MC100EP14 3.3V / 5V1:5 Differential ECL/PECL/HSTL Clock Driver Description The MC100EP14 is a low skew 1−to−5 differential driver, designed with clock distribution in mind, accepting two clock sources into an input multiplexer. The ECL/PECL input signals can be either differential or single−ended (if the VBB output is used). HSTL inputs can be used when the LVEP14 is operating under PECL conditions. The EP14 specifically guarantees low output−to−output skew. Optimal design, layout, and processing minimize skew within a device and from device to device. To ensure that the tight skew specification is realized, both sides of any differential output need to be terminated even if only one output is being used. If an output pair is unused, both outputs may be left open (unterminated) without affecting skew. The common enable (EN) is synchronous, outputs are enabled/ disabled in the LOW state. This avoids a runt clock pulse when the device is enabled/disabled as can happen with an asynchronous control. The internal flip flop is clocked on the falling edge of the input clock, therefore all associated specification limits are referenced to the negative edge of the clock input. The MC100EP14, as with most other ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the EP14 to be used for high performance clock distribution in 5.0 V systems. Designers can take advantage of the EP14’s performance to distribute low skew clocks across the backplane or the board. Features • • • • • • • • • 400 ps Typical Propagation Delay 100 ps Device−to−Device Skew 25 ps Within Device Skew Maximum Frequency > 2 GHz Typical The 100 Series Contains Temperature Compensation PECL and HSTL Mode: VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode: VCC = 0 V with VEE = −3.0 V to −5.5 V Open Input Default State These are Pb−Free Devices © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 5 http://onsemi.com TSSOP−20 DT SUFFIX CASE 948E MARKING DIAGRAM* 20 100 EP14 ALYWG G 1 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. 1 Publication Order Number: MC100EP14/D MC100EP14 VCC EN VCC CLK1 CLK1 VBB CLK0 CLK0 CLK_SEL VEE 20 19 18 17 16 15 14 13 12 11 1 0 D Q 1 2 3 4 5 6 7 8 9 10 Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 WARNING: All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. TSSOP−20 (Top View) and Logic Diagram Table 1. PIN DESCRIPTION Pin Table 2. FUNCTION TABLE Function CLK0*, CLK0** ECL/PECL/HSTL CLK Input CLK1*, CLK1** ECL/PECL/HSTL CLK Input Q0:4, Q0:4 ECL/PECL Outputs CLK_SEL* ECL/PECL Active Clock Select Input EN* ECL Sync Enable VBB Reference Voltage Output VCC Positive Supply VEE Negative Supply CLK0 CLK1 CLK_SEL EN Q L H X X X X X L H X L L H H X L L L L H L H L H L* * On next negative transition of CLK0 or CLK1 * Pins will default low when left open. ** Pins will default to VCC/2 when left open. http://onsemi.com 2 MC100EP14 Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor ESD Protection 37.5 kW Human Body Model Machine Model Charged Device Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) TSSOP−8 Flammability Rating Oxygen Index: 28 to 34 > 4 kV > 200 V > 2 kV Pb Pkg Pb−Free Pkg Level 1 Level 1 UL 94 V−0 @ 0.125 in Transistor Count 357 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−20 TSSOP−20 140 100 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−20 23 to 41 °C/W Tsol Wave Solder <2 to 3 sec @ 248°C 265 °C VI VCC VI VEE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 MC100EP14 Table 5. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 45 55 65 48 58 68 52 62 72 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 3) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 3) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VIH Input HIGH Voltage (Single−Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single−Ended) 1355 1675 1355 1675 1355 1675 mV VBB Output Voltage Reference 1775 1975 1775 1975 1775 1975 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) 3.3 1.2 3.3 1.2 3.3 V IIH Input HIGH Current 150 mA IIL Input LOW Current 1875 1.2 1875 150 D D 0.5 −150 1875 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 3. All loading with 50 W to VCC − 2.0 V. 4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 45 55 65 48 58 68 52 62 72 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 6) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV VOL Output LOW Voltage (Note 6) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV VIH Input HIGH Voltage (Single−Ended) 3775 4120 3775 4120 3775 4120 mV VIL Input LOW Voltage (Single−Ended) 3055 3375 3055 3375 3055 3375 mV VBB Output Voltage Reference 3475 3675 3475 3675 3475 3675 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 7) 5.0 1.2 5.0 1.2 5.0 V IIH Input HIGH Current 150 mA IIL Input LOW Current 3575 1.2 150 D D 0.5 −150 3575 150 0.5 −150 0.5 −150 3575 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 6. All loading with 50 W to VCC − 2.0 V. 7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 4 MC100EP14 Table 7. 100EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 8) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 45 55 65 48 58 68 52 62 72 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 9) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 9) −1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV VIH Input HIGH Voltage (Single−Ended) −1225 −880 −1225 −880 −1225 −880 mV VIL Input LOW Voltage (Single−Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV VBB Output Reference Voltage −1525 −1325 −1525 −1325 −1525 −1325 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 10) 0.0 V IIH Input HIGH Current 150 mA IIL Input LOW Current CLK CLK −1425 VEE+1.2 0.0 −1425 VEE+1.2 150 0.5 −150 0.0 −1425 VEE+1.2 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. 9. All loading with 50 W to VCC − 2.0 V. 10. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 8. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 11) −40°C Symbol Characteristic Min Typ 25°C Max VOPP Output Voltage Amplitude @ 2 GHz (Figure 2) 440 540 tPLH tPHL Propagation Delay to Output Differential 275 330 400 tskew Within−Device Skew Device−to−Device Skew (Note 12) 25 100 35 125 ts th Setup Time to CLK EN to CLK Hold Time EN to CLK tJITTER Cycle−to−Cycle Jitter (Figure 2) VPP Minimum Input Swing tr/tf Output Rise/Fall Time (20%−80%) 100 200 50 140 Min Typ 420 520 275 375 450 30 150 45 175 100 200 0.2 <1 150 800 1200 105 155 205 85°C Max 50 140 Min Typ 380 480 280 380 480 ps 40 175 50 200 ps 100 200 0.2 <1 150 800 1200 145 200 270 Max Unit GHz 50 140 ps 0.2 <1 ps 150 800 1200 mV 150 225 300 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. 12. Skew is measured between outputs under identical transitions. http://onsemi.com 5 MC100EP14 9 900 5.0 V VOUTpp (mV) 800 8 3.3 V 7 750 6 700 5 650 4 600 550 3 500 2 ÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉ (JITTER) 450 400 0.0 0.5 1.0 1.5 1 2.0 JITTER OUT ps (RMS) 850 ÉÉ ÉÉ 2.5 FREQUENCY (MHz) Figure 2. Fmax/Jitter Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping † MC100EP14DT TSSOP−20* 75 Units / Rail MC100EP14DTG TSSOP−20* 75 Units / Rail MC100EP14DTR2 TSSOP−20* 2500 / Tape & Rail MC100EP14DTR2G TSSOP−20* 2500 / Tape & Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 6 MC100EP14 Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 7 MC100EP14 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING DIM A B C D F G H J J1 K K1 L M PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC100EP14 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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