MC10H180 Dual 2−Bit Adder/Subtractor Description The MC10H180 is a high−speed, low−power, general−purpose adder/ subtractor. It is designed to be used in special purpose adders/subtractors or in high−speed multiplier arrays. Inputs for each adder are Carry−in, Operand A, and Operand B; outputs are Sum, Sum and Carry−out. The common select inputs serve as a control line to Invert A for subtract, and a control line to Invert B. http://onsemi.com MARKING DIAGRAMS* Features • Propagation Delay, 1.8 ns Typical, Operand and Select to Output • Power Dissipation, 360 mW Typical MC10H180 • Improved Noise Margin 150 mV (Over Operating Voltage and 16 MC10H180L AWLYYWW Temperature Range) • Voltage Compensated • MECL 10K™ Compatible • Pb−Free Packages are Available* 1 CDIP−16 L SUFFIX CASE 620A LOGIC DIAGRAM 7 9 5 6 4 SELA S0 S0 SELB AO BO COUT CIN 11 10 12 SELA S1 S1 SELB A1 B1 COUT CIN 15 2 3 14 1 16 POSITIVE LOGIC ONLY A’ = A SELA = ASELA B’ = B SELB = BSELB S = CIN (A’ B’ + A’ B’) + CIN(A’ B’ + A’ B’) COUT = CINA’ + CINB’ + A’ B’ MC10H180P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 1 20 13 VCC = PIN 16 VEE = PIN 8 10H180G AWLYYWW 20 1 DIP PIN ASSIGNMENT S1 1 16 VCC S0 2 15 S0 COUT 3 14 S1 CIN 4 13 COUT A0 5 12 CIN B0 6 11 A1 SELA 7 10 B1 VEE 8 9 1 PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G SELB Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MC10H180/D MC10H180 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol IE IinH Characteristic 25° 75° Min Max Min Max Min Max Unit Power Supply Current − 95 − 86 − 95 mA Input Current High Pins 4, 12 Pins 7, 9 Pins 5, 6, 10, 11 − − − 665 515 410 − − − 417 320 255 − − − 417 320 255 0.5 − 0.5 − 0.3 − mA mA IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage (1) −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage (1) −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Table 3. AC PARAMETERS 0° Symbol 25° 75° Min Max Min Max Min Max Propagation Delay Operand to Output Select to Output Carry−in to Output 0.6 0.6 0.4 2.4 2.2 1.6 0.7 0.7 0.4 2.5 2.3 1.7 0.8 0.8 0.4 2.8 2.6 1.8 tr Rise Time 0.5 2.0 0.5 2.1 0.5 2.2 ns tf Fall Time 0.5 2.0 0.5 2.1 0.5 2.2 ns tpd Characteristic Unit ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H180 Table 4. FUNCTION SELECT TABLE SelA SelB H H FuncS = A plustion B H L L L H L S = A minus B S = B minus A S = 0 minus A minus B Table 5. TRUTH TABLE FUNCTION INPUTS SelA SelB A0 B0 Cin ADD H H H H H H H H H H H H H H H H L L L L H H H H L L H H L L H H L H L H L H L H L H H L H L L H H L L H L H H L L L L H L H H H SUBTRACT H H H H H H H H L L L L L L L L L L L L H H H H L L H H L L H H L H L H L H L H H L L H L H H L L H H L H L L H L H L L H H L H FUNCTION S0 S0 Cout REVERSE SUBTRACT INPUTS SelA SelB L L L L L L L L H H H H H H H H A0 B0 L L L L H H H H L L H H L L H H Cin L H L H L H L H S0 S0 Cout H L L H L H H L L H H L H L L H L H H H L L L H L L L L L L L L L L L L L L L L L L L L H H H H L L H H L L H H L H L H L H L H L H H L H L L H H L L H L H H L H H L H L H L L ORDERING INFORMATION Package Shipping † MC10H180FN PLLC−20 46 Units / Rail MC10H180FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H180L CDIP−16 25 Unit / Rail MC10H180P PDIP−16 25 Unit / Rail MC10H180PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H180 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H180 PACKAGE DIMENSIONS CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. M B L 16X 0.25 (0.010) E M DIM A B C D E F G H K L M N J T B F C K MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 SEATING PLANE T N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 G 16X 0.25 (0.010) M D T A PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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