INTERSIL CD40194BMS

CD40104BMS,
CD40194BMS
CMOS 4-Bit Bidirectional
Universal Shift Register
December 1992
Features
Pinouts
CD40104BMS
TOP VIEW
• High Voltage Type (20V Rating)
• Medium Speed fCL = 12MHz (typ.) at VDD = 10V
16 VDD
OUTPUT ENABLE 1
• Fully Static Operation
SHIFT RIGHT IN 2
15 Q0
• Synchronous Parallel or Serial Operation
D0 3
14 Q1
• Three State Outputs (CD40104BMS)
D1 4
13 Q2
D2 5
12 Q3
D3 6
11 CLOCK
• Asynchronous Master Reset (CD40194BMS)
• 5V, 10V and 15V Parametric Ratings
• Standardized Symmetrical Output Characteristics
SHIFT LEVEL IN 7
10 SELECT 1
VSS 8
9 SELECT 0
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of
‘B’ Series CMOS Devices”
CD40194BMS
TOP VIEW
Applications
• Serial/Parallel Conversions
SHIFT RIGHT IN 2
15 Q0
D0 3
14 Q1
D1 4
13 Q2
D2 5
12 Q3
D3 6
11 CLOCK
• General Purpose Register for Bus Organized Systems
• General Purpose Registers
Description
SHIFT LEVEL IN 7
10 SELECT 1
VSS 8
9 SELECT 0
The CD40104BMS is a universal shift register featuring parallel
inputs, parallel outputs, SHIFT RIGHT and SHIFT LEFT serial
inputs, and a high impedance third output state allowing the device
to be used in bus organized systems.
In the parallel load mode (S0 and S1 are high), data is loaded into
the associated flip-flop and appears at the output after the positive
transition of the CLOCK input. During loading, serial data flow is
inhibited. Shift right and shift left are accomplished synchronously
on the positive clock edge with serial data entered at the SHIFT
RIGHT and SHIFT LEFT serial inputs, respectively. Clearing the
register is accomplished by setting both mode controls low and
clocking the register. When the output enable input is low, all outputs
assume the high impedance state.
Functional Diagrams
The CD40194BMS is a universal shift register featuring parallel inputs,
parallel outputs SHIFT RIGHT and SHIFT LEFT serial inputs, and a
direct overriding clear input. In the parallel load mode (S0 and S1 are
high), data is loaded into the associated flip-flop and appears at the output after the positive transition of the CLOCK input. During loading,
serial data flow is inhibited. Shift right and shift left are accomplished
synchronously on the positive clock edge with data entered at the
SHIFT RIGHT and SHIFT LEFT serial inputs, respectively. Clocking of
the register is inhibited when both mode control inputs are low. When
low, the RESET input resets all stages and forces all outputs low. The
CD40194BMS is similar to industry types 340194 and MC40194.
The CD40104BMS and CD40194BMS series types are supplied in
these 16 lead outline packages
Braze Seal DIP
*HNX,
†H4W
Frit Seal DIP
*H1L,
†HIF
Ceramic Flatpack
H6W
* CD40104B Only
†CD40194B Only
16 VDD
RESET 1
• Arithmetic Unit Bus Registers
CD40104BMS
OUTPUT ENABLE
D0
D1
D2
D3
SHIFT LEFT IN
SHIFT RIGHT IN
S0
MODE SELECT
S1
15
Q0
14
Q1
13
Q2
12
Q3
11
CLOCK
VDD = 16
VSS = 8
CD40194BMS
RESET
D0
D1
D2
D3
SHIFT LEFT IN
SHIFT RIGHT IN
S0
MODE SELECT
S1
CLOCK
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
7-1307
1
3
4
5
6
7
2
9
10
1
3
4
5
6
7
2
9
10
15
Q0
14
Q1
13
Q2
12
Q3
11
VDD = 16
VSS = 8
File Number
3352
Specifications CD40104BMS, CD40194BMS
Absolute Maximum Ratings
Reliability Information
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC
Package Types D, F, K, H
Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC
At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for
10s Maximum
Thermal Resistance . . . . . . . . . . . . . . . .
θja
θjc
Ceramic DIP and FRIT Package . . . . . 80oC/W
20oC/W
Flatpack Package . . . . . . . . . . . . . . . . 70oC/W
20oC/W
Maximum Package Power Dissipation (PD) at +125oC
For TA = -55oC to +100oC (Package Type D, F, K) . . . . . . 500mW
For TA = +100oC to +125oC (Package Type D, F, K). . . . . . Derate
Linearity at 12mW/oC to 200mW
Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Supply Current
Input Leakage Current
SYMBOL
IDD
IIL
TEMPERATURE
MIN
MAX
1
+25oC
-
10
µA
2
+125oC
-
1000
µA
VDD = 18V, VIN = VDD or GND
3
-55oC
-
10
µA
VIN = VDD or GND
1
+25oC
-100
-
nA
2
+125oC
-1000
-
nA
3
-55oC
-100
-
nA
1
+25oC
-
100
nA
2
+125oC
-
1000
nA
3
-55oC
-
100
nA
-
50
mV
VDD = 20V, VIN = VDD or GND
VDD = 20V
VDD = 18V
Input Leakage Current
IIH
LIMITS
GROUP A
SUBGROUPS
CONDITIONS (NOTE 1)
VIN = VDD or GND
VDD = 20V
VDD = 18V
Output Voltage
VOL15
VDD = 15V, No Load
1, 2, 3
+25oC, +125oC, -55oC
Output Voltage
VOH15
VDD = 15V, No Load (Note 3)
1, 2, 3
+25oC, +125oC, -55oC 14.95
UNITS
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1
+25oC
0.53
-
mA
Output Current (Sink)
IOL10
VDD = 10V, VOUT = 0.5V
1
+25oC
1.4
-
mA
Output Current (Sink)
IOL15
VDD = 15V, VOUT = 1.5V
1
+25oC
3.5
-
mA
Output Current (Source)
IOH5A
VDD = 5V, VOUT = 4.6V
1
+25oC
-
-0.53
mA
Output Current (Source)
IOH5B
VDD = 5V, VOUT = 2.5V
1
+25oC
-
-1.8
mA
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1
+25oC
-
-1.4
mA
Output Current (Source)
IOH15
VDD = 15V, VOUT = 13.5V
1
+25oC
-
-3.5
mA
-2.8
-0.7
V
0.7
2.8
V
N Threshold Voltage
VNTH
VDD = 10V, ISS = -10µA
1
+25oC
P Threshold Voltage
VPTH
VSS = 0V, IDD = 10µA
1
+25oC
VDD = 2.8V, VIN = VDD or GND
7
+25oC
VDD = 20V, VIN = VDD or GND
7
+25oC
VDD = 18V, VIN = VDD or GND
8A
+125oC
VDD = 3V, VIN = VDD or GND
8B
Functional
F
Input Voltage Low
(Note 2)
VIL
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
Input Voltage High
(Note 2)
VIH
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
Input Voltage Low
(Note 2)
VIL
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
Input Voltage High
(Note 2)
VIH
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
Tri-State Output
Leakage
IOZL
VIN = VDD or GND
VOUT = 0V
IOZH
VIN = VDD or GND
VOUT = VDD
V
-55oC
+25oC,
Tri-State Output
Leakage
VOH > VOL <
VDD/2 VDD/2
+125oC, -55oC
-
1.5
V
+25oC, +125oC, -55oC
3.5
-
V
1, 2, 3
+25oC, +125oC, -55oC
-
4
V
1, 2, 3
+25oC, +125oC, -55oC
11
-
V
1
+25oC
-0.4
-
µA
2
+125oC
-12
-
µA
VDD = 18V
3
-55oC
-0.4
-
µA
VDD = 20V
1
+25oC
-
0.4
µA
2
+125oC
-
12
µA
3
-55oC
-
0.4
µA
VDD = 20V
VDD = 18V
NOTES: 1. All voltages referenced to device GND, 100% testing being
implemented.
2. Go/No Go test with limits applied to inputs.
7-1308
3. For accuracy, voltage is measured differentially to VDD. Limit
is 0.050V max.
Specifications CD40104BMS, CD40194BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Propagation Delay
Clock to Q
SYMBOL
TPHL
TPLH
GROUP A
SUBGROUPS TEMPERATURE
CONDITIONS
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
Propagation Delay
CD40194BMS Reset to Q
TPHL
Propagation Delay
CD40104BMS 3-State
TPZH
TPZL
TPLZ
VDD = 5V, VIN = VDD or GND
(Note 2, 3)
Propagation Delay
CD40104BMS 3-State
TPHZ
VDD = 5V, VIN = VDD or GND
(Note 2, 3)
Transition Time
Maximum Clock Input
Frequency
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
TTHL
TTLH
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
FCL
VDD = 5V, VIN = VDD or GND
(Note 1, 2)
9
10, 11
9
10, 11
9
10, 11
9
10, 11
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
o
o
+125 C, -55 C
o
LIMITS
MIN
MAX
UNITS
-
440
ns
-
594
ns
-
460
ns
-
621
ns
-
160
ns
-
216
ns
-
90
ns
-
122
ns
9
+25 C
-
200
ns
10, 11
+125oC, -55oC
-
270
ns
3
-
MHz
2.22
-
MHz
MIN
MAX
UNITS
-
5
µA
-
150
µA
-
10
µA
-
300
µA
-
10
µA
9
10, 11
o
+25 C
o
o
+125 C, -55 C
NOTES:
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
2. -55oC and +125oC limits guaranteed, 100% testing being implemented.
3. VDD = 5V, CL = 50pF, RL = 1K, Input TR, TF < 20ns.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
Supply Current
SYMBOL
IDD
CONDITIONS
NOTES
VDD = 5V, VIN = VDD or GND
1, 2
TEMPERATURE
o
o
-55 C, +25 C
o
+125 C
VDD = 10V, VIN = VDD or GND
1, 2
o
o
-55 C, +25 C
o
+125 C
VDD = 15V, VIN = VDD or GND
1, 2
o
o
-55 C, +25 C
+125 C
-
600
µA
Output Voltage
VOL
VDD = 5V, No Load
1, 2
+25oC, +125oC,
-55oC
-
50
mV
Output Voltage
VOL
VDD = 10V, No Load
1, 2
+25oC, +125oC,
-55oC
-
50
mV
Output Voltage
VOH
VDD = 5V, No Load
1, 2
+25oC, +125oC,
-55oC
4.95
-
V
Output Voltage
VOH
VDD = 10V, No Load
1, 2
+25oC, +125oC,
-55oC
9.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1, 2
+125oC
0.36
-
mA
-55oC
0.64
-
mA
+125oC
0.9
-
mA
-55oC
1.6
-
mA
+125oC
2.4
-
mA
-55oC
4.2
-
mA
+125oC
-
-0.36
mA
-55oC
-
-0.64
mA
o
Output Current (Sink)
Output Current (Sink)
Output Current (Source)
IOL10
IOL15
IOH5A
VDD = 10V, VOUT = 0.5V
VDD = 15V, VOUT = 1.5V
VDD = 5V, VOUT = 4.6V
1, 2
1, 2
1, 2
7-1309
Specifications CD40104BMS, CD40194BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
LIMITS
PARAMETER
Output Current (Source)
SYMBOL
IOH5B
CONDITIONS
NOTES
VDD = 5V, VOUT = 2.5V
1, 2
TEMPERATURE
MIN
MAX
UNITS
-
-1.15
mA
-55 C
-
-2.0
mA
+125oC
-
-0.9
mA
-
-1.6
mA
-
-2.4
mA
-
-4.2
mA
o
+125 C
o
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1, 2
o
-55 C
Output Current (Source)
IOH15
VDD =15V, VOUT = 13.5V
1, 2
o
+125 C
o
-55 C
o
o
Input Voltage Low
VIL
VDD = 10V, VOH > 9V,
VOL < 1V
1, 2
+25 C, +125 C,
-55oC
-
3
V
Input Voltage High
VIH
VDD = 10V, VOH > 9V,
VOL < 1V
1, 2
+25oC, +125oC,
-55oC
7
-
V
Propagation Delay
Clock to Q
TPHL
TPLH
VDD = 10V
1, 2, 3
+25oC
-
200
ns
VDD = 15V
1, 2, 3
+25 C
-
140
ns
Propagation Delay
CD40194B Reset to Q
TPLH
TPHL
VDD = 10V
1, 2, 3
+25oC
-
180
ns
o
-
130
ns
o
-
70
ns
o
VDD = 15V
1, 2, 3
+25 C
Propagation Delay
CD40104BMS 3-State
TPZH
TPZL
TPLZ
VDD = 10V
VDD = 15V
1, 2, 3, 4
+25 C
-
50
ns
Propagation Delay
CD40104BMS 3-State
TPHZ
VDD = 10V
1, 2, 4
+25oC
Transition Time
Minimum Data Setup
Time, D0, D3, SRIN,
SLIN to Clock
1, 2, 3, 4
o
VDD = 15V
TTHL
TTLH
TS
1, 2, 4
VDD = 10V
1, 2, 3
VDD = 15V
1, 2, 3
TH
Maximum Clock Rise and
Fall Time
Minimum Data Hold Time
Select 1, Select 0 to
Clock
TS
ns
-
100
ns
o
-
80
ns
o
+25 C
+25 C
-
100
ns
+25oC
-
70
ns
o
-
50
ns
o
-
0
ns
o
-
0
ns
o
-
0
ns
o
1, 2, 3
VDD = 5V
1, 2, 3
1, 2, 3
1, 2, 3
VDD = 5V
+25 C
+25 C
+25 C
+25 C
1, 2, 3
+25 C
-
180
ns
1, 2, 3
+25oC
-
80
ns
VDD = 15V
1, 2, 3
+25oC
-
50
ns
VDD = 5V
1, 2, 3, 5
+25oC
3
-
µs
VDD = 10V
1, 2, 3, 5
+25oC
6
-
µs
1, 2, 3, 5
+25oC
8
-
µs
1, 2, 3
+25oC
-
400
ns
1, 2, 3
+25oC
-
220
ns
1, 2, 3
+25oC
-
130
ns
1, 2, 3
+25oC
-
0
ns
VDD = 10V
1, 2, 3
+25oC
-
0
ns
VDD = 15V
1, 2, 3
+25oC
-
0
ns
VDD = 5V
VDD = 10V
VDD = 15V
TH
40
+25 C
VDD = 15V
Minimum Data Setup
Time
Select 1, Select 0 to
Clock
-
o
+25 C
1, 2, 3
VDD = 10V
TRCL
TFCL
ns
1, 2, 3
VDD = 10V
TW
50
VDD = 10V
VDD = 15V
Minimum Clock Pulse
Width
-
o
VDD = 5V
VDD = 15V
Minimum Data Hold Time
D0, D3, SRIN, SLIN to
Clock
+25 C
VDD = 5V
7-1310
Specifications CD40104BMS, CD40194BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
LIMITS
PARAMETER
Minimum Reset Pulse
Width CD40194BMS
Input Capacitance
SYMBOL
TW
CONDITIONS
NOTES
VDD = 5V
CIN
TEMPERATURE
1, 2, 3
MIN
MAX
UNITS
o
-
300
ns
o
+25 C
VDD = 10V
1, 2, 3
+25 C
-
200
ns
VDD = 15V
1, 2, 3
+25oC
-
140
ns
-
7.5
pF
Any Input
o
1, 2
+25 C
NOTES:
1. All voltages referenced to device GND.
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized
on initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
4. CL = 50pF, RL = 1K, Input TR, TF < 20ns.
5. If more than one unit is cascaded, TRCL should be made less than or equal to the sumof the transition time and the fixed propagation
delay of the output of the driving stage for the estimated capacitive load.
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
Supply Current
SYMBOL
IDD
N Threshold Voltage
VNTH
N Threshold Voltage
Delta
∆VTN
P Threshold Voltage
VTP
P Threshold Voltage
Delta
∆VTP
Functional
F
CONDITIONS
NOTES
VDD = 20V, VIN = VDD or GND
VDD = 10V, ISS = -10µA
TEMPERATURE
1, 4
MIN
MAX
UNITS
o
-
25
µA
o
-2.8
-0.2
V
o
+25 C
1, 4
+25 C
VDD = 10V, ISS = -10µA
1, 4
+25 C
-
±1
V
VSS = 0V, IDD = 10µA
1, 4
+25oC
0.2
2.8
V
VSS = 0V, IDD = 10µA
VDD = 18V, VIN = VDD or GND
1, 4
+25 C
-
±1
V
1
+25oC
VOH >
VDD/2
VOL <
VDD/2
V
1, 2, 3, 4
+25oC
-
1.35 x
+25oC
Limit
ns
o
VDD = 3V, VIN = VDD or GND
Propagation Delay Time
TPHL
TPLH
VDD = 5V
3. See Table 2 for +25oC limit.
NOTES: 1. All voltages referenced to device GND.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
4. Read and Record
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25oC
PARAMETER
SYMBOL
DELTA LIMIT
Supply Current - MSI-2
IDD
± 1.0µA
Output Current (Sink)
IOL5
± 20% x Pre-Test Reading
IOH5A
± 20% x Pre-Test Reading
Output Current (Source)
7-1311
Specifications CD40104BMS, CD40194BMS
TABLE 6. APPLICABLE SUBGROUPS
MIL-STD-883
METHOD
GROUP A SUBGROUPS
Initial Test (Pre Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 1 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 2 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
100% 5004
1, 7, 9, Deltas
100% 5004
1, 7, 9
100% 5004
1, 7, 9, Deltas
100% 5004
2, 3, 8A, 8B, 10, 11
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Subgroup B-5
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroup B-6
Sample 5005
1, 7, 9
Sample 5005
1, 2, 3, 8A, 8B, 9
CONFORMANCE GROUP
PDA (Note 1)
Interim Test 3 (Post Burn-In)
PDA (Note 1)
Final Test
Group A
Group B
Group D
READ AND RECORD
IDD, IOL5, IOH5A
Subgroups 1, 2, 3, 9, 10, 11
Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
Group E Subgroup 2
TEST
READ AND RECORD
MIL-STD-883
METHOD
PRE-IRRAD
POST-IRRAD
PRE-IRRAD
POST-IRRAD
5005
1, 7, 9
Table 4
1, 9
Table 4
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
OSCILLATOR
FUNCTION
OPEN
GROUND
VDD
9V ± -0.5V
50kHz
25kHz
12-15
11
2
CD40104BMS, CD40194BMS
Static Burn-In 1
Note 1
12-15
1-11
16
Static Burn-In 2
Note 1
12-15
8
1-7, 9-11, 16
Dynamic BurnIn Note 1
-
7, 8, 10
1, 3-6, 9, 16
12-15
8
1-7, 9-11, 16
Irradiation
Note 2
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
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1312
CD40104BMS, CD40194BMS
Logic Diagrams
B
SHIFT
RIGHT *
INPUT 2
p
n
OE
B
D
D0 *
3
VDD
p
n
D
G
p
n
VDD
CL
CL
p
n
p
n
Q0
Q0
15
CL
CL
CL
CL
G
p
n
VSS
p
n
p
n
E
CL
Q0
E
CL
B
p
n
VDD
B
D
D1 *
4
p
n
OE
D
G
p
n
VDD
OUTPUT *
ENABLE 1
CL
CL
Q1
Q1
14
VSS
Q1
G
OE
E
CL
*
p
n
CLOCK *
CL
11
E
ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION
NETWORK
B
p
n
B
OE
D
D2 *
p
n
5
D
S0 *
9
CL
CL
D
13
Q2
G
D
Q2
Q2
p
n
VDD
G
G
E
p
n
G
S1 *
10
B
E
B
B
p
n
E
E
B
OE
D
D3 *
p
n
6
D
G
CL
CL
Q3
Q3
12
Q3
p
n
VDD
CONTROL TRUTH TABLE
G
MODE SELECT
E
SHIFT LEFT *
INPUT 7
p
n
CLOCK*
E
X
S0
S1
OUTPUT
ENABLE
0
0
1
Reset
1
0
1
Shift Right (Q0 toward Q3)
0
1
1
Shift Left (Q3 toward Q0)
1
1
1
Parallel Load
X
X
0
Operations occur as shown above,
but outputs assume high impedance
X = Don’t Care
1 = High level 0 = Low level
FIGURE 1. CD40104BMS
7-1313
ACTION
* Level change
CD40104BMS, CD40194BMS
Logic Diagrams
SHIFT
RIGHT *
INPUT 2
(Continued)
B
p
n
B
VDD
D
D0 *
3
R
p
n
CL
CL
G
p
n
Q0
p
n
p
n
D
CL
CL
CL
Q0
15
CL
VSS
G
p
n
p
n
E
p
n
CL
Q0
E
CL
R
B
p
n
VDD
B
D
D1 *
4
p
n
D
G
p
n
RESET
*
1
CL
CL
Q1
Q1
14
VSS
Q1
G
R
E
CL
*
p
n
CLOCK *
11
CL
E
ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION
NETWORK
B
p
n
B
D
D2 *
5
p
n
D
S0 *
9
CL
CL
13
Q2
G
D
Q2
Q2
p
n
D
G
G
E
p
n
G
S1 *
10
B
B
E
B
p
n
E
E
B
D
D3 *
6
p
n
D
G
CL
CL
Q3
Q3
12
Q3
p
n
G
CONTROL TRUTH TABLE
E
SHIFT LEFT *
INPUT 7
MODE SELECT
p
n
E
CLOCK*
S0
S1
RESET
X
0
0
1
No Change
1
0
1
Shift Right (Q0 toward Q3)
0
1
1
Shift Left (Q3 toward Q0)
1
1
1
Parallel Load
X
X
0
Reset
X
X = Don’t Care
1 = High level 0 = Low level
FIGURE 2. CD40194BMS
7-1314
ACTION
* Level change
CD40104BMS, CD40194BMS
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
25
20
15
10V
10
5
5V
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
12.5
10.0
10V
7.5
5.0
2.5
5V
0
-5
-15
-10V
-20
-25
-15V
-30
0
AMBIENT TEMPERATURE (TA) = +25oC
0
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
-5
-10V
-10
-15V
FIGURE 5. TYPICAL P-CHANNEL OUTPUT HIGH (SOURCE)
CURRENT CHARACTERISTICS
-15
FIGURE 6. MINIMUM P-CHANNEL OUTPUT HIGH (SOURCE)
CURRENT CHARACTERISTICS
AMBIENT TEMPERATURE (TA) = +25oC
TRANSITION TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (TA) = +25oC
300
SUPPLY VOLTAGE (VDD) = 5V
200
10V
100
15V
20
40
60
80
LOAD CAPACITANCE (CL) (pF)
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-15
-10
-5
-10
0
10
FIGURE 4. MINIMUM N-CHANNEL OUTPUT LOW (SINK)
CURRENT CHARACTERISTICS
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
0
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
5
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
AMBIENT TEMPERATURE (TA) = +25oC
PROPAGATION DELAY TIME (tPLH, tPHL) (ns)
15.0
0
FIGURE 3. TYPICAL N-CHANNEL OUTPUT LOW (SINK)
CURRENT CHARACTERISTICS
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-15
-10
-5
AMBIENT TEMPERATURE (TA) = +25oC
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
30
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
Typical Performance Characteristics
200
150
100
10V
FIGURE 7. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF LOAD CAPACITANCE, (CLOCK TO Q)
15V
50
0
0
100
SUPPLY VOLTAGE (VDD) = 5V
20
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
FIGURE 8. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
7-1315
CD40104BMS, CD40194BMS
Typical Performance Characteristics
TYP. DYNAMIC POWER DISSIPATION (PD) (µW)
105 8
(Continued)
AMBIENT TEMPERATURE (TA) = +25oC
6
4
2
SUPPLY VOLTAGE (VDD) = 5V
104 8
6
4
2
15V
10V
3
10 8
6
4
2
102 8
6
4
CL = 50pF
CL = 15pF
2
10
2
4 68
0.1
2
4 68
2
4 68
2
10
102
FREQUENCY (fφ) (kHz)
1
4 68
103
2
4 68
104
FIGURE 9. TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY
Chip Dimensions and Pad Layouts
CD40104BMS
CD40194BMS
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION:
PASSIVATION:
Thickness: 11kÅ − 14kÅ,
AL.
10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-1316