MC74AC240, MC74ACT240 Octal Buffer/Line Driver with 3−State Outputs The MC74AC240/74ACT240 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter or receiver which provides improved PC board density. http://onsemi.com Features • 3−State Outputs Drive Bus Lines or Buffer Memory Address • • • PDIP−20 N SUFFIX CASE 738 Registers Outputs Source/Sink 24 mA ′ACT240 Has TTL Compatible Inputs Pb−Free Packages are Available 1 SOIC−20W DW SUFFIX CASE 751D TRUTH TABLE Inputs Outputs OE1 D (Pins 12, 14, 16, 18) L L H L H X H L Z NOTE: 1 TSSOP−20 DT SUFFIX CASE 948E H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance 1 SOEIAJ−20 M SUFFIX CASE 967 TRUTH TABLE Inputs Outputs OE2 D (Pins 3, 5, 7, 9) L L H L H X H L Z NOTE: 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. VCC OE2 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 OE1 GND Figure 1. Pinout: 20−Lead Packages Conductors (Top View) © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 8 1 Publication Order Number: MC74AC240/D MC74AC240, MC74ACT240 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C IIN Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Unit V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC240, MC74ACT240 DC CHARACTERISTICS 74AC Symbol Parameter VCC (V) 74AC TA = +25°C Typ VIH VIL VOH VOL TA =−40°C to +85°C Unit Conditions Guaranteed Limits Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Low Level Output Voltage IOUT = −50 mA V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC240, MC74ACT240 AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) 74AC Symbol Parameter VCC* TA = +25°C (V) CL = 50 pF 74AC TA = −40°C to +85°C Unit CL = 50 pF Fig. No. Min Typ Max Min Max 1.5 1.5 6.0 4.5 8.0 6.5 1.0 1.0 9.0 7.0 ns 3−5 tPLH Propagation Delay Data to Output 3.3 5.0 tPHL Propagation Delay Data to Output 3.3 5.0 1.5 1.5 5.5 4.5 8.0 6.0 1.0 1.0 8.5 6.5 ns 3−5 tPZH Output Enable Time 3.3 5.0 1.5 1.5 6.0 5.0 10.5 7.0 1.0 1.0 11.0 8.0 ns 3−7 tPZL Output Enable Time 3.3 5.0 1.5 1.5 7.0 5.5 10.0 8.0 1.0 1.0 11.0 8.5 ns 3−8 tPHZ Output Disable Time 3.3 5.0 1.5 1.5 7.0 6.5 10.0 9.0 1.0 1.0 10.5 9.5 ns 3−7 tPLZ Output Disable Time 3.3 5.0 1.5 1.5 7.5 6.5 10.5 9.0 1.0 1.0 11.5 9.5 ns 3−8 * Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND VOL IIN DICCT IOZ IOLD IOHD ICC Maximum Low Level Output Voltage †Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 4 V V IOUT = −50 mA *VIN = VIL or VIH IOH −24 mA −24 mA IOUT = 50 mA MC74AC240, MC74ACT240 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* Parameter (V) 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Data to Output 5.0 1.5 6.0 8.5 1.5 9.5 ns 3−5 tPHL Propagation Delay Data to Output 5.0 1.5 5.5 7.5 1.5 8.5 ns 3−5 tPZH Output Enable Time 5.0 1.5 7.0 8.5 1.0 9.5 ns 3−7 tPZL Output Enable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−8 tPHZ Output Disable Time 5.0 2.0 8.0 9.5 2.0 10.5 ns 3−7 tPLZ Output Disable Time 5.0 2.5 6.5 10.0 2.0 10.5 ns 3−8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Value Parameter Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V http://onsemi.com 5 MC74AC240, MC74ACT240 ORDERING INFORMATION Device Package MC74AC240N PDIP−20 MC74AC240NG PDIP−20 (Pb−Free) MC74ACT240N PDIP−20 MC74ACT240NG PDIP−20 (Pb−Free) MC74AC240DW SOIC−20 MC74AC240DWG SOIC−20 (Pb−Free) MC74AC240DWR2 SOIC−20 MC74AC240DWR2G SOIC−20 (Pb−Free) MC74ACT240DW SOIC−20 MC74ACT240DWG SOIC−20 (Pb−Free) MC74ACT240DWR2 SOIC−20 MC74ACT240DWR2G SOIC−20 (Pb−Free) MC74AC240DTR2 TSSOP−20* MC74AC240DTR2G TSSOP−20* MC74ACT240DTR2 TSSOP−20* MC74ACT240DTR2G TSSOP−20* MC74AC240MEL SOEIAJ−20 MC74AC240MELG SOEIAJ−20 (Pb−Free) MC74ACT240MEL SOEIAJ−20 MC74ACT240MELG SOEIAJ−20 (Pb−Free) Shipping † 18 Units / Rail 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel 2500 / Tape & Reel 2000 / Tape & Reel 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb−Free. http://onsemi.com 6 MC74AC240, MC74ACT240 MARKING DIAGRAMS PDIP−20 SOIC−20W TSSOP−20 20 20 20 20 AC 240 ALYWG G AC240 AWLYYWWG MC74AC240N AWLYYWWG SOEIAJ−20 1 74AC240 AWLYWWG 1 1 1 20 20 20 20 ACT 240 ALYWG G ACT240 AWLYYWWG MC74ACT240N AWLYYWWG 1 1 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) http://onsemi.com 7 74ACT240 AWLYWWG 1 MC74AC240, MC74ACT240 PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. −A− 20 11 1 10 B L C −T− K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 M SOIC−20W DW SUFFIX CASE 751D−05 ISSUE G 20 11 X 45 _ h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q A B M D 18X e A1 SEATING PLANE C T http://onsemi.com 8 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74AC240, MC74ACT240 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− L PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D H DETAIL E 0.100 (0.004) −T− SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 −−− −−− 0.047 C 1.20 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MC74AC240, MC74ACT240 PACKAGE DIMENSIONS SOEIAJ−20 M SUFFIX CASE 967−01 ISSUE A 20 LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.81 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.032 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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