Figure 14. Operating waveforms (Buck mode) ZXLD1370 Document number: DS32165 Rev. 4 - 2 11 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) b) Boost and Buck-Boost modes Control in Boost and Buck-boost mode is achieved by sensing the coil current in the series resistor Rs, connected between the two inputs of a current monitor within the control loop block. An output from the control loop drives the input of a comparator which drives the gate of the external NMOS switch transistor M1 via the internal Gate Driver. In boost and buck-boost modes, when the switch is on, current flows from VIN, via Rs, coil and switch to ground. This current ramps up until an upper threshold value is reached. At this point GATE goes low, the switch is turned off and the current flows via Rs, coil, D1 and LED back to VIN (Buck-boost mode), or GND (Boost mode). When the coil current has ramped down to a lower threshold value, GATE goes high, the switch is turned on again and the cycle of events repeats, resulting in continuous oscillation. The average current in the coil is equal to the average of the maximum and minimum threshold currents and the ripple current (hysteresis) is Figure 15. Boost and Buck-Boost configuration equal to the difference between the thresholds. The average current in the LED is always less than the average current in the coil and the ratio between these currents is set by the values of external resistors RGI1 and RGI2. The peak LED current is equal to the peak coil current. The control loop maintains the average LED current at the set level by adjusting the thresholds and the hysteresis continuously to force the average current in the coil to the value demanded by the voltage on the ADJ and GI pins. This minimises variation in output current with changes in operating conditions. Loop compensation is achieved by a single external capacitor C2, connected between SHP and SGND. Gate Voltage ~15V 0V VVIN VVIN -225mV ISM Voltage Coil current 225mV/Rs 0A LED current 225mV/Rs Average LED current 0A tOFF tON Figure 16. Operating waveforms (Boost and Buck-boost modes) Note: In Boost and Buck-boost modes, average ILED= average ICOIL x RGI1/(RGI1+RGI2) For more detailed descriptions of device operation and for choosing external components, please refer to the application circuits and descriptions in the later sections of this specification. ZXLD1370 Document number: DS32165 Rev. 4 - 2 12 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Application Information (Continued) A basic ZXLD1370 application circuit is shown in Figures 13 and 15. External component selection is driven by the characteristics of the load and the input supply, since this will determine the kind of topology being used for the system. Component selection starts with the current setting procedure, the inductor/frequency setting and the MOSFET selection. Finally after selecting the freewheeling diode and the output capacitor (if needed), the application section will cover the PWM dimming and thermal feedback. Setting the output current The first choice when defining the output current is whether the device is operating with the load in series with the sense resistor (buck mode) or whether the load is not in series with the sense resistor (boost and buck-boost modes). The output current setting depends on the choice of the sense resistor Rs, the voltage on the ADJ pin and the voltage on the GI pin, according to the device working mode. The sense resistor Rs sets the coil current IRS. The ADJ pin may be connected directly to the internal 1.25V reference (VREF) to define the nominal 100% LED current. The ADJ pin can also be overdriven with an external dc voltage between 125mV and 2.5V to adjust the LED current proportionally between 10% and 200% of the nominal value. ADJ and GI are high impedance inputs within their normal operating voltage ranges. An internal 2.6V clamp protects the device against excessive input voltage and limits the maximum output current to approximately 4% above the maximum current set by VADJ if the maximum input voltage is exceeded. Below are provided the details of the LED current calculation both when the load in series with the sense resistor (buck mode) and when the load is not in series with the sense resistor (boost and buck-boost modes). RS In Buck mode, GI is connected to ADJ which results in the average LED current (ILED) equal to the average sense resistor/coil current (IRS). A loop gain compensation factor, K, compensates for GI being connected to ADJ. This gives the following equation for ILED: ILED = IRs = K 225mV VADJ = R S VREF VIN REF where K= 0.97 218mV VADJ R S VREF If ADJ (and GI pin) is directly connected to VREF, this becomes: 218mV ILED = IRs = RS Therefore: 218mV Rs = ILED ADJ = GI SGND Figure 17. Buck configuration In Boost and Buck-boost mode GI is connected to ADJ through a voltage divider. The ratio of average LED current (ILED) to average sense resistor/coil current is determined by voltage divider ratio (defined by the resistor divider) at the GI pin. I Standard boost converter equation ICOIL = LED ⇒ 1− D I × RS Î Sense resistor voltage VRS = ICOIL × R S = LED 1− D Now V VADJ 225mV = GI = ILED VADJ VREF R S = ISM R GI1 VADJ 225mV (R GI1 + R GI2 ) VREF R S RS VIN ISM REF ADJ R GI2 GI R GI1 SGND Rearranging gives: Rs = R GI1 225mV VADJ (R GI1 + R GI2 ) ILED VREF ZXLD1370 Document number: DS32165 Rev. 4 - 2 Figure 18. Boost and Buck-boost connection 13 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) When the ADJ pin is directly connected to the REF pin, this becomes: R GI1 225mV Rs = (R GI1 + R GI2 ) ILED Note that the average LED current for a boost or buck-boost converter is always less than the average sense resistor current. For the ZXLD1370, the recommended potential divider ratio is given by: 0 .2 ≤ R GI1 ≤ 0.50 (R GI1 + R GI2 ) It is possible to use a different combination of GI pin voltages and sense resistor values to set the LED current. In general the design procedure to follow is: Define input conditions in terms of VIN and IIN Set output conditions in terms of LED current and the number of LEDs Define controller topology – Buck, Boost or Buck-boost Calculate the maximum duty-cycle as: Buck mode DMAX = VLEDs VINMIN Boost mode DMAX = VLEDS − VIN MIN VLEDS Buck-boost mode DMAX = VLEDS VLEDS + VIN MIN Set the appropriate GI ratio according to the circuit duty and the max switch current admissible cycle limitations R GI1 VGI = ≤ 1 − DMAX (R GI1 + R GI2 ) VADJ 10kΩ ≤ RGI1 ≤ 200kΩ - Set RGI1 as: - Calculate RGI2 as: R GI2 ≈ - DMAX x R GI1 1 − DMAX Calculate the sense resistor as: Rs = R GI1 225mV (R GI1 + R GI2 ) ILED If the potential divider ratio is greater than 0.64, the device detects that buck-mode operation is desired and the output current will deviate from the desired value. For example, as in the typical application circuit, in order to get ILED= 350mA with IRS=1.5A the ratio has to be set as: VGI RGI1 ILED = = ≈ 0.23 IRS VADJ (RGI1 + RGI2) ZXLD1370 Document number: DS32165 Rev. 4 - 2 14 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Setting RGI1= 33kΩ gives V R GI2 = R GI1( ADJ − 1) = 110kΩ VGI This will result in: Rs = R GI1 225mV = 150m Ω (R GI1 + R GI2 ) ILED Table 1 shows typical resistor values used to determine GIRATIO with E24 series resistors Table 1 GI ratio 0.2 0.25 0.3 0.35 0.4 0.45 0.5 RGI1 30kΩ 33kΩ 39kΩ 30kΩ 100kΩ 51kΩ 30kΩ RG2 120kΩ 100kΩ 91kΩ 56kΩ 150kΩ 62kΩ 30kΩ INDUCTOR/FREQUENCY SELECTION Recommended inductor values for the ZXLD1370 are in the range 22 μH to 100 μH. The chosen coil should have a saturation current higher than the peak sensed current and a continuous current rating above the required mean sensed current by at least 50%. The inductor value should be chosen to maintain operating duty cycle and switch 'on'/'off' times within the recommended limits over the supply voltage and load current range. The frequency compensation mechanism inside the chip tends to keep the frequency within the range 300kHz – 400kHz in most of the operating conditions. Nonetheless, the controller allows for higher frequencies when either the number of LEDs or the input voltage increases. The graphs below can be used to select a recommended inductor to maintain the ZXLD1370 switching frequency within a predetermined range when used in different topologies. Buck inductor selection: ZXLD1370 Buck Mode 1.5A Minimum Recommended Inductor Target Switching Frequency - 400kHz 15 Number of LEDs 13 11 9 L=47µH 7 5 L=33µH 3 L=10µH 1 0 10 L=22µH 20 30 40 50 60 Supply Voltage (V) Figure 19. 1.5A Buck mode inductor selection for target frequency of 400 kHz ZXLD1370 Document number: DS32165 Rev. 4 - 2 15 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) ZXLD1370 Buck Mode 1.5A Minimum Recommended Inductor Target Switching Frequency > 500kHz 15 Number of LEDs 13 11 9 L=47µH 7 5 L=33µH L=22µH 3 L=10µH 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 20. 1.5A Buck mode inductor selection for target frequency > 500kHz For example, in a buck configuration (VIN =24V and 6 LEDs), with a load current of 1.5A; if the target frequency is around 400 kHz, the Ideal inductor size is L= 33µH. The same kind of graphs can be used to select the right inductor for a buck configuration and a LED current of 750mA, as shown in figures 21 and 22. ZXLD1370 Buck Mode 750mA Minimum Recommended Inductor Target Switching Frequency 400kHz 15 Number of LEDs 13 11 9 7 L=100µH 5 L=68µH L=47µH 3 L=33µH 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 21. 750mA Buck mode inductor selection for target frequency 400kHz ZXLD1370 Document number: DS32165 Rev. 4 - 2 16 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) ZXLD1370 Buck Mode 750mA Minimum Recommended Inductor Target Switching Frequency > 500kHz 15 Number of LEDs 13 11 9 L=100µH 7 5 L=68µH L=47µH 3 L=33µH 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 22. 750mA Buck mode inductor selection for target frequency > 500kHz In the case of the Buck-boost topology, the following graphs guide the designer to select the inductor for a target frequency of 400kHz (figure 23) or higher than 500kHz (figure 24). ZXLD1370 Buck-Boost Mode 350mA Minimum Recommended Inductor Target Switching Frequency - 400kHz 15 Num ber of LEDs 13 11 9 L=47µH 7 5 L=33µH 3 L=22µH 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 23. 350mA Buck-Boost mode inductor selection for target frequency 400kHz ZXLD1370 Document number: DS32165 Rev. 4 - 2 17 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) ZXLD1370 Buck-Boost Mode 350mA Minimum Recommended Inductor Target Switching Frequency > 500kHz 15 13 Number of LEDs 11 L=47µH 9 7 5 L=33µH 3 L=22µH 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 24. 350mA Buck-Boost mode inductor selection for target frequency > 500kHz For example, in a Buck-bust configuration (VIN =10-18V and 4 LEDs), with a load current of 350mA; if the target frequency is around 400kHz, the Ideal inductor size is L= 33uH. The same size of inductor can be used if the target frequency is higher than 500kHz driving 6LEDs with a current of 350mA from a VIN =12-24V. In the case of the Boost topology, the following graphs guide the designer to select the inductor for a target frequency of 400kHz (figure 25) or higher than 500kHz (figure 26). ZXLD1370 Boost Mode 350mA Minimum Recommended Inductor Target Switching Frequency - 400kHz L=47µH 15 Number of LEDs 13 11 L=33µH 9 7 L=22µH 5 3 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 25. 350mA Boost mode inductor selection for target frequency 400kHz ZXLD1370 Document number: DS32165 Rev. 4 - 2 18 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) ZXLD1370 Boost Mode 350mA Minimum Recommended Inductor Target Switching frequency > 500kHz L=47µH 15 Number of LEDs 13 L=33µH 11 9 7 L=22µH 5 3 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 26. 350mA Buck-Boost mode inductor selection for target frequency > 500kHz Suitable coils for use with the ZXLD1370 may be selected from the MSS range manufactured by Coilcraft, or the NPIS range manufactured by NIC components. The following websites may be useful in finding suitable components www.coilcraft.com www.niccomp.com www.wuerth-elektronik.de MOSFET Selection The ZXLD130 requires an external NMOS FET as the main power switch with a voltage rating at least 15% higher than the maximum transistor voltage to ensure safe operation during the ringing of the switch node. The current rating is recommended to be at least 10% higher than the average transistor current. The power rating is then verified by calculating the resistive and switching power losses. P = Presistive + Pswitching Resistive power losses The resistive power losses are calculated using the RMS transistor current and the MOSFET on-resistance. Calculate the current for the different topologies as follows: Buck mode IMOSFET − MAX = D MAX x ILED Boost / Buck-boost mode IMOSFET − MAX = DMAX x ILED 1 − DMAX The approximate RMS current in the MOSFET will be: Buck mode IMOSFET − RMS =ILED D ZXLD1370 Document number: DS32165 Rev. 4 - 2 19 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Boost / Buck-boost mode IMOSFET − RMS = D x ILED 1− D The resistive power dissipation of the MOSFET is: Presistive = IMOSFET − RMS2 x RDS − ON Switching power losses Calculating the switching MOSFET's switching loss depends on many factors that influence both turn-on and turn-off. Using a first order rough approximation, the switching power dissipation of the MOSFET is: C x V 2IN x fsw x ILOAD Pswitching = RSS IGATE where CRSS is the MOSFET's reverse-transfer capacitance (a data sheet parameter), fSW is the switching frequency, IGATE is the MOSFET gate-driver's sink/source current at the MOSFET's turn-on threshold. Matching the MOSFET with the controller is primarily based on the rise and fall time of the gate voltage. The best rise/fall time in the application is based on many requirements, such as EMI (conducted and radiated), switching losses, lead/circuit inductance, switching frequency, etc. How fast a MOSFET can be turned on and off is related to how fast the gate capacitance of the MOSFET can be charged and discharged. The relationship between C (and the relative total gate charge Qg), turn-on/turn-off time and the MOSFET driver current rating can be written as: dV ⋅ C Qg dt = = I I where dt = turn-on/turn-off time dV = gate voltage C = gate capacitance = Qg/V I = drive current – constant current source (for the given voltage value) Here the constant current source” I ” usually is approximated with the peak drive current at a given driver input voltage. Example 1) Using the DMN6068 MOSFET (VDS(MAX) = 60V, ID(MAX) = 8.5A): Æ QG = 10.3nC at VGS = 10V ZXLD1370 IPEAK = I GATE = 300mA dt = Qg IPEAK = 10.3nC = 35ns 300mA Assuming that cumulatively the rise time and fall time can account for a maximum of 10% of the period, the maximum frequency allowed in this condition is: tPERIOD = 20*dt Æ f = 1/ tPERIOD = 1.43MHz This frequency is well above the max frequency the device can handle, therefore the DNM6068 can be used with the ZXLD1370 in the whole spectrum of frequencies recommended for the device (from 300kHz to 1MHz). Example 2) Using the ZXMN6A09K (VDS(MAX) = 60V, ID(MAX) = 12.2A): Æ QG = 29nC at VGS = 10V ZXLD1370 IPEAK = 300mA dt = Qg IPEAK = 29nC = 97ns 300mA ZXLD1370 Document number: DS32165 Rev. 4 - 2 20 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Assuming that cumulatively the rise time and fall time can account for a maximum of 10% of the period, the maximum frequency allowed in this condition is: Æ tPERIOD = 20*dt f = 1/ tPERIOD = 515kHz This frequency is within the recommended frequency range the device can handle, therefore the ZXMN6A09K is recommended to be used with the ZXLD1370 for frequencies from 300kHz to 500kHz). The recommended total gate charge for the MOSFET used in conjunction with the ZXLD1370 is less than 30nC. Junction temperature estimation Finally, the ZXLD1370 junction temperature can be estimated using the following equations: Total supply current of ZXLD1370: IQTOT ≈ IQ + f • QG Where IQ = total quiescent current IQ-IN + IQ-AUX Power consumed by ZXLD1370 PIC = VIN • (IQ + f • Qg) Or in case of separate voltage supply, with VAUX < 15V PIC = VIN • IQ-IN + Vaux • (IQ-AUX + f • Qg) TJ = TA + PIC • θJA = TA + PIC • (θJC + θCA) Where the total quiescent current IQTOT consists of the static supply current (IQ) and the current required to charge and discharge the gate of the power MOSFET. Moreover the part of thermal resistance between case and ambient depends on the PCB characteristics. 2.5 Power dissipation (mW) 2 1.5 1 0.5 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient temperature (°C) Figure 27. Power derating curve for ZXLD1370 mounted on test board according to JESD51 ZXLD1370 Document number: DS32165 Rev. 4 - 2 21 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) DIODE SELECTION For maximum efficiency and performance, the rectifier (D1) should be a fast low capacitance Schottky diode* with low reverse leakage at the maximum operating voltage and temperature. The Schottky diode also provides better efficiency than silicon PN diodes, due to a combination of lower forward voltage and reduced recovery time. It is important to select parts with a peak current rating above the peak coil current and a continuous current rating higher than the maximum output load current. In particular, it is recommended to have a voltage rating at least 15% higher than the maximum transistor voltage to ensure safe operation during the ringing of the switch node and a current rating at least 10% higher than the average diode current. The power rating is verified by calculating the power loss through the diode. The higher forward voltage and overshoot due to reverse recovery time in silicon diodes will increase the peak voltage on the Drain of the external MOSFET. If a silicon diode is used, care should be taken to ensure that the total voltage appearing on the Drain of the external MOSFET, including supply ripple, does not exceed the specified maximum value. *A suitable Schottky diode would be PDS3100 (Diodes Inc). OUTPUT CAPACITOR An output capacitor may be required to limit interference or for specific EMC purposes. For boost and buck-boost regulators, the output capacitor provides energy to the load when the freewheeling diode is reverse biased during the first switching subinterval. An output capacitor in a buck topology will simply reduce the LED current ripple below the inductor current ripple. In other words, this capacitor changes the current waveform through the LED(s) from a triangular ramp to a more sinusoidal version without altering the mean current value. In all cases, the output capacitor is chosen to provide a desired current ripple of the LED current (usually recommended to be less than 40% of the average LED current). Buck: COUTPUT = ΔIL −PP 8 x fSW x rLED x ΔILED −PP Boost and Buck-boost C OUTPUT = D x ILED − PP fSW x rLED x ΔILED − PP where: • ΔIL is the ripple of the inductor current, usually ± 20% of the average sensed current • ΔILED is the ripple of the LED current, it should be <40% of the LEDs average current • fsw is the switching frequency (From graphs and calculator) • rLED is the dynamic resistance of the LEDs string (n times the dynamic resistance of the single LED from the datasheet of the LED manufacturer). The output capacitor should be chosen to account for derating due to temperature and operating voltage. It must also have the necessary RMS current rating. The minimum RMS current for the output capacitor is calculated as follows: Buck I ICOUTPUT −RMS = LED − PP 12 Boost and Buck-boost ICOUTPUT − RMS = ILED DMAX 1 − DMAX Ceramic capacitors with X7R dielectric are the best choice due to their high ripple current rating, long lifetime, and performance over the voltage and temperature ranges. ZXLD1370 Document number: DS32165 Rev. 4 - 2 22 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) INPUT CAPACITOR The input capacitor can be calculated knowing the input voltage ripple ΔVIN-PP as follows: Buck CIN = D x(1 − D)x ILED fSW x ΔVIN −PP CIN = ΔIL −PP 8 x fSW x ΔVIN −PP Use D = 0.5 as worst case Boost Buck-boost CIN = D x ILED fSW x ΔVIN − PP Use D = DMAX as worst case The minimum RMS current for the output capacitor is calculated as follows: Buck ICIN − RMS = ILED x Dx(1 − D) use D=0.5 as worst case Boost I ICIN − RMS = L − PP 12 Buck-boost ICIN −RMS = ILED x D (1 − D) ZXLD1370 Document number: DS32165 Rev. 4 - 2 Use D=DMAX as worst case 23 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) PWM OUTPUT CURRENT CONTROL & DIMMING The ZXLD1370 has a dedicated PWM dimming input that allows a wide dimming frequency range from 100Hz to 1kHz with up to 1000:1 resolution; however higher dimming frequencies can be used – at the expense of dimming dynamic range and accuracy. Typically, for a PWM frequency of 1kHz, the error on the current linearity is lower than 5%; in particular the accuracy is better than 1% for PWM from 5% to 100%. This is shown in the graph below: Buck mode - L=33uH - Rs = 150mΩ - PWM @ 1kHz 1500.00 10% 9% 8% 7% 1000.00 6% 750.00 5% 4% 500.00 Error LED current [mA] 1250.00 3% 2% 250.00 1% 0.00 0 10 20 30 40 50 60 70 80 90 0% 100 PWM PWM @ 1kHz Error Figure 28: LED current linearity and accuracy with PWM dimming at 1kHz For a PWM frequency of 100Hz, the error on the current linearity is lower than 2.5%; it becomes negligible for PWM greater than 5%. This is shown in the graph below: Buck mode - L=33uH - Rs = 150mΩ - PWM @ 100Hz 10% 1500.00 9% 8% 7% 1000.00 6% 5% 750.00 4% 500.00 Error LED current [mA] 1250.00 3% 2% 250.00 1% 0.00 0 10 20 30 40 50 60 70 80 90 0% 100 PWM PWM @ 100Hz Error Figure 29: LED current linearity and accuracy with PWM dimming at 100Hz The PWM pin is designed to be driven by both 3.3V and 5V logic levels. It can be driven also by an open drain/collector transistor. In this case the designer can either use the internal pull-up network or an external pull-up network in order to speed-up PWM transitions, as shown in the Boost/ Buck-Boost section. ZXLD1370 Document number: DS32165 Rev. 4 - 2 24 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Figure 31. PWM dimming from MCU Figure 30. PWM dimming from open collector switch LED current can be adjusted digitally, by applying a low frequency PWM logic signal to the PWM pin to turn the controller on and off. This will produce an average output current proportional to the duty cycle of the control signal. During PWM operation, the device remains powered up and only the output switch is gated by the control signal. The PWM signal can achieve very high LED current resolution. In fact, dimming down from 100% to 0, a minimum pulse width of 2µs can be achieved resulting in very high accuracy. While the maximum recommended pulse is for the PWM signal is10ms. 2µs < 10 ms Gate 0V PWM < 10 ms 0V 2µs Figure 32. PWM dimming minimum and maximum pulse The device can be put in standby by taking the PWM pin to ground, or pulling it to a voltage below 0.4V with a suitable open collector NPN or open drain NMOS transistor, for a time exceeding 15ms (nominal). In the shutdown state, most of the circuitry inside the device is switched off and residual quiescent current will be typically 90µA. In particular, the Status pin will go down to GND while the FLAG and REF pins will stay at their nominal values. Fig 33. Stand-by state from PWM signal ZXLD1370 Document number: DS32165 Rev. 4 - 2 25 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) TADJ pin - Thermal control of LED current The ‘Thermal control’ circuit monitors the voltage on the TADJ pin and reduces output current if the voltage on this pin falls below 625mV. An external NTC thermistor and resistor can therefore be connected as shown below to set the voltage on the TADJ pin to 625mV at the required temperature threshold. This will give 100% LED current below the threshold temperature and a falling current above it as shown in the graph. The temperature threshold can be altered by adjusting the value of Rth and/or the thermistor to suit the requirements of the chosen LED. The Thermal Control feature can be disabled by connecting TADJ to REF. Here is a simple procedure to design the thermal feedback circuit: 1) Select the temperature threshold Tthreshold at which the current must start to decrease 2) Select the Thermistor TH1 (both resistive value at 25˚C and beta) 3) Select the value of the resistor Rth as Rth = TH at Tthreshold Figure 34. Thermal feedback network For example, 1) Temperature threshold Tthreshold = 70˚C 2) TH1 = 10kΩ at 25˚C and beta= 3500 3) Rth = TH at Tthreshold = 3.3kΩ Æ TH = 3.3kΩ @ 70˚C Over-Temperature Shutdown The ZXLD1370 incorporates an over-temperature shutdown circuit to protect against damage caused by excessive die temperature. A warning signal is generated on the STATUS output when die temperature exceeds 125°C nominal and the output is disabled when die temperature exceeds 150°C nominal. Normal operation resumes when the device cools back down to 125°C. ZXLD1370 Document number: DS32165 Rev. 4 - 2 26 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) FLAG/STATUS Outputs The FLAG/STATUS outputs provide a warning of extreme operating or fault conditions. FLAG is an open-drain logic output, which is normally off, but switches low to indicate that a warning, or fault condition exists. STATUS is a DAC output, which is normally high (4.5V), but switches to a lower voltage to indicate the nature of the warning/fault. Conditions monitored, the method of detection and the nominal STATUS output voltage are given in the following table: Table 2 Severity (Note 14) Monitored parameters 1 VAUX<5.6V 2 Output current out of regulation (Note 15) Warning/Fault condition FLAG Nominal STATUS voltage H 4.5 L 4.5 VIN<5.6V L 3.6 2 VSHP outside normal voltage range L 3.6 Driver stalled with switch ‘on’, or ‘off’ (Note 16) 2 tON, or tOFF>100µs L 3.6 Device temperature above maximum recommended operating value 3 TJ>125°C L 1.8 Sense resistor current IRS above specified maximum 4 VSENSE>0.32V L 0.9 Normal operation Supply under-voltage 14. Severity 1 denotes lowest severity. 15. This warning will be indicated if the output power demand is higher than the available input power; the loop may not be able to maintain regulation. 16. This warning will be indicated if the gate pin stays at the same level for greater than 100us (e.g. the output transistor cannot pass enough current to reach the upper switching threshold). FLAG VOLTAGE Notes: VREF 0V 4.5V Normal Operations VAUX UVLO STATUS VOLTAGE 3.6V - VIN UVLO - STALL - OUT of REG 2.7V 1.8V Over Temperature 0.9V Over Current 0A 0 1 2 3 4 SEVERITY Figure 35. Status levels In the event of more than one fault/warning condition occurring, the higher severity condition will take precedence. E.g. ‘Excessive coil current’ and ‘Out of regulation’ occurring together will produce an output of 0.9V on the STATUS pin. If VADJ>1.7V, VSENSE may be greater than the excess coil current threshold in normal operation and an error will be reported. Hence, STATUS and FLAG are only guaranteed for VADJ<=VREF. ZXLD1370 Document number: DS32165 Rev. 4 - 2 27 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) VR EF FLAG Diagnostic signals should be ignored during the device start – up for 100μs. The device start up sequence will be initiated both during the first power on of the device or after the PWM signal is kept low for more than 15ms, initiating the standby state of the device. 0V O ut of STATUS In particular, during the first 100μs the diagnostic is signaling an over-current then an out-of-regulation status. These two events are due to the charging of the inductor and are not true fault conditions. r e g u la t io n O ver C u rre n t Coil current 2 2 5 m V /R 1 0A 100us Fig 36. Diagnostic during Start-up Boosting VAUX supply voltage in Boost and Buck-Boost mode When the input voltage is lower than 8V, the gate voltage will also be lower 8V. This means that depending on the characteristics of the external MOSFET, the gate voltage may not be enough to fully enhance the power MOSFET. This boosting technique is particularly important when the output MOSFET is operating at full current, since the boost circuit allows the gate voltage to be higher than 12V. This guarantees that the MOSFET is fully enhanced reducing both the power dissipation and the risk of thermal runaway of the MOSFET itself. An extra diode D2 and decoupling capacitor C3 can be used, as shown below in figure 36, to generate a boosted voltage at VAUX when the input supply voltage at VIN is below 8V. This enables the device to operate with full output current when VIN is at the minimum value of 6V. In the case of a low voltage threshold MOSFET, the bootstrap circuit is generally not required. Fig 37. Bootstrap circuit for Boost and Buck-boost low voltage operations The resistor R2 can be used to limit the current in the bootstrap circuit in order to reduce the impact of the circuit itself on the LED accuracy. The impact on the LED current is usually a decrease of maximum 5% compared to the nominal current value set by the sense resistor. The Zener diode D3 is used to limit the voltage on the VAUX pin to less than 60V. Due to the increased number of components and the loss of current accuracy, the bootstrap circuit is recommended only when the system has to operate continuously in conditions of low input voltage (between 6 and 8V) and high load current. Other circumstances such as low input voltage at low load current, or transient low input voltage at high current should be evaluated keeping account of the external MOSFET power dissipation. ZXLD1370 Document number: DS32165 Rev. 4 - 2 28 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Over-voltage Protection The ZXLD1370 is inherently protected against open-circuit load when used in Buck configuration. However care has to be taken with open-circuit load conditions in Buck-Boost or Boost configurations. This is because in these configurations there is no internal open-circuit protection mechanism for the external MOSFET. In this case an Over-Voltage-Protection (OVP) network should be provided externally to the MOSFET to avoid damage due to open circuit conditions. This is shown in figure 38 below, highlighted in the dotted blue box. Figure 38. OVP circuit The zener voltage is determined according to: Vz = VLEDMAX +10% where VLEDMAX is maximum LED chain voltage. If the LEDA voltage exceeds VZ the gate of MOSFET Q2 will rise turning Q2 on. This will pull the PWM pin low and switch off Q1 until the voltage on the drain of Q1 falls below Vz. If the voltage at LEDA remains above VZ for longer than 20ms then the ZXLD1370 will enter into a shutdown state. Care should be taken such that the maximum gate voltage of the Q2 MOSFET is not exceeded. Take care of the max voltage drop on the Q2 MOSFET gate. ZXLD1370 Document number: DS32165 Rev. 4 - 2 29 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) PCB Layout considerations PCB layout is a fundamental activity to get the most of the device in all configurations. In the following section it is possible to find some important insight to design with the ZXLD1370 both in Buck and Buck-Boost/Boost configurations. SHP pin Inductor, Switch and Freewheeling diode VIN / VAUX decoupling Figure 39: Circuit Layout Here are some considerations useful for the PCB layout: In order to avoid ringing due to stray inductances, the inductor L1, the anode of D1 and the drain of Q1 should be placed as close together as possible. The shaping capacitor C1 is fundamental for the stability of the control loop. To this end it should be placed no more than 5mm from the SHP pin. Input voltage pins, VIN and VAUX, need to be decoupled. It is recommended to use two ceramic capacitors of 2.2uF, X7R, 100V (C3 and C4). In addition to these capacitors, it is suggested to add two ceramic capacitors of 1uF, X7R, 100V each (C2, C8), as well as a further decoupling capacitor of 100nF close to the VIN/VAUX pins (C9). VIN and VAUX pins can be short-circuited when the device is used in buck mode, or can be driven from a separate supply. APPLICATION EXAMPLES Example 1: 2.8A Buck LED driver In this application example, the ZXLD1370 is connected as a buck LED driver. The schematic and parts list are shown below. The LED driver is able to deliver 2.8A of LED current with an input voltage range of 8V to 24V. In order to achieve high efficiency at high LED current, a Super Barrier Rectifier (SBR) with a low forward voltage is used as the free wheeling rectifier. This LED driver is suitable for applications which require high LED current such as LED projector, automatic LED lighting etc. ZXLD1370 Document number: DS32165 Rev. 4 - 2 30 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Figure 40. Application circuit: 2.8A Buck LED driver Table 3: Bill of Material Ref No. Value U1 60V LED driver Q1 60V MOSFET D1 45V 10A SBR L1 33µH 4.2A C1 100pF 50V C2 1uF 50V X7R C3 C4 C5 4.7µF 50V X7R R1 R2 R3 300mΩ 1% R4 400mΩ 1% R5 0Ω Part No. ZXLD1370 ZXMN6A09K SBR10U45SP5 744770933 SMD 0805/0603 SMD1206 SMD1210 SMD1206 SMD1206 SMD 0805/0603 Manufacturer Diodes Inc Diodes Inc Diodes Inc Wurth Electronik Generic Generic Generic Generic Generic Generic Typical Performance LED Current vs Input Voltage Efficiency vs Input Voltage 3000 100% 90% 2500 80% LED Current (mA) Efficiency (%) 70% 60% 50% 40% 30% 1 LED 2 LED 20% 2000 1500 1000 500 10% 0% 10 12 14 16 18 20 22 24 Input Voltage (V) Document number: DS32165 Rev. 4 - 2 10 12 14 16 18 20 22 24 Input Voltage (V) Figure 42. Line regulation Figure 41. Efficiency ZXLD1370 0 31 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Example 2: 400mA Boost LED driver In this application example, the ZXLD1370 is connected as a boost LED driver. The schematic and parts list are shown below. The LED driver is able to deliver 400mA of LED current into 12 high-brightness LEDs with an input voltage range of 16V to 32V. The overall high efficiency of 92%+ makes it ideal for applications such as solar LED street lighting and general LED illuminations. Figure 43. Application circuit - 400mA Boost LED driver Table4. Bill of Material Ref No. Value U1 60V LED driver Q1 60V MOSFET Q2 60V MOSFET D1 100V 3A Schottky Z1 47V 410mW Zener L1 68µH 2.1A C1 100pF 50V C3 C9 4.7µF 50V X7R C2 1µF 50V X7R R1 R2 560mΩ 1% R9 R10 33kΩ 1% R12 0Ω R15 2.7KΩ ZXLD1370 Document number: DS32165 Rev. 4 - 2 Part No. ZXLD1370 ZXMN6A25G 2N7002A PDS3100-13 BZT52C47 744771168 SMD 0805/0603 SMD1210 SMD1206 SMD1206 SMD 0805/0603 SMD 0805/0603 SMD 0805/0603 32 of 36 www.diodes.com Manufacturer Diodes Inc Diodes Inc Diodes Inc Diodes Inc Diodes Inc Wurth Electronik Generic Generic Generic Generic Generic Generic Generic March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Typical Performance Efficiency vs Input Voltage LED Current vs Input Voltage 100% 450 90% 400 80% 350 300 60% LED Current Efficiency 70% 50% 40% 30% 250 200 150 20% 100 10% 50 0% 0 16 18 20 22 24 26 28 30 32 Input Voltage 16 18 20 22 24 26 28 30 32 Input Voltage Figure 44. Efficiency Figure 45. Line regulation Example 3: 700mA Buck-Boost LED driver In this application example, the ZXLD1370 is connected as a buck-boost LED driver. The schematic and parts list are shown below. The LED driver is able to deliver 700mA of LED current into 4 high-brightness LEDs with an input voltage range of 7V to 20V. Since the Buck-boost LED driver handles an input voltage range from below and above the total LED voltage, the versatile input voltage range make it ideal for automotive lighting applications. Figure 46. Application circuit - 700mA Buck-Boost LED driver ZXLD1370 Document number: DS32165 Rev. 4 - 2 33 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Applications Information (Continued) Table 5: Bill of Material Ref No. Value U1 60V LED driver Q1 60V MOSFET Q2 60V MOSFET D1 100V 5A Schottky Z1 47V 410mW Zener L1 22µH 2.1A C1 100pF 50V C3 C9 4.7µF 50V X7R C2 1µF 50V X7R R1 R2 R3 300mΩ 1% R9 33kΩ 1% R10 15kΩ 1% R12 0Ω R15 2.7kΩ Part No. ZXLD1370 ZXMN6A25G 2N7002A PDS5100-13 BZT52C47 744771122 SMD 0805/0603 SMD1210 SMD1206 SMD1206 SMD 0805/0603 SMD 0805/0603 SMD 0805/0603 SMD 0805/0603 Manufacturer Diodes Inc Diodes Inc Diodes Inc Diodes Inc Diodes Inc Wurth Electronik Generic Generic Generic Generic Generic Generic Generic Generic Typical Performance Efficiency vs Input Voltage LED Current vs Input Voltage 100% 800 90% 80% 700 70% 600 LED Current Efficiency 60% 50% 40% 30% 500 400 300 200 20% 100 10% 0% 0 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Input Voltage Document number: DS32165 Rev. 4 - 2 8 9 10 11 12 13 14 15 16 17 18 19 20 Input Voltage Figure 47. Efficiency ZXLD1370 7 Figure 48. Line regulation 34 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 Ordering Information Device Packaging Status ZXLD1370EST16TC TSSOP-16EP Active Part Marking ZXLD 1370 YYWW Reel Quantity Tape Width Reel Size 2500 16mm 13” Where YY is last two digits of year and WW is two digit week number Package Data TSSOP-16EP ZXLD1370 Document number: DS32165 Rev. 4 - 2 35 of 36 www.diodes.com March 2011 © Diodes Incorporated A Product Line of Diodes Incorporated ZXLD1370 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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