MC10ELT24, MC100ELT24 5VTTL to Differential ECL Translator The MC10ELT/100ELT24 is a TTL to differential ECL translator. Because ECL levels are used a +5 V, −5.2 V (or −4.5 V) and ground are required. The small outline 8−lead package and the single gate of the ELT24 makes it ideal for those applications where space, performance and low power are at a premium. The 100 Series contains temperature compensation. • • • • • 0.8 ns tPHL, 0.95 ns tPLH Typical Propagation Delay PNP TTL Inputs for Minimal Loading Flow Through Pinouts Operating Range: VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V with GND = 0 V Pb−Free Packages are Available http://onsemi.com MARKING DIAGRAMS* 8 8 SO−8 D SUFFIX CASE 751 8 HLT24 ALYW 1 1 1 8 8 1 TSSOP−8 DT SUFFIX CASE 948R KLT24 ALYW 8 HT24 ALYW 1 KT24 ALYW 1 H = MC10 K = MC100 A = Assembly Location L = Wafer Lot Y = Year W = Work Week *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2004 October, 2004 − Rev. 7 1 Publication Order Number: MC10ELT24/D MC10ELT24, MC100ELT24 Table 1. PIN DESCRIPTION VEE 1 8 VCC Pin TTL D 2 7 Q ECL NC 3 6 Q Function Q, Q ECL Differential Outputs* D TTL Input VCC Positive Supply VEE Negative Supply GND Ground NC No Connect *Output state undetermined when inputs are open. NC 4 5 GND Figure 1. Logic Diagram and Pinout Assignment Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model > 4 kV > 200 V Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 51 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Power Supply GND = 0 V VEE = −5.0 V 7 V VEE Negative Power Supply GND = 0 V VCC = +5.0 V −8 V VIN Input Voltage GND = 0 V VI VCC Iout Output Current Continuous Surge TA Tstg JA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm JC Thermal Resistance (Junction−to−Case) JA Thermal Resistance (Junction−to−Ambient) JC Tsol 0 to VCC V 50 100 mA mA Operating Temperature Range −40 to +85 °C Storage Temperature Range −65 to +150 °C SO−8 SO−8 190 130 °C/W °C/W Standard Board SO−8 41 to 44 °C/W 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 5% °C/W Wave Solder < 2 to 3 sec @ 248°C 265 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC10ELT24, MC100ELT24 Table 4. 10ELT SERIES NECL OUTPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 2) −40°C Symbol Characteristic Min Typ 25°C Max Min 85°C Typ Max Min Typ Max Unit ICC VCC Power Supply Current 7.0 4.5 7.0 7.0 mA IEE Power Supply Current 18 12.5 18 18 mA VOH Output HIGH Voltage (Note 3) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 3) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Output parameters vary 1:1 with GND. VCC can vary 4.5 V / 5.5 V. VEE can vary −4.2 V / −5.5 V. 3. Outputs are terminated through a 50 resistor to GND − 2 V. Table 5. 100ELT SERIES NECL OUTPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 4) −40°C Symbol Characteristic Min Typ 25°C Max Min 85°C Typ Max Min Typ Max Unit ICC VCC Power Supply Current 7.0 4.5 7.0 7.0 mA IEE Power Supply Current 18 12.5 18 18 mA VOH Output HIGH Voltage (Note 5) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 5) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Output parameters vary 1:1 with GND. VCC can vary 4.5 V / 5.5 V. VEE can vary −4.2 V / −5.5 V. 5. Outputs are terminated through a 50 resistor to GND − 2 V. http://onsemi.com 3 MC10ELT24, MC100ELT24 Table 6. TTL INPUT DC CHARACTERISTICS VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V; GND = 0.0 V; TA = −40°C to +85°C Symbol Characteristic Condition Min Typ Max Unit IIH Input HIGH Current VIN = 2.7 V 20 A IIHH Input HIGH Current VIN = 7.0 V 100 A IIL Input LOW Current VIN = 0.5 V −0.6 mA VIK Input Clamp Diode Voltage IIN = −18 mA −1.2 V VIH Input HIGH Voltage VIL Input LOW Voltage 2.0 V 0.8 V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 7. AC CHARACTERISTICS VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V; GND = 0.0 V −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max 400 Unit fmax Maximum Toggle Frequency MHz tPLH Propagation Delay (Note 6) 1.5 V to 50% 0.5 2.0 0.5 0.95 2.0 0.5 2.0 ns tPHL Propagation Delay (Note 6) 1.5 V to 50% 0.5 2.0 0.5 0.8 2.0 0.5 2.0 ns tJITTER Random Clock Jitter (RMS) tr/tf Output Rise/Fall Time (20−80%) 2.5 0.25 1.25 0.25 ps 1.25 0.25 1.25 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Specifications for standard TTL input signal. 7. Devices are designed to meet the AC specifications shown in the above table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. http://onsemi.com 4 MC10ELT24, MC100ELT24 Zo = 50 Q D Receiver Device Driver Device Zo = 50 Q D 50 50 VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC10ELT24D Package Shipping† SOIC−8 98 Units / Rail MC10ELT24DG SOIC−8 (Pb−Free) 98 Units / Rail MC10ELT24DR2 SOIC−8 2500 / Tape & Reel MC10ELT24DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10ELT24DT TSSOP−2 100 Units / Rail MC10ELT24DTR2 TSSOP−2 2500 / Tape & Reel MC10ELT24DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel SOIC−8 98 Units / Rail MC100ELT24D MC100ELT24DR2 SOIC−8 2500 / Tape & Reel MC100ELT24DT TSSOP−8 100 Units / Rail MC100ELT24DTR2 TSSOP−8 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPS I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1642/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 5 MC10ELT24, MC100ELT24 PACKAGE DIMENSIONS SOIC−8 NB D SUFFIX CASE 751−07 ISSUE AC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 0.25 (0.010) S B 1 M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 MC10ELT24, MC100ELT24 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U K REF 0.10 (0.004) S 2X L/2 8 1 PIN 1 IDENT S T U S V NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S 5 0.25 (0.010) B −U− L 0.15 (0.006) T U M M 4 A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 7 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0 6 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0 6 MC10ELT24, MC100ELT24 ECLinPS are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 For additional information, please contact your local Sales Representative. MC10ELT24/D