ONSEMI MC100H602FN

MC10H602, MC100H602
9−Bit Latch TTL to ECL
Translator
Description
The MC10H/100H602 is a 9−bit, dual supply TTL to ECL translator
with latch. Devices in the ON Semiconductor 9−bit translator series
utilize the PLCC−28 for optimal power pinning, signal flow−through
and electrical performance.
The H602 features D−type latches. Latching is controlled by Latch
Enable (LEN), while the Master Reset input resets the latches. A
post−latch logic enable is also provided (ENECL), allowing control of
the output state without destroying latch data. All control inputs are
ECL level.
The 10H version is compatible with MECL 10Ht ECL logic levels.
The 100H version is compatible with 100K levels.
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PLCC−28
FN SUFFIX
CASE 776
Features
• 9−Bit Ideal for Byte−Parity Applications
• Flow−Through Configuration
• Extra TTL and ECL Power/Ground Pins to Minimize
•
•
•
•
MARKING DIAGRAM*
Switching Noise
Dual Supply
3.5 ns Max D to Q
PNP TTL Inputs for Low Loading
Pb−Free Packages are Available*
1
MCxxxH602G
AWLYYWW
xxx
A
WL
YY
WW
G
= 10 or 100
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 10
1
Publication Order Number:
MC10H602/D
MC10H602, MC100H602
D5 D4 VCCT D3
25
24
23
22
D2 D1 D0
21
20
Table 1. PIN NAMES
19
D6
26
18
Q0
PIN
D7
27
17
Q1
D8
28
16
VCCE
15
VCCO
GND
VCCE
VCCO
VCCT
VEE
D0 −D8
Q0 −Q8
ENECL
LEN
MR
GND
MR
2
14
Q2
LEN
3
13
VCCO
ENECL
4
12
Q3
5
6
7
8
9
Q8 Q7 VCCO Q6 VEE
10
11
Q5
Q4
FUNCTION
TTL Ground (0 V)
ECL VCC (0 V)
ECL VCC (0 V) — Outputs
TTL Supply (+ 5.0 V)
ECL Supply (− 5.2 / −4.5 V)
Data Inputs (TTL)
Data Outputs (ECL)
Enable Control (ECL)
Latch Enable (ECL)
Master Reset (ECL)
Figure 1. PLCC−28 Pinout (Top View)
ENECL
DQ
EN
Q0
D1
DQ
EN
Q1
D2
DQ
EN
Q2
D3
DQ
EN
Q3
D4
DQ
EN
Q4
D5
DQ
EN
Q5
D6
DQ
EN
Q6
D7
DQ
EN
Q7
D8
DQ
EN
Q8
D0
TTL
Table 2. TRUTH TABLE
D
LEN
MR
ENECL
Q
L
H
X
X
X
L
L
H
X
X
L
L
L
H
X
H
H
H
H
L
L
H
Q0
L
L
ECL
LEN
MR
Figure 2. LOGIC SYMBOL
Table 3. DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = − 5.2 V ± 5% (10H version); VEE = − 4.2 V to − 5.5 V (100H version)
0°C
Symbol
Min
Parameter
25°C
Max
Min
75°C
Max
Min
Max
Unit
Power Supply Current
IEE
ECL
ICCH
ICCL
TTL
10H
100H
−125
−122
−125
−123
−125
−132
mA
48
50
48
50
48
50
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H602, MC100H602
Table 4. 10H ECL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = − 5.2 V ± 5%
0°C
Symbol
Parameter
Min
Condition
25°C
Max
75°C
Max
175
Min
Max
Unit
175
mA
mA
IINH
IINL
Input HIGH Current
Input LOW Current
0.5
VIH
VIL
Input HIGH Voltage
Input LOW Voltage
−1170
−1950
−840
−1480
−1130
−1950
−810
−1480
−1070
−1950
−735
−1450
mV
VOH
VOL
Output HIGH Voltage
Output LOW Voltage
−1020
−1950
−840
−1630
−980
−1950
−810
−1630
−920
−1950
−735
−1600
mV
50 W to − 2.0 V
255
Min
0.5
0.5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 5. 100H ECL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = − 4.2 V to − 5.5 V
0°C
Symbol
Parameter
Min
Condition
25°C
Max
Min
Max
IINH
IINL
Input HIGH Current
Input LOW Current
0.5
VIH
VIL
Input HIGH Voltage
Input LOW Voltage
−1165
−1810
−880
−1475
−1165
−1810
−880
−1475
VOH
VOL
Output HIGH Voltage
Output LOW Voltage
−1025
−1810
−880
−1620
−1025
−1810
−880
−1620
50 W to − 2.0 V
255
75°C
175
0.5
Min
Max
Unit
175
mA
mA
−1165
−1810
−880
−1475
mV
−1025
−1810
−880
−1620
mV
0.5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. TTL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = − 5.2 V ± 5% (10H version); VEE = − 4.2 V to − 5.5 V (100H
version)
0°C
Symbol
Parameter
Min
Condition
2.0
25°C
Max
Min
Max
Min
Unit
0.8
V
V
Input HIGH Voltage
Input LOW Voltage
IIH
Input HIGH Current
VIN = 2.7 V
VIN = 7.0 V
20
100
20
100
20
100
mA
IIL
Input LOW Current
VIN = 0.5 V
−0.6
−0.6
−0.6
mA
VIK
Input Clamp Voltage
IIN = −18 mA
−1.2
−1.2
−1.2
V
0.8
2.0
Max
VIH
VIL
0.8
2.0
75°C
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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3
MC10H602, MC100H602
Table 7. AC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = − 5.2 V ± 5% (10H version); VEE = − 4.2 V to − 5.5 V (100H version)
0°C
Symbol
Parameter
D
LEN
MR
ENECL
25°C
75°C
Min
Max
Min
Max
Min
Max
Unit
1.4
2.0
2.0
1.6
3.0
3.4
3.4
3.2
1.5
2.1
2.1
1.7
3.2
3.5
3.5
3.3
1.7
2.4
2.5
1.8
3.5
3.7
3.9
3.7
ns
tPLH
tPHL
Propagation Delay
to Output
ts
Set−Up Time, D to LEN
2.0
2.0
2.0
ns
th
Hold Time, D to LEN
1.0
1.0
1.0
ns
tw(L)
LEN Pulse Width, LOW
2.0
2.0
2.0
ns
tR
tF
Output Rise/Fall Time
20% −80%
0.5
1.5
0.5
1.5
0.5
1.5
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Package
Shipping †
MC10H602FN
PLCC−28
37 Units / Rail
MC10H602FNG
PLCC−28
(Pb−Free)
37 Units / Rail
MC10H602FNR2
PLCC−28
500 / Tape & Reel
MC10H602FNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
MC100H602FN
PLCC−28
37 Units / Rail
MC100H602FNG
PLCC−28
(Pb−Free)
37 Units / Rail
MC100H602FNR2
PLCC−28
500 / Tape & Reel
MC100H602FNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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4
MC10H602, MC100H602
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
−N−
0.007 (0.180)
B
Y BRK
T L−M
M
0.007 (0.180)
U
M
N
S
T L−M
S
S
N
S
D
Z
−M−
−L−
W
28
D
X
V
1
A
0.007 (0.180)
R
0.007 (0.180)
C
M
M
T L−M
T L−M
S
S
N
S
N
S
0.007 (0.180)
H
N
S
S
G
J
0.004 (0.100)
−T− SEATING
T L−M
S
N
T L−M
S
N
S
K
PLANE
F
VIEW S
G1
M
K1
E
S
T L−M
S
VIEW D−D
Z
0.010 (0.250)
0.010 (0.250)
G1
VIEW S
S
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10_
0.410
0.430
0.040
−−−
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5
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10_
10.42
10.92
1.02
−−−
0.007 (0.180)
M
T L−M
S
N
S
MC10H602, MC100H602
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
MECL 10H is a trademark of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC10H602/D