SN74LS86 Quad 2-Input Exclusive OR Gate VCC 14 13 12 11 10 9 8 http://onsemi.com LOW POWER SCHOTTKY 1 2 3 4 5 6 7 GND TRUTH TABLE IN 14 OUT A B Z L L H H L H L H L H H L 1 PLASTIC N SUFFIX CASE 646 14 1 SOIC D SUFFIX CASE 751A GUARANTEED OPERATING RANGES Symbol VCC Parameter Supply Voltage Min Typ Max Unit 4.75 5.0 5.25 V 0 25 70 °C TA Operating Ambient Temperature Range IOH Output Current – High –0.4 mA IOL Output Current – Low 8.0 mA 14 1 SOEIAJ M SUFFIX CASE 965 ORDERING INFORMATION Device Package Shipping SN74LS86N 14 Pin DIP 2000 Units/Box SN74LS86D SOIC–14 55 Units/Rail SN74LS86DR2 SOIC–14 2500/Tape & Reel SN74LS86M SOEIAJ–14 See Note 1 SN74LS86MEL SOEIAJ–14 See Note 1 1. For ordering information on the EIAJ version of the SOIC package, please contact your local ON Semiconductor representative. Semiconductor Components Industries, LLC, 2001 October, 2001 – Rev. 7 1 Publication Order Number: SN74LS86/D SN74LS86 DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol Parameter VIH Input HIGH Voltage VIL Input LOW Voltage VIK Input Clamp Diode Voltage VOH Output HIGH Voltage VOL Output LOW Voltage IIH Input HIGH Current IIL Input LOW Current IOS Short Circuit Current (Note 2) Min Typ Max 2.0 0.8 –0.65 2.7 –1.5 3.5 Unit Test Conditions V Guaranteed Input HIGH Voltage for All Inputs V Guaranteed Input LOW Voltage for All Inputs V VCC = MIN, IIN = –18 mA V VCC = MIN, IOH = MAX, VIN = VIH or VIL per Truth Table VCC = VCC MIN, VIN = VIL or VIH per Truth Table 0.25 0.4 V IOL = 4.0 mA 0.35 0.5 V IOL = 8.0 mA 40 µA VCC = MAX, VIN = 2.7 V 0.2 mA VCC = MAX, VIN = 7.0 V –0.8 mA VCC = MAX, VIN = 0.4 V –100 mA VCC = MAX ICC Power Supply Current 10 2. Not more than one output should be shorted at a time, nor for more than 1 second. mA VCC = MAX –20 AC CHARACTERISTICS (TA = 25°C) Limits Typ Max Unit tPLH tPHL Propagation Delay, Other Input LOW 12 10 23 17 ns tPLH tPHL Propagation Delay, Other Input HIGH 20 13 30 22 ns Symbol Parameter Min http://onsemi.com 2 Test Conditions VCC = 5.0 V CL = 15 pF SN74LS86 PACKAGE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 646–06 ISSUE M 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. 8 B 1 7 A F DIM A B C D F G H J K L M N L N C –T– SEATING PLANE J K H D 14 PL G M 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 8 –B– 1 P 7 PL 0.25 (0.010) 7 G M B M F R X 45 C –T– SEATING PLANE D 14 PL 0.25 (0.010) M T B J M K S A MILLIMETERS MIN MAX 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --10 0.38 1.01 M D SUFFIX PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F 14 INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --10 0.015 0.039 S http://onsemi.com 3 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 SN74LS86 PACKAGE DIMENSIONS M SUFFIX SOEIAJ PACKAGE CASE 965–01 ISSUE O 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE M L 7 1 DETAIL P Z D VIEW P A e c A1 b 0.13 (0.005) M 0.10 (0.004) DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.056 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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