NCS2200 Series, NCS2200A Low Voltage Comparators The NCS2200 Series is an industry first sub−one volt, low power comparator family. These devices consume only 10 mA of supply current. They are guaranteed to operate at a low voltage of 0.85 V which allows them to be used in systems that require less than 1.0 V and are fully operational up to 6.0 V which makes them convenient for use in both 3.0 V and 5.0 V systems. Additional features include no output phase inversion with overdriven inputs, internal hysteresis, which allows for clean output switching, and rail−to−rail input and output performance. The NCS2200 Series is available in the tiny SOT−23−5 and SOT−23−6 package. There are eight options featuring two industry standard pinouts. Additionally, the NCS2200 and NCS2202 are available in the SC70−5 package. The NCS2200 is also available in the tiny DFN 2x2.2 package. The NCS2200A is available in UDFN 1.2x1.0 package. (Table 1) The NCS2201/3 Series in the SOT−23−6 package features an enable function, which can be externally controlled. When the enable pin is pulled low (output tri−state mode), current consumption is typically 0.3 mA. This allows the user to implement these devices in power sensitive applications such as portable electronics. Features • • • • • • • • • • 5 1 Operating Voltage of 0.85 V to 6.0 V Rail−to−Rail Input/Output Performance Low Supply Current of 10 mA No Phase Inversion with Overdriven Input Signals Glitchless Transitioning in or out of Tri−State Mode Complementary or Open Drain Output Configuration Available with the Enable Function Internal Hysteresis Propagation Delay of 1.1 ms Pb−Free Packages are Available SOT−23−5 (TSOP−5) SN SUFFIX CASE 483 SOT−23−6 (TSOP−6) SN SUFFIX CASE 318G 6 1 DFN 2x2.2 SQL SUFFIX CASE 488 1 6 5 1 SC70−5 SQ SUFFIX CASE 419A UDFN 1.2x1.0 MU SUFFIX CASE 517AA 1 Typical Applications • • • • http://onsemi.com Single Cell NiCd/NiMH Battery Powered Applications Cellular Telephones Alarm and Security Systems Personal Digital Assistants ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 14 of this data sheet. © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 8 1 Publication Order Number: NCS2200/D NCS2200 Series, NCS2200A Table 1. Comparator Selector Guide Output Type Device Package Pinout Style NCS2200SN1T1 SOT−23−5 1 Complementary NCS2200SN2T1 SOT−23−5 2 Complementary NCS2200SQ2T2 SC70−5 2 Complementary, Enable NCS2201SN1T1 SOT−23−6 1 Complementary, Enable NCS2201SN2T1 SOT−23−6 2 Open Drain NCS2202SN1T1 SOT−23−5 1 Open Drain NCS2202SQ1T2 SC70−5 1 Open Drain NCS2202SN2T1 SOT−23−5 2 Open Drain NCS2202SQ2T2 SC70−5 2 Open Drain, Enable NCS2203SN1T1 SOT−23−6 1 Open Drain, Enable NCS2203SN2T1 SOT−23−6 2 Complementary NCS2200SQLT1 DFN, 2x2.2 N/A Complementary NCS2200AMUT1 UDFN, 1.2x1.0 N/A Complementary PIN CONNECTIONS Output 1 VCC Non−Inverting Input 2 5 + − 3 4 Output 1 VEE Non−Inverting Input 2 VEE Inverting Input 5 VCC 4 Inverting Input + − 3 Style 2 Pinout (SN2T1, SQ2T2) Style 1 Pinout (SN1T1) Figure 1. SOT−23−5 (NCS2200, NCS2202), SC70−5 (NCS2200, NCS2202) Output 1 VCC Non−Inverting Input 2 + − 3 5 6 VEE 5 Enable Inverting Input 4 Output 1 VEE Non−Inverting Input 2 Style 1 Pinout (SN1T1) + − 3 5 6 VCC 5 Enable Inverting Input 4 Style 2 Pinout (SN2T1) Figure 2. SOT−23−6 (NCS2201, NCS2203) VEE 1 6 VOUT VEE 1 6 VOUT VCC 2 5 VCC N/A 2 5 VCC IN− 3 4 IN+ IN− 3 4 IN+ Top View Top View Figure 3. DFN 2x2.2 (NCS2200) Figure 4. UDFN 1.2x1.0 (NCS2200A) http://onsemi.com 2 NCS2200 Series, NCS2200A MAXIMUM RATINGS Symbol Value Unit Supply Voltage Range (VCC to VEE) Rating VS 6.0 V Non−inverting/Inverting Input to VEE − −0.2 to (VCC + 0.2) V Operating Junction Temperature TJ 150 °C Operating Ambient Temperature TA −40 to +105 °C Storage Temperature Range Tstg −65 to +150 °C Output Short Circuit Duration Time (Note 1) tS Indefinite ESD Tolerance (Note 2) NCS2200/2201 Human Body Model Machine Model NCS2202/NCS2203 Human Body Model Machine Model NCS2200A Human Body Model Machine Model − s V 2000 200 1000 200 1900 200 Thermal Resistance, Junction−to−Ambient TSOP−5 DFN (Note 3) SC70−5 UDFN RqJA °C/W 238 215 283 350 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The maximum package power dissipation limit must not be exceeded. TJ(max) * TA PD + RqJA 2. ESD data available upon request. 3. For more information, refer to application note, AND8080/D. http://onsemi.com 3 NCS2200 Series, NCS2200A ELECTRICAL CHARACTERISTICS (For all values VCC = 0.85 V to 6.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 4) NCS2200 Series Characteristics Symbol Min Typ Max Unit VHYS 2.0 8.0 20 mV Input Hysteresis TA = 25°C Input Offset Voltage VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C VIO mV −10 −12 0.5 − +10 +12 −6.0 −8.0 0.5 − +6.0 +8.0 −5.0 −7.0 0.5 − +5.0 +7.0 Common Mode Voltage Range VCM − VEE to VCC − V Output Leakage Current (NCS2202/NCS2203) VCC = 6.0 V ILEAK − 3.3 − nA ISC − 70 − mA CMRR 53 65 − dB IIB − 1.0 − pA PSRR 45 55 − dB Output Short−Circuit Sourcing or Sinking (Vout = GND) Common Mode Rejection Ratio VCM = VCC Input Bias Current Power Supply Rejection Ratio DVS = 2.575 V Supply Current VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C ICC Output Voltage High (NCS2200/NCS2201) VCC = 0.85 V, Isource = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isource = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isource = 5.0 mA TA = 25°C TA = −40°C to 105°C VOH Output Voltage Low VCC = 0.85 V, Isink = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isink = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isink = 5.0 mA TA = 25°C TA = −40°C to 105°C VOL mA − 10 − 15 17 − 10 − 15 17 − 10 − 15 17 V VCC − 0.2 VCC − 0.225 VCC − 0.10 − − VCC − 0.2 VCC − 0.25 VCC − 0.12 − − VCC − 0.2 VCC − 0.25 VCC − 0.12 − − V − VEE + 0.10 − VEE + 0.2 VEE + 0.225 − VEE + 0.12 − VEE + 0.2 VEE + 0.25 − VEE + 0.12 − VEE + 0.2 VEE + 0.25 tPHL tPLH − − 0.7 1.1 − − Output Fall Time VCC = 6.0 V, CL = 50 pF tFALL − 20 − ns Output Rise Time VCC = 6.0 V, CL = 50 pF tRISE − 16 − ns tPU − 35 − ms ms Propagation Delay 20 mV Overdrive, CL = 15 pF Powerup Time 4. The limits over the extended temperature range are guaranteed by design only. http://onsemi.com 4 NCS2200 Series, NCS2200A ELECTRICAL CHARACTERISTICS (For all values VCC = 0.85 V to 6.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 5) NCS2200A Characteristics Symbol Min Typ Max Unit VHYS 2.0 4.5 20 mV Input Hysteresis TA = 25°C Input Offset Voltage VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C VIO Common Mode Voltage Range Output Short−Circuit Sourcing or Sinking (Vout = GND) Common Mode Rejection Ratio VCM = VCC Input Bias Current Power Supply Rejection Ratio DVS = 2.575 V mV −10 −12 0.5 − +10 +12 −6.0 −8.0 0.5 − +6.0 +8.0 −5.0 −7.0 0.5 − +5.0 +7.0 VCM − VEE to VCC − V ISC − 60 − mA CMRR 53 70 − dB IIB − 1.0 − pA PSRR 45 80 − dB Supply Current VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C ICC Output Voltage High VCC = 0.85 V, Isource = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isource = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isource = 5.0 mA TA = 25°C TA = −40°C to 105°C VOH Output Voltage Low VCC = 0.85 V, Isink = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isink = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isink = 5.0 mA TA = 25°C TA = −40°C to 105°C VOL mA − 7.5 − 15 17 − 8.0 − 15 17 − 9.0 − 15 17 V VCC − 0.25 VCC − 0.275 VCC − 0.10 − − VCC − 0.3 VCC − 0.35 VCC − 0.12 − − VCC − 0.3 VCC − 0.35 VCC − 0.12 − − V − VEE + 0.10 − VEE + 0.25 VEE + 0.275 − VEE + 0.12 − VEE + 0.3 VEE + 0.35 − VEE + 0.12 − VEE + 0.3 VEE + 0.35 tPHL tPLH − − 0.5 0.5 − − Output Fall Time VCC = 6.0 V, CL = 50 pF (Note 6) tFALL − 20 − ns Output Rise Time VCC = 6.0 V, CL = 50 pF (Note 6) tRISE − 16 − ns ms Propagation Delay 20 mV Overdrive, CL = 15 pF 5. The limits over the extended temperature range are guaranteed by design only. 6. Input signal: 1 kHz, squarewave signal with 10 ns edge rate. http://onsemi.com 5 NCS2200 Series, NCS2200A ENABLE FUNCTION ELECTRICAL CHARACTERISTICS (NCS2201/NCS2203 only) (For all values VCC = 6.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 7) Characteristics Enable Voltage Threshold Input Voltage Increasing, Device Enabled Input Voltage Decreasing, Device Disabled Symbol Min Typ Max Unit VEN(HIGH) VEN(LOW) − 2.0 3.2 2.2 4.0 − VENHYS − 1.0 − V IEN − 100 200 nA ICCD − 300 600 nA tEN(ON) tEN(OFF) − − 82 0.5 − − V Enable Hysteresis Enable Pullup Current Disable State Supply Current ms Enable Input to Output Propagation Delay Input Voltage Increasing, Device Enabled Input Voltage Decreasing, Device Disabled 7. The limits over the extended temperature range are guaranteed by design only. http://onsemi.com 6 NCS2200 Series, NCS2200A 1000 TA = 25°C VCC = 5.0 V ICC, SUPPLY CURRENT (mA) ICC, SUPPLY CURRENT (mA) 12 11 10 9.0 8.0 7.0 6.0 −50 0 −25 25 50 75 VCC = 2.7 V 10 0.1 10 1.0 100 TA, AMBIENT TEMPERATURE (°C) FREQUENCY (kHz) Figure 1. NCS2200 Series Supply Current versus Temperature Figure 2. NCS2200 Series Supply Current versus Output Transition Frequency 300 1000 VCC − VOH, OUTPUT VOLTAGE HIGH STATE (mV) ICC, SUPPLY CURRENT (mA) VCC = 5.0 V 1.0 0.01 100 12 10 8.0 6.0 4.0 TA = 85°C TA = 25°C 2.0 TA = −40°C 0 1.0 2.0 3.0 4.0 5.0 100 10 1.0 0.1 1.0 10 VCC, SUPPLY VOLTAGE (V) Isource, OUTPUT SOURCE CURRENT (mA) Figure 3. NCS2200 Series Supply Current versus Supply Voltage Figure 4. NCS2200/1 Output Voltage High State versus Output Source Current 1000 VCC = 5.0 V TA = 25°C 100 10 1.0 0.1 0.01 VCC = 5.0 V TA = 25°C 0.1 0.01 6.0 VOL, OUTPUT VOLTAGE LOW STATE (mV) 0 VOL, OUTPUT VOLTAGE LOW STATE (mV) 100 0.1 1.0 10 160 140 VCC = 5.0 V ILOAD = 4.0 mA 120 100 80 60 40 20 0 −100 −50 0 50 100 Isink, OUTPUT SINK CURRENT, (mA) TA, AMBIENT TEMPERATURE (°C) Figure 5. NCS2200 Series Output Voltage Low State versus Output Sink Current Figure 6. NCS2200 Series Output Voltage Low State versus Temperature http://onsemi.com 7 150 4.95 1.0 VCC = 5.0 V ILOAD = 4.0 mA 4.94 PROPAGATION DELAY (ms) VOH, OUTPUT VOLTAGE HIGH STATE (mV) NCS2200 Series, NCS2200A 4.93 4.92 4.91 4.90 4.89 4.88 −100 −50 0 50 100 0.8 tPLH 0.6 tPHL 0.4 0.2 VCC = 5.0 V Input Overdrive = 50 mV 0 −50 150 700 1.2 600 1.0 tLH 500 tHL 300 200 0 25 50 75 TA = 25°C Input Overdrive = 100 mV VCC = 2.7 V TA = 25°C 0.8 0.6 tPLH 0.4 tPHL 0.2 0 0 1.0 2.0 3.0 4.0 5.0 6.0 0 VCC, SUPPLY VOLTAGE (V) 50 100 150 Figure 10. NCS2200 Series Propagation Delay versus Input Overdrive 0.8 VCC = 5.0 V TA = 25°C 0.7 tPLH 0.6 VCC 2 V/Div 0.5 0.4 0.3 tPHL Output 0.2 0.1 Input Overdrive = 50 mV 0 0 50 100 200 INPUT OVERDRIVE (mV) Figure 9. NCS2200 Series Output Response Time versus Supply Voltage PROPAGATION DELAY (ms) 100 Figure 8. NCS2200 Series Propagation Delay versus Temperature PROPAGATION DELAY (ms) OUTPUT RESPONSE TIME (ns) Figure 7. NCS2200/1 Series Output Voltage High State versus Temperature 100 0 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) 400 −25 150 200 INPUT OVERDRIVE (mV) 10 ms/Div Figure 12. NCS2200 Series Powerup Delay Figure 11. NCS2200 Series Propagation Delay versus Input Overdrive http://onsemi.com 8 ICCD, DISABLE STATE SUPPLY CURRENT (mA) VCM, INPUT COMMON MODE VOLTAGE RANGE (V) NCS2200 Series, NCS2200A 3.0 TA = 25°C 2.0 1.0 0 −1.0 −2.0 −3.0 1.0 2.0 3.0 4.0 5.0 6.0 0.45 TA = 25°C 0.3 0.15 0 1.0 ILEAK, OUTPUT LEAKAGE CURRENT (nA) TA = 25°C 2.5 Device Enabled Output Active 2.0 1.5 Device Disabled Output Tri−State 1.0 0.5 0 0 1.0 2.0 3.0 4.0 4.0 5.0 6.0 Figure 14. NCS2201/3 Series Disable State Supply Current versus Supply Voltage 3.5 3.0 3.0 VCC, SUPPLY VOLTAGE (V) Figure 13. NCS2200 Series Input Common Mode Voltage Range versus Supply Voltage ENABLE INPUT VOLTAGE (V) 2.0 VS, SUPPLY VOLTAGE (V) 5.0 6.0 180 160 140 120 100 TA = 85°C 80 60 40 TA = 25°C 20 TA = −40°C 0 0 VCC, SUPPLY VOLTAGE (V) 1.0 2.0 3.0 4.0 5.0 6.0 7.0 VOUT, OUTPUT VOLTAGE (V) Figure 15. NCS2201/3 Enable Input Voltage versus Supply Voltage Figure 16. NCS2202/3 Output Leakage Current versus Output Voltage http://onsemi.com 9 8.0 NCS2200 Series, NCS2200A OPERATING DESCRIPTION The NCS2200 Series is an industry first sub−one volt, low power comparator family. This series is designed for rail−to−rail input and output performance. These devices consume only 10 mA of supply current while achieving a typical propagation delay of 1.1 ms at a 20 mV input overdrive. Figures 10 and 11 show propagation delay with various input overdrives. This comparator family is guaranteed to operate at a low voltage of 0.85 V up to 6.0 V. This is accomplished by the use of a modified analog CMOS process that implements depletion MOSFET devices. The common−mode input voltage range extends 0.1 V beyond the upper and lower rail without phase inversion or other adverse effects. This series is available in the SOT−23−5 and SOT−23−6 package. Additionally, the NCS2200 device is available in the tiny DFN 2x2.2 package and the SC70−5 package. NCS2200A is available in UDFN package. The SOT−23−6 features the enable function, which can be externally controlled. This feature allows significantly lower current consumption of 0.3 mA. This makes the devices suitable for implementation in power sensitive applications such as portable electronics. The enable function is active high when connected to the VCC pin. When the enable pin is driven low (device disabled), output tri−state mode is activated. The device will remain in this mode and will not respond to any changes at the inputs of the comparator. In order to pull the device out of tri−state mode, the enable upper voltage threshold must be met. Figure 15 shows the enable input voltage required to either enable or disable the device, with a variance in supply voltage. In addition, these devices have a typical internal hysteresis of "8.0 mV. This allows for greater noise immunity and clean output switching. Output Stage The NCS2200/1 has a complementary P and N Channel output stage that has capability of driving a rail−to−rail output swing with a load ranging up to 5.0 mA. It is designed such that shoot−through current is minimized while switching. This feature eliminates the need for bypass capacitors under most circumstances. The NCS2202/3 has an open drain N−channel output stage that can be pulled up to 6.0 V (max) with an external resistor. This facilitates mixed voltage system applications. VCC VCC IN (+) IN (+) Output Output IN (−) IN (−) VEE VEE Figure 17. NCS2200/1SNxT1/NCS2200A Complementary Output Configuration Figure 18. NCS2202/3SNxT1 Open Drain Output Configuration http://onsemi.com 10 NCS2200 Series, NCS2200A VCC Rx IN (−) NCS 2201 IN (+) Cx EN VO OUT R2 R1 The oscillation frequency can be programmed as follows: 1 f+1+ T 2.2 RxCx Figure 19. Schmitt Trigger Oscillator VCC 1M R1 100 pF t0 R2 1M IN (−) NCS 2201 IN (+) VCC EN VO OUT C1 R3 The resistor divider R1 and R2 can be used to set the magnitude of the input pulse. The pulse width is set by adjusting C1 and R3. Figure 20. One−Shot Multivibrator http://onsemi.com 11 t0 t1 0 NCS2200 Series, NCS2200A +5 V +3 V 100 k R pullup IN (−) NCS 2203 IN (+) 100 k EN +3 V Logic Output OUT +5 V Logic Input This circuit converts 5 V logic to 3 V logic. Using the NCS2202/3 allows for full 5 V logic swing without creating overvoltage on the 3 V logic input. Figure 21. Logic Level Translator VCC IN (−) NCS 2201 IN (+) EN OUT 100 mV Figure 22. Zero−Crossing Detector http://onsemi.com 12 NCS2200 Series, NCS2200A ORDERING INFORMATION Pinout Style Output Type Package Shipping † N/A Complementary UDFN (Pb−Free) 3000 / Tape & Reel NCS2200SN1T1 1 Complementary SOT−23−5 (TSOP−5) 3000 / Tape & Reel NCS2200SN1T1G 1 Complementary SOT−23−5 (TSOP−5) (Pb−Free) 3000 / Tape & Reel NCS2200SN2T1 2 Complementary SOT−23−5 (TSOP−5) 3000 / Tape & Reel NCS2200SN2T1G 2 Complementary SOT−23−5 (TSOP−5) (Pb−Free) 3000 / Tape & Reel NCS2200SQ2T2 2 Complementary SC70−5 3000 / Tape & Reel NCS2200SQ2T2G 2 Complementary SC70−5 (Pb−Free) 3000 / Tape & Reel NCS2200SQLT1 N/A Complementary DFN, 2x2.2 3000 / Tape & Reel NCS2200SQLT1G N/A Complementary DFN, 2x2.2 (Pb−Free) 3000 / Tape & Reel NCS2201SN1T1 1 Complementary, Enable SOT−23−6 (TSOP−6) 3000 / Tape & Reel NCS2201SN1T1G 1 Complementary, Enable SOT−23−6 (TSOP−6) (Pb−Free) 3000 / Tape & Reel NCS2201SN2T1 2 Complementary, Enable SOT−23−6 (TSOP−6) 3000 / Tape & Reel NCS2201SN2T1G 2 Complementary, Enable SOT−23−6 (TSOP−6) (Pb−Free) 3000 / Tape & Reel NCS2202SN1T1 1 Open Drain SOT−23−5 (TSOP−5) 3000 / Tape & Reel NCS2202SN1T1G 1 Open Drain SOT−23−5 (TSOP−5) (Pb−Free) 3000 / Tape & Reel NCS2202SQ1T2G 1 Open Drain SC70−5 (Pb−Free) 3000 / Tape & Reel NCS2202SN2T1 2 Open Drain SOT−23−5 (TSOP−5) 3000 / Tape & Reel NCS2202SN2T1G 2 Open Drain SOT−23−5 (TSOP−5) (Pb−Free) 3000 / Tape & Reel NCS2202SQ2T2G 2 Open Drain SC70−5 (Pb−Free) 3000 / Tape & Reel NCS2203SN1T1 1 Open Drain, Enable SOT−23−6 (TSOP−6) 3000 / Tape & Reel NCS2203SN1T1G 1 Open Drain, Enable SOT−23−6 (TSOP−6) (Pb−Free) 3000 / Tape & Reel NCS2203SN2T1 2 Open Drain, Enable SOT−23−6 (TSOP−6) 3000 / Tape & Reel NCS2203SN2T1G 2 Open Drain, Enable SOT−23−6 (TSOP−6) (Pb−Free) 3000 / Tape & Reel Device NCS2200AMUT1G This device contains 93 active transistors. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCS2200 Series, NCS2200A MARKING DIAGRAMS SOT−23−5 (TSOP−5) SN SUFFIX CASE 483 SOT−23−6 (TSOP−6) SN SUFFIX CASE 318G 6 5 CAx AYWG G CAxAYWG G 1 1 x = I for NCS2200SN1T1 J for NCS2200SN2T1 M for NCS2202SN1T1 N for NCS2202SN2T1 A = Assembly Location Y = Year W = Work Week G = Pb−Free Package x = K for NCS2201SN1T1 L for NCS2201SN2T1 O for NCS2203SN1T1 P for NCS2203SN2T1 A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) (Note: Microdot may be in either location) SC70−5 SQ SUFFIX CASE 419A DFN6 2x2.2 SQL SUFFIX CASE 488 5 1 CBx MG G CB MG G 1 CBx x = Specific Device Code = A for NCS2200SQ2T2 D for NCS2202SQ1T2G E for NCS2202SQ2T2G M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation, position, and underbar may vary depending upon manufacturing location. CB = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code overbar and underbar may vary depending upon manufacturing location. UDFN6 1.2x1.0 MU SUFFIX CASE 517AA 1 SM G (Top View) S M G = Specific Device Code = Date Code = Pb−Free Package http://onsemi.com 14 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS SOT−23−5 / TSOP−5 / SC59−5 SN SUFFIX PLASTIC PACKAGE CASE 483−02 ISSUE F NOTE 5 2X 0.10 T 2X 0.20 T NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 5 1 4 2 3 M B S K L DETAIL Z G A DIM A B C D G H J K L M S DETAIL Z J C 0.05 SEATING PLANE H T SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS SOT−23−6 / TSOP−6 / SC59−6 SN SUFFIX CASE 318G−02 ISSUE S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D 6 HE 1 5 4 2 3 E b DIM A A1 b c D E e L HE q e q c A 0.05 (0.002) L A1 MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 16 MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° NCS2200 Series, NCS2200A PACKAGE DIMENSIONS DFN6, 2x2.2 SQL SUFFIX CASE 488−03 ISSUE G D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG SIDE EDGE. 6. DETAILS A AND B SHOW OPTIONAL VIEWS FOR END OF TERMINAL LEAD AT EDGE OF PACKAGE AND SIDE EDGE OF PACKAGE. B A ÍÍÍ ÍÍÍ ÍÍÍ E PIN ONE REFERENCE 0.10 C 2X 0.10 C 2X DIM A A1 A3 b b1 D D2 E e L L1 TOP VIEW DETAIL B 0.10 C A3 A 6X 0.08 C A1 SIDE VIEW 0.10 C A 0.05 C C B b1 NOTE 3 SEATING PLANE 0.20 0.30 0.40 0.30 0.00 MILLIMETERS NOM MAX 0.90 1.00 0.03 0.05 0.20 REF 0.25 0.30 0.35 0.40 2.00 BSC 0.50 0.60 2.20 BSC 0.65 BSC 0.35 0.40 0.05 0.10 SOLDERING FOOTPRINT* 0.50 0.020 e 1 MIN 0.80 0.00 3 DETAIL A D2 6 6X 4 L 5X 0.10 C A BOTTOM VIEW 0.05 C EDGE OF PACKAGE B L1 A1 ÉÉ ÉÉ 1.9 0.075 0.65 0.025 SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 EXPOSED Cu MOLD CMPD DETAIL A Bottom View (Optional) 0.40 0.016 0.50 0.020 b 0.65 0.025 A3 DETAIL B Side View (Optional) http://onsemi.com 17 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS SC70−5/SC88A (SOT−353) SQ SUFFIX CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 18 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE A PIN ONE REFERENCE 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 A3 b D E e L L2 TOP VIEW 2X 0.10 C (A3) 0.10 C MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.00 BSC 1.20 BSC 0.40 BSC 0.30 0.40 0.40 0.50 A 10X 0.08 C SEATING PLANE SIDE VIEW A1 5X 1 MOUNTING FOOTPRINT* 6X C 6X 0.42 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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