MC10H186 Hex D Master−Slave Flip−Flop with Reset Description The MC10H186 is a hex D type flip−flop with common reset and clock lines. This MECL 10H™ part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in clock toggle frequency and propagation delay and no increase in power−supply current. http://onsemi.com MARKING DIAGRAMS* Features 16 • Propagation Delay, 1.7 ns Typical • Power Dissipation, 460 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and • • • MC10H186L AWLYYWW Temperature Range) Voltage Compensated MECL 10K Compatible Pb−Free Packages are Available* 1 CDIP−16 L SUFFIX CASE 620A CLOCKED TRUTH TABLE R C D Qn+1 L L X Qn L H* L L L H* H H H L X L 16 MC10H186P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 * A clock H is a clock transition from a low to a high state. 1 20 DIP PIN ASSIGNMENT RESET 1 16 VCC Q0 2 15 Q5 Q1 3 14 Q4 Q2 4 13 Q3 D0 5 12 D5 D1 6 11 D4 D2 7 10 D3 VEE 8 9 CLOCK PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. February, 2006 − Rev. 7 10H186G AWLYYWW 20 1 Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). © Semiconductor Components Industries, LLC, 2006 1 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Publication Order Number: MC10H186/D MC10H186 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (See Note 1.) 0° Symbol IE IinH Characteristic 25° 75° Min Max Min Max Min Max Unit Power Supply Current − 121 − 110 − 121 mA Input Current High Pins 5,6,7,10,11,12 Pin 9 Pin 1 − − − 430 670 1250 − − − 265 420 765 − − − 265 420 765 0.5 − 0.5 − 0.3 − mA mA IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Table 3. AC PARAMETERS 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit tpd Propagation Delay 0.7 3.0 0.7 3.0 0.7 3.0 ns tset Set−up Time 1.5 − 1.5 − 1.5 − ns thold Hold Time 1.0 − 1.0 − 1.0 − ns tr Rise Time 0.7 2.6 0.7 2.6 0.7 2.6 ns tf Fall Time 0.7 2.6 0.7 2.6 0.7 2.6 ns Toggle Frequency 250 − 250 − 250 − MHz Reset Recovery Time (t1−9+) 3.0 − 3.0 − 3.0 − ns ftog trr NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H186 APPLICATION INFORMATION The MC10H186 contains six high−speed, master slave type “D” flip−flops. Data is entered into the master when the clock is low. Master−to−slave data transfer takes place on the positive−going Clock transition. Thus outputs may change only on a positive−going Clock transition. A change in the information present at the data (D) input will not affect the output information any other time due to the master−slave construction of this device. A common Reset is included in this circuit. THE RESET ONLY FUNCTIONS WHEN THE CLOCK IS LOW. LOGIC DIAGRAM D0 5 2 Q0 D1 6 3 Q1 D2 7 4 Q2 D3 10 13 Q3 D4 11 14 Q4 D5 12 15 Q5 CLOCK 9 RESET 1 VCC = PIN 16 VEE = PIN 8 ORDERING INFORMATION Package Shipping † MC10H186FN PLLC−20 46 Units / Rail MC10H186FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H186FNR2 PLLC−20 500 / Tape & Reel MC10H186FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H186L CDIP−16 25 Unit / Rail MC10H186P PDIP−16 25 Unit / Rail MC10H186PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H186 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H186 PACKAGE DIMENSIONS CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. M B L 16X 0.25 (0.010) E M DIM A B C D E F G H K L M N J T B F C K MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 SEATING PLANE T N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 G 16X 0.25 (0.010) M D T A PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 5 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC10H186/D