MC74ACT241 Octal Buffer/Line Driver with 3−State Outputs The MC74ACT241 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter or receiver which provides improved PC board density. http://onsemi.com Features • 3−State Outputs Drive Bus Lines or Buffer Memory Address • • • MARKING DIAGRAMS Registers Outputs Source/Sink 24 mA TTL Compatible Inputs Pb−Free Packages are Available 20 1 VCC OE2 YA1 DB4 YA2 DB3 YA3 DB2 YA4 DB1 20 19 18 17 16 15 14 13 12 11 ACT241 AWLYYWWG SOIC−20W DW SUFFIX CASE 751D 1 20 1 2 3 4 5 6 7 8 9 10 OE1 DA1 YB4 DA2 YB3 DA3 YB2 DA4 YB1 GND ACT 241 ALYWG G 1 TSSOP−20 DT SUFFIX CASE 948E Figure 1. Pinout: 20−Lead Packages Conductors 1 (Top View) TRUTH TABLE Inputs OE1 D Outputs 20 (Pins 12, 14, 16, 18) L L L L H H H X Z 1 SOEIAJ−20 M SUFFIX CASE 967 H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) TRUTH TABLE Inputs 74ACT241 AWLYWWG Outputs OE2 D (Pins 3, 5, 7, 9) H L L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. H H H L X Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 5 1 Publication Order Number: MC74ACT241/D MC74ACT241 MAXIMUM RATINGS Symbol VCC Parameter DC Supply Voltage Value Unit *0.5 to )7.0 V VI DC Input Voltage *0.5 v VI v VCC )0.5 V VO DC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $100 mA TSTG Storage Temperature Range *65 to )150 _C 260 _C )150 _C TL Lead temperature, 1 mm from Case for 10 Seconds TJ Junction temperature under Bias qJA Thermal Resistance SOIC TSSOP 96 128 _C/W PD Power Dissipation in Still Air at 85_C SOIC TSSOP 500 450 mW MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage Latchup Performance UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 > 1000 V Above VCC and Below GND at 85_C (Note 5) $100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter Min DC Input Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Typ Max Unit 4.5 5.5 V 0 VCC V −40 25 +85 °C 0 0 10 8.0 10 8.0 ns/V Output Current − High − − −24 mA Output Current − Low − − 24 mA TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Note 7) IOH IOL VCC = 4.5 V VCC = 5.5 V 6. Unused Inputs may not be left open. All inputs must be tied to a high voltage level or low logic voltage level. 7. Vin from 0.8 V to 2.0 V; refer to individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74ACT241 DC CHARACTERISTICS TA = +255C VCC (V) Typ TA = −405C to +855C Guaranteed Limits Symbol Parameter VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V V IOUT = −50 mA 4.5 5.5 − 3.86 4.86 3.76 4.76 V V *VIN = VIL or VIH IOH 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 V V IOUT = 50 mA 4.5 5.5 − 0.36 0.36 0.44 0.44 V V *VIN = VIL or VIH IOL Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND Additional Maximum ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND IOLD IOHD †Minimum Dynamic Output Current 5.5 5.5 − − 75 −75 mA mA VOLD = 1.65 V Max VOHD = 3.85 V Min ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 mA VIN = VCC or GND VOL IIN DICCT IOZ Maximum Low Level Output Voltage Unit Conditions −24 mA −24 mA 24 mA 24 mA *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS tr = tf = 3.0 ns (For Figures and Waveforms, See Figures 2, 3, and 4.) Symbol Parameter TA = +255C CL = 50 pF TA = −405C to +855C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit tPLH Propagation Delay Data to Output 5.0 1.5 6.5 9.0 1.5 10.0 ns tPHL Propagation Delay Data to Output 5.0 1.5 7.0 9.0 1.5 10.0 ns tPZH Output Enable Time 5.0 1.5 6.0 9.0 1.0 10.0 ns tPZL Output Enable Time 5.0 1.5 7.0 10.0 1.5 11.0 ns tPHZ Output Disable Time 5.0 1.5 8.0 10.5 1.5 11.5 ns tPLZ Output Disable Time 5.0 2.0 7.0 10.5 1.5 11.5 ns *Voltage Range 5.0 V is 5.0 V ±0.5 V CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V http://onsemi.com 3 MC74ACT241 SWITCHING WAVEFORMS tr tf 3.0 V 50% INPUT DATA GND tw 1/fmax tPLH OUTPUT tPHL 50% Figure 2. 3.0 V OE1 1.3 V OE2 1.3 V GND 3.0 V GND tPZL tPLZ OUTPUT Y (12, 14, 16, 18) HIGH IMPEDANCE 1.3 V 10% VOL 90% VOH tPZH tPHZ OUTPUT Y (3, 5, 7, 9) 1.3 V HIGH IMPEDANCE Figure 3. 450 W INPUT OUTPUT DEVICE UNDER TEST 50 W SCOPE TEST POINT CL* *Includes all probe and jig capacitance Figure 4. Test Circuit http://onsemi.com 4 MC74ACT241 ORDERING INFORMATION Device Package MC74ACT241DW SOIC−20 MC74ACT241DWG SOIC−20 (Pb−Free) MC74ACT241DWR2 SOIC−20 MC74ACT241DWR2G SOIC−20 (Pb−Free) MC74ACT241DTR2 TSSOP−20* MC74ACT241DTR2G TSSOP−20* MC74ACT241MEL SOEIAJ−20 MC74ACT241MELG SOEIAJ−20 (Pb−Free) Shipping † 38 Units / Rail 1000 / Tape & Reel 2500 / Tape & Reel 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb−Free. http://onsemi.com 5 MC74ACT241 PACKAGE DIMENSIONS SOIC−20W DW SUFFIX CASE 751D−05 ISSUE G 20 11 X 45 _ h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q A B M D 18X e A1 SEATING PLANE C T http://onsemi.com 6 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74ACT241 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− L PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D H DETAIL E 0.100 (0.004) −T− SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 −−− −−− 0.047 C 1.20 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MC74ACT241 PACKAGE DIMENSIONS SOEIAJ−20 M SUFFIX CASE 967−01 ISSUE A 20 LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.81 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.032 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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