MC33375 Series 300 mA, Low Dropout Voltage Regulator with On/Off Control The MC33375 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223 and SOP−8. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC33375 has a control pin that allows a logic level signal to turn−off or turn−on the regulator output. Due to the low input−to−output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. http://onsemi.com LOW DROPOUT MICROPOWER VOLTAGE REGULATOR MARKING DIAGRAMS 4 1 Features: SOT−223 ST SUFFIX CASE 318E • Low Quiescent Current (0.3 A in OFF mode; 125 A in ON mode) • Low Input−to−Output Voltage Differential of 25 mV at IO = 10 mA, • • • • • and 260 mV at IO = 300 mA Extremely Tight Line and Load Regulation Stable with Output Capacitance of only 0.33 F for 2.5 V Output Voltage Internal Current and Thermal Limiting Logic Level ON/OFF Control Pb−Free Packages are Available Vin Vout Thermal & Anti−sat Protection On/Off AYM 375xx G G 1 8 8 1 375xx ALYW G SOIC−8 D SUFFIX CASE 751 1 A = Assembly Location Y = Year M = Date Code L = Wafer Lot W = Work Week xx = Voltage Version G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Rint See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. On/Off Block 1.23 V V. Ref. 54 K GND This device contains 41 active transistors Figure 1. Simplified Block Diagram © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 10 1 Publication Order Number: MC33375/D MC33375 Series PIN CONNECTIONS Gnd 4 Input Gnd Gnd 1 ON/OFF 2 3 Vin ON/ Vout OFF 1 8 2 7 3 6 4 5 Output Gnd Gnd N/C MAXIMUM RATINGS Rating Symbol Value Unit VCC 13 Vdc PD Internally Limited W RJA RJC 160 25 °C/W °C/W RJA RJC 245 15 °C/W °C/W Output Current IO 300 mA Maximum Junction Temperature TJ 150 °C Operating Ambient Temperature Range TA − 40 to +125 °C Storage Temperature Range Tstg − 65 to +150 °C Input Voltage Power Dissipation and Thermal Characteristics TA = 25°C Maximum Power Dissipation Case 751 (SOP−8) D Suffix Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 318E (SOT−223) ST Suffix Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC33375 Series ELECTRICAL CHARACTERISTICS (CL = 1.0 F, TA = 25°C, for min/max values TJ = −40°C to +125°C, Note 1) Symbol Characteristic Output Voltage 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix IO = 0 mA to 250 mA TA = 25°C, Vin = [VO + 1] V Min Typ Max 1.782 2.475 2.970 3.267 4.950 1.80 2.50 3.00 3.30 5.00 1.818 2.525 3.030 3.333 5.05 1.764 2.450 2.940 3.234 4.900 − − − − − 1.836 2.550 3.060 3.366 5.100 VO Unit Vdc 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Vin = [VO + 1] V, 0 < IO < 100 mA 2% Tolerance from TJ = −40 to +125°C Line Regulation Vin = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25°C Regline − 2.0 10 mV Load Regulation Vin = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25°C Regload − 5.0 25 mV − − − − 25 115 220 260 100 200 400 500 65 75 − − − 160 46 − − IQOn − 125 200 A IQOff − 0.3 4.0 A − − − − − 1100 1100 1500 1500 1500 1500 1500 2000 2000 2000 − 450 − 2.4 − − − − − − 0.5 0.3 − 150 − Dropout Voltage IO = 10 mA IO = 100 mA IO = 250 mA IO = 300 mA Vin − VO TJ = −40°C to +125°C Ripple Rejection (120 Hz) Vin(peak−peak) = [VO + 1.5] V to [VO + 5.5] V Output Noise Voltage CL = 1.0 F IO = 50 mA (10 Hz to 100 kHz) CL = 200 F − mV dB Vrms Vn CURRENT PARAMETERS Quiescent Current ON Mode Vin = [VO + 1] V, IO = 0 mA Quiescent Current OFF Mode Quiescent Current ON Mode SAT 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Vin = [VO − 0.5] V, IO = 0 mA (Note 2) Current Limit Vin = [VO + 1] V, VO Shorted A IQSAT ILIMIT mA ON/OFF INPUTS On/Off Input Voltage Logic “1” (Regulator On) Vout = VO ± 2% Logic “0” (Regulator Off) Vout < 0.03 V Logic “0” (Regulator Off) Vout < 0.05 V (1.8 V Option) VCTRL V THERMAL SHUTDOWN Thermal Shutdown − 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO − 0.5] V guarantees this condition. http://onsemi.com 3 °C MC33375 Series DEFINITIONS difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following: Load Regulation − The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage − The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage − The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation − The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current − Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation − The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation − The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150°C. The junction temperature is rising while the T –T Pd + J A R JA The maximum operating junction temperature TJ is specified at 150°C, if TA = 25°C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as: I out + P D V – Vout CC The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150°C for MC33375) and ambient temperature. R http://onsemi.com 4 T –T + J A JA P D MC33375 Series 7 150 TA = 25° C 6 CL = 33 F IL = 10 mA 5 Vout = 3.3 V 100 4 50 3 0 2 Vout −50 1 0 0 20 40 60 80 100 120 140 160 70 60 Vin 40 4 30 3 20 10 2 0 1 Vout 0 50 100 Figure 3. Line Transient Response 1.0 300 −200 0 Vout CHANGE −400 CL = 1.0 F Vout = 3.3 V −500 TA = 25° C −600 Vin = 4.3 V 0 50 −0.2 −0.4 −0.6 −0.8 100 150 200 300 250 350 LOAD CURRENT (mA) LOAD CURRENT (mA) 0.2 150 LOAD CURRENT −50 0.04 −150 −0.01 −250 −350 CL = 33.0 F Vout = 3.3 V TA = 25° C Vin = 4.3 V Vout CHANGE −450 −550 −0.06 −0.11 −650 −750 −1.0 400 −0.16 0 50 TIME (S) 100 150 200 250 300 TIME (S) Figure 5. Load Transient Response Figure 4. Load Transient Response 300 3.5 3.0 IL = 1 mA DROPOUT VOLTAGE (mV) OUTPUT VOLTAGE (V) 0.09 50 OUTPUT VOLTAGE CHANGE (V) 0.4 −100 0.14 250 0.6 LOAD CURRENT OUTPUT VOLTAGE CHANGE (V) 200 −700 350 0.8 −300 −20 200 150 TIME (S) Figure 2. Line Transient Response 0 −10 0 −100 180 200 TIME (S) 100 50 Vin , INPUT VOLTAGE (V) Vin 200 OUTPUT VOLTAGE CHANGE (mV) TA = 25° C 6 CL = 0.47 F IL = 10 mA 5 Vout = 3.3 V OUTPUT VOLTAGE CHANGE (mV) Vin , INPUT VOLTAGE (V) 7 2.5 IL = 250 mA 2.0 1.5 1.0 250 200 150 100 50 0.5 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1 4.5 5.0 10 100 1000 INPUT VOLTAGE (V) IO, OUTPUT CURRENT (mA) Figure 6. Output Voltage versus Input Voltage Figure 7. Dropout Voltage versus Output Current http://onsemi.com 5 MC33375 Series 12 250 10 IL = 300 mA 8 200 Ignd (mA) DROPOUT VOLTAGE (mV) 300 IL = 250 mA 150 IL = 100 mA 100 IL = 300 mA 6 4 IL = 100 mA 50 2 IL = 10 mA 0 −40 0 IL = 50 mA 25 0 85 0 1 2 3 TEMPERATURE (°C) 4 5 6 7 8 Vin (VOLTS) Figure 9. Ground Pin Current versus Input Voltage Figure 8. Dropout Voltage versus Temperature 2.5 8 7 IO = 0 2.495 IL = 250 mA Vout (VOLTS) Ignd (mA) 6 5 4 3 2.49 IO = 250 mA 2.485 IL = 100 mA 2.48 IL = 50 mA 2.475 2 1 0 −40 −20 0 20 40 60 80 100 120 2.47 −40 140 0 25 TA (°C) TEMPERATURE (°C) Figure 10. Ground Pin Current versus Ambient Temperature Figure 11. Output Voltage versus Ambient Temperature (Vin = Vout + 1V) http://onsemi.com 6 85 MC33375 Series 2.5 IO = 0 2.495 Vout (VOLTS) 2.49 IO = 250 mA 2.485 2.48 2.475 2.47 2.465 −40 0 25 85 TEMPERATURE (°C) Figure 12. Output Voltage versus Ambient Temperature (Vin = 12 V) 70 70 60 60 50 IL = 250 mA IL = 1 mA dB 40 40 30 30 20 20 10 10 1 10 0 0.1 100 1 10 FREQUENCY (kHz) FREQUENCY (kHz) Figure 13. Ripple Rejection Figure 14. Ripple Rejection 5 ENABLE 4.5 4 VOLTAGE (V) dB 50 0 0.1 IL = 100 mA IL = 10 mA 3.5 CL = 1.0 F 3 2.5 CL = 33 F 2 1.5 1 0.5 0 0 100 200 300 400 TIME (S) Figure 15. Enable Transient http://onsemi.com 7 500 100 MC33375 Series 1.8 V Option 2.0 1.85 ILOAD = 100 mA 1.8 VOUT, OUTPUT VOLTAGE (V) VOUT , OUTPUT VOLTAGE (V) 1.84 1.83 1.82 1.81 1.80 1.79 1.78 1.77 1.76 1.75 −40 1.6 1.4 1.2 1.0 0.8 0.6 0.4 TA = 25° C ILOAD = 0 mA 0.2 0 −20 0 20 40 60 80 100 120 1 0 3 2 TA, AMBIENT TEMPERATURE (°C) Figure 16. Output Voltage versus Temperature 140 10 120 100 TA = 25° C VCC = 3 V IQ ( A) Ignd , (mA) 6 Figure 17. Output Voltage versus Input Voltage 12 8 5 4 VCC, (V) 6 4 80 60 40 2 TA = 25° C ILOAD = 0 mA 20 0 0 50 0 100 150 200 250 300 350 0 1 3 2 ILOAD, (mA) 5 4 6 VCC, (V) Figure 19. Quiescent Current versus Input Voltage Figure 18. Ground Current versus Load Current 80 VCC = 3 V ILOAD = 1 mA TA = 25°C COUT = 1 F 2V 70 PSRR (dB) 60 50 ENABLE VOUT 40 30 20 0V 10 0 0.1 1 10 100 0 1000 5 10 15 20 25 30 35 40 f, FREQUENCY (kHz) t, TIME (s) Figure 20. PSRR versus Frequency Figure 21. Enable Response http://onsemi.com 8 45 50 MC33375 Series VCC = 3 V ILOAD = 1 mA to 100 mA TA = 25°C 1.82 V 1.80 V 1.78 V 100 mA 1 mA 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 t, TIME (ms) Figure 22. Load Transient Response APPLICATIONS INFORMATION ON/OFF Vout Vin MC33375−xx Cin Cout LOAD GND Figure 23. Typical Application Circuit frequencies. A 0.33 F or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. Figure 16 shows the ESR that allows the LDO to remain stable for various load currents. The MC33375 regulators are designed with internal current limiting and thermal shutdown making them user−friendly. Figure 15 is a typical application circuit. The output capability of the regulator is in excess of 300 mA, with a typical dropout voltage of less than 260 mV. Internal protective features include current and thermal limiting. EXTERNAL CAPACITORS These regulators require only a 0.33 F (or greater) capacitance between the output and ground for stability for 1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output voltage options of 5.0 V require only 0.22 F for stability. The output capacitor must be mounted as close as possible to the MC33375. If the output capacitor must be mounted further than two centimeters away from the MC33375, then a larger value of output capacitor may be required for stability. A value of 0.68 F or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25°C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. This will reduce the circuit’s sensitivity to the input line impedance at high 100 ESR (ohm) Vout = 3.0 V Cout = 1.0 F Cin = 1.0 F 10 Stable Region 1.0 0.1 0 50 100 150 200 250 300 LOAD CURRENT (mA) Figure 24. ESR for Vout = 3.0V Applications should be tested over all operating conditions to insure stability. http://onsemi.com 9 MC33375 Series THERMAL PROTECTION The internal current limit will typically limit current to 450 mA. If during current limit the junction exceeds 150°C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking. Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 150°C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the 150°C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold. OUTPUT NOISE In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the MC33375. ON/OFF PIN Thermal limit is not a substitute for proper heatsinking. 1.6 160 1.4 PD(max) for TA = 50°C 140 1.2 2.0 oz. Copper L Minimum Size Pad 120 L 100 80 ÎÎÎ ÎÎÎ ÎÎÎ 1.0 0.8 0.6 RJA 60 0 5.0 0.4 30 10 15 20 25 L, LENGTH OF COPPER (mm) Figure 25. SOT−223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length R θ JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (°C/W) RJA, THERMAL RESISTANCE, JUNCTION−TO−AIR (°CW) 180 PD, MAXIMUM POWER DISSIPATION (W) When this pin is pulled low, the MC33375 is off. This pin should not be left floating. The pin should be pulled high for the MC33375 to operate. 3.2 170 150 2.8 PD(max) for TA = 50°C 130 2.4 110 Graph Represents Symmetrical Layout 2.0 90 L 70 ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ 2.0 oz. Copper 3.0 mm L RJA 50 1.6 1.2 0.8 0.4 30 0 10 20 30 40 50 L, LENGTH OF COPPER (mm) Figure 26. SOP−8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 10 MC33375 Series ORDERING INFORMATION Device Type Operating Temperature Range, Tolerance MC33375ST−1.8T3 MC33375ST−1.8T3G SOT−223 (Pb−Free) SOIC−8 (Pb−Free) MC33375D−2.5R2 SOIC−8 (Pb−Free) SOT−223 MC33375ST−2.5T3G SOT−223 (Pb−Free) MC33375D−3.0 2500 / Tape & Reel 4000 / Tape & Reel SOIC−8 MC33375D−3.0G SOIC−8 (Pb−Free) MC33375D−3.0R2 98 Units / Rail SOIC−8 3.0 V (Fixed Voltage) 1% Tolerance at TA = 25°C MC33375ST−3.0T3 SOIC−8 (Pb−Free) 2500 / Tape & Reel SOT−223 MC33375ST−3.0T3G 2% Tolerance at TJ from −40 to +125°C MC33375D−3.3 SOT−223 (Pb−Free) 4000 / Tape & Reel SOIC−8 MC33375D−3.3G SOIC−8 (Pb−Free) MC33375D−3.3R2 98 Units / Rail SOIC−8 3.3 V (Fixed Voltage) SOIC−8 (Pb−Free) MC33375ST−3.3T3 SOT−223 MC33375ST−3.3T3G SOT−223 (Pb−Free) MC33375D−5.0 2500 / Tape & Reel 4000 / Tape & Reel SOIC−8 MC33375D−5.0G SOIC−8 (Pb−Free) MC33375D−5.0R2 MC33375D−5.0R2G 98 Units / Rail SOIC−8 2.5 V (Fixed Voltage) MC33375ST−2.5T3 MC33375D−3.3R2G 4000 / Tape & Reel SOIC−8 MC33375D−2.5G MC33375D−3.0R2G Shipping† SOT−223 1.8 V (Fixed Voltage) MC33375D−2.5 MC33375D−2.5R2G Package 98 Units / Rail SOIC−8 5.0 V (Fixed Voltage) SOIC−8 (Pb−Free) MC33375ST−5.0T3 SOT−223 MC33375ST−5.0T3G SOT−223 (Pb−Free) 2500 / Tape & Reel 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 11 MC33375 Series DEVICE MARKING Device Version Marking (1st line) MC33375 1.8 V 37518 MC33375 2.5 V 37525 MC33375 3.0 V 37530 MC33375 3.3 V 37533 MC33375 5.0 V 37550 TAPE AND REEL SPECIFICATIONS† Device Reel Size Tape Width Quantity MC33375D 13″ 12 mm Embossed Tape 2500 Units MC33375ST 13″ 8 mm Embossed Tape 4000 Units †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 12 MC33375 Series PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. D b1 4 HE 1 2 3 E b e1 e 0.08 (0003) C q A A1 DIM A A1 b b1 c D E e e1 L1 HE q MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10° − L1 SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 13 MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° MC33375 Series PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 1 0.25 (0.010) M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 14 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC33375/D