FS6370 EEPROM Programmable 3-PLL Clock Generator IC 1.0 Features • • • • • • • • • Just-in-time customization of clock frequencies via internal non-volatile 128-bit serial EEPROM I2C™-bus serial interface Three on-chip PLLs with programmable reference and feedback dividers Four independently programmable muxes and post dividers Programmable power-down of all PLLs and output clock drivers Tristate outputs for board testing One PLL and two mux/post-divider combinations can be modified via SEL_CD input 5 V to 3.3 V operation Accepts 5 MHz to 27 MHz crystal resonators 2.0 Description The FS6370 is a CMOS clock generator IC designed to minimize cost and component count in a variety of electronic systems. Three EEPROM-programmable phase-locked loops (PLLs) driving four programmable muxes and post dividers provide a high degree of flexibility. An internal EEPROM permits just-in-time factory programming of devices for end user requirements. Figure 1: Pin Configuration ©2008 SCILLC. All rights reserved. May 2008 – Rev. 3 Publication Order Number: FS6370/D FS6370 Figure 2: Block Diagram Table 1: Pin Descriptions Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type P U DI U DI P AI AO U DI O P U DI DO P DO DO P DO P Name VSS SEL_CD PD/SCL VSS XIN XOUT OE/SDA VDD MODE CLK_D VSS CLK_C CLK_B VDD CLK_A VDD Description Ground Selects one of two programmed PLL C, Mux C/D and post divider C/D combinations Power-down input (run-mode) or serial interface clock input (program mode) Ground Crystal oscillator feedback Crystal oscillator drive Output enable input (run mode) or serial interface data input/output (program mode) Power supply (5 V to 3.3 V) Selects either program mode (low) or run mode (high) D clock output Ground C clock output B clock output Power supply (5 V to 3.3 V) A clock output Power supply (5 V to 3.3 V) Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = ThreeLevel Digital Input, DO = Digital Output; P = Power/Ground; # = Active Low pin Rev. 3 | Page 2 of 28 | www.onsemi.com FS6370 3.0 Functional Block Description 3.1 Phase Locked Loops (PLLs) Each of the three on-chip PLLs is a standard phase- and frequency-locked loop architecture that multiplies a reference frequency to a desired frequency by a ratio of integers. This frequency multiplication is exact. As shown in Figure 3, each PLL consists of a reference divider, a phase-frequency detector (PFD), a charge pump, an internal loop filter, a voltage-controlled oscillator (VCO), and a feedback divider. During operation, the reference frequency (fREF), generated by the on-board crystal oscillator, is first reduced by the reference divider. The divider value is often referred to as the modulus, and is denoted as NR for the reference divider. The divided reference is fed into the PFD. The PFD controls the frequency of the VCO (fVCO) through the charge pump and loop filter. The VCO provides a high-speed, low noise, continuously variable frequency clock source for the PLL. The output of the VCO is fed back to the PFD through the feedback divider (the modulus is denoted by NF) to close the loop. Figure 3: PLL Block Diagram The PFD will drive the VCO up or down in frequency until the divided reference frequency and the divided VCO frequency appearing at the inputs of the PFD are equal. The input/output relationship between the reference frequency and the VCO frequency is: 3.1.1. Reference Divider The reference divider is designed for low phase jitter. The divider accepts the output of the reference oscillator and provides a divideddown frequency to the PFD. The reference divider is an 8-bit divider, and can be programmed for any modulus from 1 to 255 by programming the equivalent binary value. A divide-by-256 can also be achieved by programming the eight bits to 00h. 3.1.2. Feedback Divider The feedback divider is based on a dual-modulus pre-scaler technique. The technique allows the same granularity as a fully programmable feedback divider, while still allowing the programmable portion to operate at low speed. A high-speed pre-divider (also called a pre-scaler) is placed between the VCO and the programmable feedback divider because of the high speeds at which the VCO can operate. The dual-modulus technique insures reliable operation at any speed that the VCO can achieve and reduces the overall power consumption of the divider. For example, a fixed divide-by-eight pre-scaler could have been used in the feedback divider. Unfortunately, a divide-by-eight would limit the effective modulus of the entire feedback divider to multiples of eight. This limitation would restrict the ability of the PLL to Rev. 3 | Page 3 of 28 | www.onsemi.com FS6370 achieve a desired input-frequency-to-output-frequency ratio without making both the reference and feedback divider values comparatively large. Generally, very large values are undesirable as they degrade the bandwidth of the PLL, increasing phase jitter and acquisition time. To understand the operation of the feedback divider, refer to Figure 4. The M-counter (with a modulus always equal to M) is cascaded with the dual-modulus pre-scaler. The A-counter controls the modulus of the pres-caler. If the value programmed into the A-counter is A, the pre-scaler will be set to divide by N+1 for A pre-scaler outputs. Thereafter, the prescaler divides by N until the M-counter output resets the A-counter, and the cycle begins again. Note that N=8, and A and M are binary numbers. Figure 4: Feedback Divider Suppose that the A-counter is programmed to zero. The modulus of the pre-scaler will always be fixed at N; and the entire modulus of the feedback divider becomes MxN. Next, suppose that the A-counter is programmed to a one. This causes the pre-scaler to switch to a divide-by-N+1 for its first divide cycle and then revert to a divide-by-N. In effect, the A-counter absorbs (or "swallows") one extra clock during the entire cycle of the feedback divider. The overall modulus is now seen to be equal to MxN+1. This example can be extended to show that the feedback divider modulus is equal to MxN+A, where A<M. 3.1.3. Feedback Divider Programming For proper operation of the feedback divider, the A-counter must be programmed only for values that are less than or equal to the Mcounter. Therefore, not all divider moduli below 56 are available for use. This is shown in Table 2. Above a modulus of 56, the feedback divider can be programmed to any value up to 2047. Table 2: Feedback Divider Modulus Under 56 M-Counter: FBKDIV[10:3] 000 001 00000001 8 9 00000010 16 17 00000011 24 25 00000100 32 33 00000101 40 41 00000110 48 49 00000111 56 57 010 18 26 34 42 50 58 A-Counter: FBKDIV[2:0] 011 100 27 35 36 43 44 51 52 59 60 Feedback Divider Modulus 101 45 53 61 110 54 62 111 63 3.2 Post Divider Muxes As shown in Figure 2, a mux in front of each post divider stage can select from any one of the three PLL frequencies or the reference frequency. The mux selection is controlled by bits in the EEPROM or the control registers. The input frequency on two of the four multiplexers (muxes C and D in Figure 2) can be altered without reprogramming by a logic-level input on the SEL_CD pin. Rev. 3 | Page 4 of 28 | www.onsemi.com FS6370 3.3 Post Dividers A post divider performs several useful functions. First, it allows the VCO to be operated in a narrower range of speeds compared to the variety of output clock speeds that the device is required to generate. Second, it changes the basic PLL equation to: where NP is the post divider modulus. The extra integer in the denominator permits more flexibility in the programming of the loop for many applications where frequencies must be achieved exactly. The modulus on two of the four post dividers (post dividers C and D in Figure 2) can be altered without reprogramming by a logic level on the SEL_CD pin. 4.0 Device Operation The FS6370 has two modes of operation: • Program mode: during which either the EEPROM or the FS6370 control registers can be programmed directly with the desired PLL settings • Run mode: where the PLL settings stored the EEPROM are transferred to the FS6370 control registers on power-up, and the device then operates based on those settings Note that the EEPROM locations are not physically the same registers used to control the FS6370. Direct access to either the EEPROM or the FS6370 control registers is achieved in program mode. The EEPROM register contents are automatically transferred to the FS6370 control registers in normal device operation (run mode). 4.1 MODE Pin The MODE pin controls the mode of operation. A logic-low places the FS6370 in program mode. A logic-high puts the device in run mode. A pull-up on this pin defaults the device into run mode. Reprogramming of either the control registers or the EEPROM is permitted at any time if the MODE pin is a logic-low. Note, however, that a logic-high state on the MODE pin is latched so that only one transfer of EEPROM data to the FS6370 control registers can occur. If a second transfer of EEPROM data into the FS6370 is desired, power (VDD) must be removed and reapplied to the device. The MODE pin also controls the function of the PD/SCL and OE/SDA pins. In run mode, these two pins function as power-down (PD) and output enable (OE) controls. In program mode, the pins function as the I2C interface for clock (SCL) and data (SDA). 4.2 SEL_CD Pin The SEL_CD pin provides a way to alter the operation of PLL C, muxes C and D, and post dividers C and D without having to reprogram the device. A logic-low on the SEL_CD pin selects the control bits with a "C1" or "D1" notation, per Table 3. A logic-high on the SEL_CD pin selects the control bits with "C2" or "D2" notation, per Table 3. Note that changing between two running frequencies using the SEL_CD pin may produce glitches in the output, especially if the postdivider(s) is/are altered. 4.3 Oscillator Overdrive For applications where an external reference clock is provided (and the crystal oscillator is not required), the reference clock should be connected to XOUT and XIN must be left unconnected (float). Rev. 3 | Page 5 of 28 | www.onsemi.com FS6370 For best results, make sure the reference clock signal is as jitter-free as possible, can drive a 40 pF load with fast rise and fall times, and can swing rail-to-rail. If the reference clock is not a rail-to-rail signal, the reference must be AC coupled to XOUT through a 0.01 µF or 0.1 µF capacitor. A minimum 1 V peak-to-peak signal is required to drive the internal differential oscillator buffer. 5.0 Run Mode If the MODE pin is set to a logic-high, the device enters the run mode. The high state is latched (see MODE pin). The FS6370 then copies the stored EEPROM data into its control registers and begins normal operation based on that data when the self-load is complete. The self-load process takes about 89,000 clocks of the crystal oscillator. During the self-load time, all clock outputs are held low. At a reference frequency of 27 MHz, the self-load takes about 3.3ms to complete. If the EEPROM is empty (all zeros), the crystal reference frequency provides the clock for all four outputs. No external programming access to the FS6370 is possible in run mode. The dual-function PD/SCL and OE/SDA pins become a power-down (PD) and output enable (OE) control, respectively. 5.1 Power-Down and Output Enable A logic-high on the PD/SCL pin powers down only those portions of the FS6370 which have their respective power-down control bits enabled. Note that the PD/SCL pin has an internal pull-up. When a post divider is powered down, the associated output driver is forced low. When all PLLs and post dividers are powered down the crystal oscillator is also powered down. The XIN pin is forced low, and the XOUT pin is pulled high. A logic-low on the OE/SDA pin tristates all output clocks. Note that this pin has an internal pull-up. 6.0 Program Mode If the MODE pin is logic-low, the device enters the program mode. All internal registers are cleared to zero, delivering the crystal frequency to all outputs. The device allows programming of either the internal 128-bit EEPROM or the on-chip control registers via I2C control over the PD/SCL and OE/SDA pins. The EEPROM and the FS6370 act as two separate parallel devices on the same on-chip I2C-bus. Choosing either the EEPROM or the device control registers is done via the I2C device address. The dual-function PD/SCL and OE/SDA pins become the serial data I/O (SDA) and serial clock input (SCL) for normal I2C communications. Note that power-down and output enable control via the PD/SCL and OE/SDA pins is not available. 6.1 EEPROM Programming Data must be loaded into the EEPROM in a most-significant-bit (MSB) to least-significant-bit (LSB) order. The register map of the EEPROM is noted in Table 3. The device address of the EEPROM is: A6 1 A5 0 A4 1 A3 0 A2 X A1 X A0 X 6.1.1. Write Operation The EEPROM can only be written to with the random register write procedure (see Section 8.2.2). The procedure consists of the device address, the register address, a R/W bit, and one byte of data. Following the STOP condition, the EEPROM initiates its internally timed 4ms write cycle, and commits the data byte to memory. No acknowledge signals are generated during the EEPROM internal write cycle. Rev. 3 | Page 6 of 28 | www.onsemi.com FS6370 If a stop bit is transmitted before the entire write command sequence is complete, then the command is aborted and no data is written to memory. If more than eight bits are transmitted before the stop bit is sent, then the EEPROM will clear the previously loaded data byte and will begin loading the data buffer again. 6.1.2. Acknowledge Polling The EEPROM does not acknowledge while it internally commits data to memory. This feature can be used to increase data throughput by determining when the internal write cycle is complete. The process is to initiate the random register write procedure with a START condition, the EEPROM device address, and the write command bit (R/W=0). If the EEPROM has completed its internal 4 ms write cycle, the EEPROM will acknowledge on the next clock, and the write command can continue. If the EEPROM has not completed the internal 4 ms write cycle, the random register write procedure must be restarted by sending the START condition, device address and R/W bit. This sequence must be repeated until the EEPROM acknowledges. 6.1.3. Read Operation The EEPROM supports both the random register read procedure and the sequential register read procedure (both are outlined in Section 6). For sequential read operations, the EEPROM has an internal address pointer that increments by one at the end of each read operation. The pointer directs the EEPROM to transmit the next sequentially addressed data byte, allowing the entire memory contents to be read in one operation. 6.2 Direct Register Programming The FS6370 control registers may be directly accessed by simply using the FS6370 device address in the read or write operations. The operation of the device will follow the register values. The register map of the FS6370 is identical to that of the EEPROM shown in Table 3. The FS6370 supports the random read and write procedures, as well as the sequential read and write procedures described in Section 8. The device address for the FS6370 is: A6 1 A5 0 A4 1 A3 1 A2 1 A1 0 A0 0 7.0 Cost Reduction Migration Path The FS6370 is compatible with the programmable register-based FS6377 or a fixed-frequency ROM-based clock generator. Attention should be paid to the board layout if a migration path to either of these devices is desired. 7.1 Programming Migration Path If the design can support I2C programming overhead, a cost reduction from the EEPROM-based FS6370 to the register-based FS6377 is possible. Figure 5 shows the five pins that may not be compatible between the various devices if programming of the FS6370 or the FS6377 is desired. Rev. 3 | Page 7 of 28 | www.onsemi.com FS6370 Figure 5: FS6370 to FS6377 7.2 Non-Programming Migration Path If the design has solidified on a particular EEPROM programming pattern, the EEPROM pattern can be hard-coded into a ROM-based device. For high-volume requirements, a ROM-based device offers significant cost savings over the FS6370. Contact an ON Semiconductor sales representative for more detail. 8.0 I2C-bus Control Interface This device is a read/write slave device meeting all Philips I2C-bus specifications except a "general call." The bus has to be controlled by a master device that generates the serial clock SCL, controls bus access and generates the START and STOP conditions while the device works as a slave. Both master and slave can operate as a transmitter or receiver, but the master device determines which mode is activated. A device that sends data onto the bus is defined as the transmitter, and a device receiving data as the receiver. I2C-bus logic levels noted herein are based on a percentage of the power supply (VDD). A logic-one corresponds to a nominal voltage of VDD, while a logic-low corresponds to ground (VSS). 8.1 Bus Conditions Data transfer on the bus can only be initiated when the bus is not busy. During the data transfer, the data line (SDA) must remain stable whenever the clock line (SCL) is high. Changes in the data line while the clock line is high will be interpreted by the device as a START or STOP condition. The following bus conditions are defined by the I2C-bus protocol. 8.1.1. Not Busy Both the data (SDA) and clock (SCL) lines remain high to indicate the bus is not busy. 8.1.2. START Data Transfer A high to low transition of the SDA line while the SCL input is high indicates a START condition. All commands to the device must be preceded by a START condition. Rev. 3 | Page 8 of 28 | www.onsemi.com FS6370 8.1.3. STOP Data Transfer A low to high transition of the SDA line while SCL is held high indicates a STOP condition. All commands to the device must be followed by a STOP condition. 8.1.4. Data Valid The state of the SDA line represents valid data if the SDA line is stable for the duration of the high period of the SCL line after a START condition occurs. The data on the SDA line must be changed only during the low period of the SCL signal. There is one clock pulse per data bit. Each data transfer is initiated by a START condition and terminated with a STOP condition. The number of data bytes transferred between START and STOP conditions is determined by the master device, and can continue indefinitely. However, data that is overwritten to the device after the first 16 bytes will overflow into the first register, then the second, and so on, in a first-in, firstoverwritten fashion. 8.1.5. Acknowledge When addressed, the receiving device is required to generate an acknowledge after each byte is received. The master device must generate an extra clock pulse to coincide with the acknowledge bit. The acknowledging device must pull the SDA line low during the high period of the master acknowledge clock pulse. Setup and hold times must be taken into account. The master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been read (clocked) out of the slave. In this case, the slave must leave the SDA line high to enable the master to generate a STOP condition. 8.2 I2C-bus Operation All programmable registers can be accessed randomly or sequentially via this bi-directional two wire digital interface. The device accepts the following I2C-bus commands. 8.2.1. Device Address After generating a START condition, the bus master broadcasts a seven-bit device address followed by a R/W bit. The device address of the FS6370 is: A6 1 A5 0 A4 1 A3 1 A2 1 A1 0 A0 0 Any one of eight possible addresses are available for the EEPROM. The least significant three bits are don’t care’s. A6 1 A5 0 A4 1 A3 0 A2 X A1 X A0 X 8.2.2. Random Register Write Procedure Random write operations allow the master to directly write to any register. To initiate a write procedure, the R/W bit that is transmitted after the seven-bit device address is a logic-low. This indicates to the addressed slave device that a register address will follow after the slave device acknowledges its device address. The register address is written into the slave's address pointer. Following an acknowledge by the slave, the master is allowed to write eight bits of data into the addressed register. A final acknowledge is returned by the device, and the master generates a STOP condition. If either a STOP or a repeated START condition occurs during a register write, the data that has been transferred is ignored. 8.2.3. Random Register Read Procedure Random read operations allow the master to directly read from any register. To perform a read procedure, the R/W bit that is transmitted after the seven-bit address is a logic-low, as in the register write procedure. This indicates to the addressed slave device that a register address will follow after the slave device acknowledges its device address. The register address is then written into the slave's address pointer. Rev. 3 | Page 9 of 28 | www.onsemi.com FS6370 Following an acknowledge by the slave, the master generates a repeated START condition. The repeated START terminates the write procedure, but not until after the slave's address pointer is set. The slave address is then resent, with the R/W bit set this time to a logic-high, indicating to the slave that data will be read. The slave will acknowledge the device address, and then transmits the eight-bit word. The master does not acknowledge the transfer but does generate a STOP condition. 8.2.4. Sequential Register Write Procedure Sequential write operations allow the master to write to each register in order. The register pointer is automatically incremented after each write. This procedure is more efficient than the random register write if several registers must be written. To initiate a write procedure, the R/W bit that is transmitted after the seven-bit device address is a logic-low. This indicates to the addressed slave device that a register address will follow after the slave device acknowledges its device address. The register address is written into the slave's address pointer. Following an acknowledge by the slave, the master is allowed to write up to 16 bytes of data into the addressed register before the register address pointer overflows back to the beginning address. An acknowledge by the device between each byte of data must occur before the next data byte is sent. Registers are updated every time the device sends an acknowledge to the host. The register update does not wait for the STOP condition to occur. Registers are therefore updated at different times during a sequential register write. 8.2.5. Sequential Register Read Procedure Sequential read operations allow the master to read from each register in order. The register pointer is automatically incremented by one after each read. This procedure is more efficient than the random register read if several registers must be read. To perform a read procedure, the R/W bit that is transmitted after the seven-bit address is a logic-low, as in the register write procedure. This indicates to the addressed slave device that a register address will follow after the slave device acknowledges its device address. The register address is then written into the slave's address pointer. Following an acknowledge by the slave, the master generates a repeated START condition. The repeated START terminates the write procedure, but not until after the slave's address pointer is set. The slave address is then resent, with the R/W bit set this time to a logic-high, indicating to the slave that data will be read. The slave will acknowledge the device address, and then transmits all 16 bytes of data starting with the initial addressed register. The register address pointer will overflow if the initial register address is larger than zero. After the last byte of data, the master does not acknowledge the transfer but does generate a STOP condition. Rev. 3 | Page 10 of 28 | www.onsemi.com FS6370 Figure 6: Random Register Write Procedure Figure 7: Random Register Read Procedure Figure 8: Sequential Register Write Procedure Figure 9: Sequential Register Read Procedure Rev. 3 | Page 11 of 28 | www.onsemi.com FS6370 9.0 Programming Information Table 3: Register Map (Note: All register bits are cleared to zero on power-up) Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Byte 15 MUX_D2[1:0] MUX_C2[1:0] PDPOST_D (selected via SEL_CD = 1) (selected via SEL_CD = 1) Byte 14 POST_D2[3:0] (selected via SEL_CD = 1) Byte 13 POST_D1[3:0] (selected via SEL_CD = 0) Byte 12 POST_B[3:0] Byte 11 MUX_D1[1:0] Reserved (0) LFTC_C2 CP_C2 (selected via SEL_CD = 0) (SEL_CD=1) (SEL_CD=1) Byte 10 FBKDIV_C2[7:3] M-Counter (selected via SEL_CD pin = 1) Byte 9 REFDIV_C2[7:0] (selected via SEL_CD pin = 1) Byte 8 MUX_C1[1:0] PDPLL_C LFTC_C1 CP_C1 (selected via SEL_CD = 0) (SEL_CD=0) (SEL_CD=0) Byte 7 FBKDIV_C1[7:3] M-Counter (selected via SEL_CD = 0 Byte 6 REFDIV_C1[7:0] (selected via SEL_CD = 0) Byte 5 MUX_B[1:0] PDPLL_B LFTC_B CP_B Byte 4 FBKDIV_B[7:3] M-Counter Byte 3 REFDIV_B[7:0] Byte 2 MUX_A[1:0] PDPLL_A LFTC_A CP_A Byte 1 FBKDIV_A[7:3] M-Counter Byte 0 REFDIV_A[7:0] Bit 2 PDPOST_C Bit 1 PDPOST_B Bit 0 PDPOST_A POST_C2[3:0] (selected via SEL_CD = 1) POST_C1[3:0] (selected via SEL_CD = 0) POST_A[3:0] FBKDIV_C2[10:8] M-Counter (selected via SEL_CD pin = 1) FBKDIV_C2[2:0] A-Counter (selected via SEL_CD pin = 1) FBKDIV_C1[10:8] M-Counter (selected via SEL_CD = 0) FBKDIV_C1[2:0] A-Counter (selected via SEL_CD = 1) FBKDIV_B[10:8] M-Counter FBKDIV_B[2:0] A-Counter FBKDIV_A[10:8] M-Counter FBKDIV_A[2:0] A-Counter 9.1 Control Bit Assignments If any PLL control bit is altered during device operation, including those bits controlling the reference and feedback dividers, the output frequency will slew smoothly (in a glitch-free manner) to the new frequency. The slew rate is related to the programmed loop filter time constant. However, any programming changes to any mux or post divider control bits will cause a glitch on an operating clock output. 9.1.1. Power-Down All power-down functions are controlled by enable bits. That is, the bits select which portions of the FS6370 to power-down when the PD input is asserted. If the power-down bit contains a one, the related circuit will shut down if the PD pin is high (run mode only). When the PD pin is low, power is enabled to all circuits. If the power-down bit contains a zero, the related circuit will continue to function regardless of the PD pin state. Rev. 3 | Page 12 of 28 | www.onsemi.com FS6370 Table 4: Power-Down Bits Name PDPLL_A (Bit 21) PDPLL_B (Bit 45) PDPLL_C (Bit 69) Description Power-Down PLL A Bit = 0 Bit = 1 Power-Down PLL B Bit = 0 Bit = 1 Power-Doan PLL C Bit = 0 Bit = 1 Power on Power off Power on Power off Power on Power off Reserved (0) (Bit 69) PDPOST_A (Bit 120) PDPOST_B (Bit 121) PDPOSTC (Bit 122) PDPOSTD (Bit 123) Power-Down POST Divider A Bit = 0 Bit = 1 Power-Down POST Divider B Bit = 0 Bit = 1 Power-Down POST Divider C Bit = 0 Bit = 1 Power-Down POST Divider D Bit = 0 Bit = 1 Power on Power off Power on Power off Power on Power off Power on Power off Table 5: Divider Control Bits Name REFDIV_A[7:0] (Bits 7-0) REFDIV_B[7:0] (Bits 31-24) REFDIV_C1[7:0] (Bits 55-48) REFDIV_C2[7:0] (Bits 79-72) FBKDIV_A[10:0] (Bits 18-8) FBKDIV_B[10:0] (Bits 42-32) FBKDIV_C1[10:0] (Bits 66-56) FBKDIV_C2[10:0] (Bits 90-80) Description Reference Divider A (NR) Reference Divider B (NR) Reference Divider C1 (NR) selected when the SEL-CD pin = 0 Reference Divider C2 (NR) selected when the SEL-CD pin = 1 Feedback Divider A (NF) FBKDIV_A[2:0] FBKDIV_A[10:3] Feedback Divider B (NF) FBKDIV_B[2:0] FBKDIV_B[10:3] Feedback Divider C1 (NF) selected when the SEL-CD pin = 0 FBKDIV_C1[2:0] FBKDIV_C1[10:3] Feedback Divider C2 (NF) selected when the SEL-CD pin = 1 FBKDIV_C2[2:0] FBKDIV_C2[10:3] Rev. 3 | Page 13 of 28 | www.onsemi.com A-Counter value M-Counter value A-Counter value M-Counter value A-Counter value M-Counter value A-Counter value M-Counter value FS6370 Table 6: Post Divider Control Bits Name POST_A[3:0] (Bits 99-96) POST_B[3:0] (Bits 103-100) POST_C1[3:0] (Bits 107-104) POST_C2[3:0] (Bits 115-112) POST_D1[3:0] (Bits 111-108) POST_D2[3:0] (Bits 119-116) Description POST divider A (see Table 7) POST divider B (see Table 7) POST divider C1 (see Table 7) selected when the SEL_CD pin = 0 POST divider C2 (see Table 7) selected when the SEL_CD pin = 1 POST divider D1 (see Table 7) selected when the SEL_CD pin = 0 POST divider D2 (see Table 7) selected when the SEL_CD pin = 1 Table 7: Post Divider Modulus Bit [3] 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Bit [2] 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Bit [1] 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Bit [0] 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Divide By 1 2 3 4 5 6 8 9 10 12 15 16 18 20 25 50 Rev. 3 | Page 14 of 28 | www.onsemi.com FS6370 Table 8: PLL Tuning Bits Name LFTC_A (Bit 20) LFTC_B (Bit 44) LFTC_C1 (Bit 68) LFTC_C2 (Bit 92) CP_A (Bit 19) CP_B (Bit 43) CP_C1 (Bit 67) CP_C2 (Bit 91) Description Loop Filter Time Constant A Bit = 0 Bit = 1 Loop Filter Time Constant B Bit = 0 Short time constant: 7 µs Long time constant: 20 µs Short time constant: 7 µs Bit = 1 Long time constant: 20 µs Loop Filter Time Constant C1 - Selected when the SEL_CD pin = 0 Bit = 0 Short time constant: 7 µs Bit = 1 Long time constant: 20 µs Loop Filter Time Constant C2 - Selected when the SEL_CD pin = 1 Bit = 0 Short time constant: 7 µs Bit = 1 Long time constant: 20 µs Charge Pump A Bit = 0 Current = 2 µA Bit = 1 Current = 10 µA Charge Pump B Bit = 0 Current = 2 µA Bit = 1 Current = 10 µA Charge Pump C1 - Selected when the SEL_CD pin = 0 Bit = 0 Current = 2 µA Bit = 1 Current = 10 µA Charge Pump C2 - Selected when the SEL_CD pin = 1 Bit = 0 Current = 2 µA Bit = 1 Current = 10 µA Rev. 3 | Page 15 of 28 | www.onsemi.com FS6370 Table 9: MUX Select Bits Name MUX_A[1:0] (Bits 23-22) MUX_B[1:0] (Bits 47-46) MUX_C1[1:0] (Bits 71-70) MUX_C2[1:0] (Bits 125-124) MUX_D1[1:0] (Bits 95-94) MUX_D2[1:0] (Bits 127-126) Description MUX A Frequency Select Bit 23 Bit 22 0 0 0 1 1 0 1 1 MUX B Frequency Select Bit 47 Bit 46 0 0 0 1 1 0 1 1 MUX C1 Frequency Select – Selected when the SEL_CD pin = 0 Bit 71 Bit 70 0 0 0 1 1 0 1 1 MUX C2 Frequency Select – Selected when the SEL_CD pin = 1 Bit 125 Bit 124 0 0 0 1 1 0 1 1 MUX D1 Frequency Select – Selected when the SEL_CD pin = 0 Bit 95 Bit 94 0 0 0 1 1 0 1 1 MUX D2 Frequency Select – Selected when the SEL_CD pin = 1 Bit 127 Bit 126 0 0 0 1 1 0 1 1 Rev. 3 | Page 16 of 28 | www.onsemi.com Reference frequency PLL A frequency PLL B frequency PLL C frequency Reference frequency PLL A frequency PLL B frequency PLL C frequency Reference frequency PLL A frequency PLL B frequency PLL C frequency Reference frequency PLL A frequency PLL B frequency PLL C frequency Reference frequency PLL A frequency PLL B frequency PLL C frequency Reference frequency PLL A frequency PLL B frequency PLL C frequency FS6370 10.0 Electrical Specifications Table 10: Absolute Maximum Ratings Parameter Supply Voltage, dc (VSS = ground) Symbol VDD Min. VSS-0.5 Max. 7 Units V Input Voltage, dc VI Output Voltage, dc VO VSS-0.5 VDD+0.5 V VSS-0.5 VDD+0.5 V Input Clamp Current, dc (VI < 0 or VI > VDD) Output Clamp Current, dc (VI < 0 or VI > VDD) IIK -50 50 mA IOK -50 50 Storage Temperature Range (non-condensing) mA TS -65 150 °C Ambient Temperature Range, Under Bias TA -55 125 °C Junction Temperature TJ Re-Flow Solder Profile 150 °C 260 °C 2 kV Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality and reliability. CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy electrostatic discharge. Table 11: Operating Conditions Parameter Supply Voltage Ambient Operating Temperature Range Symbol VDD 5 V ± 10% 3.3 V ± 10% TA Crystal Resonator Frequency fXIN Crystal Resonator Load Capacitance CXL Serial Data Transfer Rate Output Driver Load Capacitance Conditions/Descriptions Min. Typ. Max. 4.5 5 5.5 3 3.3 3.6 0 5 Parallel resonant, AT cut Standard mode CL Rev. 3 | Page 17 of 28 | www.onsemi.com V 70 °C 27 MHz 18 10 Units pF 100 kb/s 15 pF FS6370 Table 12: DC Electrical Specifications Parameter Symbol Conditions/Description Min. Typ. Max. Units Overall Supply Current, Dynamic IDD VDD = 5.5V, fCLK = 50MHz ; CL = 15pF See Figure 11 for more information 43 mA Supply Current, Write IDD(write) Additional operating current demand, EEPROM program mode, VDD = 5.5 V 2 mA Supply Current, Read IDD(read) Additional operating current demand, EEPROM program mode, VDD = 5.5 V 1 mA Supply Current, Static IDDL VDD = 5.5V, powered down via PD pin 0.3 mA Dual Function I/O (P VDD = 5.5V 3.85 VDD+0.3 VDD = 3.6V 2.52 VDD+0.3 Register program mode (SDA, SCL) VDD = 5.5V 3.85 VDD+0.3 VDD = 3.6V 2.52 VDD+0.3 EEPROM prodgram mode (SDA, SCL) VDD = 5.5V 3.85 VDD+0.3 VDD = 3.6V 2.52 VDD+0.3 VDD = 5.5V VSS-0.3 1.65 VDD = 3.6V VSS-0.3 1.08 Register program mode (SDA, SCL) VDD = 5.5V VSS-0.3 1.65 VDD = 3.6V VSS-0.3 1.08 EEPROM prodgram mode (SDA, SCL) VDD = 5.5V VSS-0.3 1.65 VDD = 3.6V VSS-0.3 Run mode (PD, OE) High-Level Input Voltage VIH Run mode (PD, OE) Low-Level Input Voltage VIL Run mode (PD, OE) Hysteresis Voltage High-Level Input Current Vhys IIH Low-Level Input Current (pull-up) IIL Low-Level Output Sink Current (SDA) IOL V 1.08 VDD = 5.5V 2.20 VDD = 3.6V 1.44 Register program mode (SDA, SCL) VDD = 5.5V 2.20 VDD = 3.6V 1.44 Register program mode (SDA, SCL) VDD = 5.5V 0.275 VDD = 3.6V V V 0.18 Run/register program mode -1 1 EEPROM program mode -1 1 VIL = 0V -20 -36 Run/register program mode, VOL = 0.4V 26 EEPROM program mode, VOL = 0.4V 3.0 -80 μA µA mA Mode and Frequency Select Inputs (MODE, SEL_CD) VDD = 5.5 V 2.4 VDD+0.3 VDD = 3.6 V 2.0 VDD+0.3 VDD = 5.5 V VSS-0.3 0.8 VDD = 3.6 V VSS-0.3 0.8 High-Level Input Voltage VIH Low-Level Input Voltage VIL High-Level Input Current IIH -1 Low-Level Input Current (pull-up) IIL -20 Parameter Symbol Conditions/Description Rev. 3 | Page 18 of 28 | www.onsemi.com Min. -36 Type. V V 1 μA -80 μA Max. Units FS6370 Table 12: DC Electrical Specifications (Continued) Crystal Oscillator Feedback (XIN) Threshold Bias Voltage VTH High-Level Input Current IIH Low-Level Input Current IIL VDD = 5.5 V 2.9 VDD = 3.6 V 1.7 VDD = 5.5 V 54 VDD = 5.5 V, oscillator powered down 5 -25 -54 V mA 15 mA -75 µA Crystal Loading Capacitance * CL(xtal) As seen by an external crystal connected to XIN and XOUT 18 pF Input Loading Capacitance * CL(XIN) As seen by an external clock driver on XOUT; XIN unconnected 36 pF Crystal Oscillator Output (XOUT) High-Level Output Source Current IOH VDD = V(XIN) = 5.5 V, VO = 0 V 10 21 30 mA Low-Level Output Sink Current IOL VDD = 5.5 V, V(XIN = VO = 5.5 V -10 -21 -30 mA Clock Outputs (CLK_A, CLK_B, CLK_C, CLK_D) High-Level Output Source Current Low-Level Output Sink Current Output Impedance Tristate Output Current IOH VO = 2.4 V -125 mA mA IOL VO = 0.4 V 23 zOH VO = 0.5VDD; output driving high 29 zOL VO = 0.5VDD; output driving low 27 IZ -10 Ω 10 µA Short Circuit Source Current * ISCH VDD = 5.5 V , VO = 0 V; shorted for 30s, max -150 mA Short Circuit Sink Current * ISCL VDD = VO = 5.5 V; shorted for 30s, max. 123 mA Voltage (V) 0 Low Drive Current (mA) Min. Typ. Max. Voltage (V) 0 0 0 0 High Drive Current (mA) Min. Typ. Max. -87 -112 -150 0.2 9 11 12 0.5 -85 -110 -147 0.5 22 25 29 1 -83 -108 -144 0.7 29 34 40 1.5 -80 -104 -139 1 39 46 55 2 -74 -97 -131 1.2 44 52 64 2.5 -65 -88 -121 1.5 51 61 76 2.7 -61 -84 -116 1.7 55 66 83 3 -53 -77 -108 2 60 73 92 3.2 -48 -71 -102 2.2 62 77 97 3.5 -39 -62 -92 2.5 65 81 104 3.7 -32 -55 -85 2.7 65 83 108 4 -21 -44 -74 3 66 85 112 4.2 -13 -36 -65 0 3.5 67 87 117 4.5 -24 -52 4 68 88 119 4.7 -15 -43 4.5 69 89 120 5 0 91 121 5.2 -11 123 5.5 0 5 5.5 -28 The data in this table represents nominal characterization data only. Figure 10: CLK_A, CLK_B, CLK_C, CLK_D Clock Output Rev. 3 | Page 19 of 28 | www.onsemi.com FS6370 Figure 11: Dynamic Current vs. Output Frequency Rev. 3 | Page 20 of 28 | www.onsemi.com FS6370 Table 13: AC Timing Specifications Parameter Symbol Conditions/Description Clock (MHz) Min. Typ. Max. Units 4 ms Overall EEPROM Write Cycle Time Twc Output Frequency * fO VCO Frequency * fVCO VCO Gain * VDD = 5.5 V 0.8 150 VDD = 3.6 V 0.8 100 VDD = 5.5 V 40 230 VDD = 3.6 V 40 170 AVCO Loop Filter Time Constant * Rise Time * tr Fall Time * tf 400 LFTC bit = 0 7 LFTC bit = 1 20 VO = 0.5 V to 4.5 V; CL = 15pF 2.0 VO = 0.3 V to 3.0 V; CL = 15pF 2.1 VO = 4.5 V to 0.5 V; CL = 15pF 1.8 VO = 3.0 V to 0.3 V; CL = 15pF 1.9 MHz MHz MHz/V μs ns ns Tristate Enable Delay * tPZL, tPZH 1 8 ns Tristate Disable Delay * tPZL, tPZH 1 8 ns Clock Stabilization Time * tSTB Output active from power-up, RUN mode via PD pin μs 100 After last register is written, register program mode 1 ms Divider Modulus Feedback Divider NF Reference Divider NR Post Divider NP See also Error! Reference source not found. See also Error! Reference source not found. 8 2047 1 255 1 50 45 55 Clock Output (PLL A clock via CLK_A pin) Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period Duty Cycle * Jitter, Long Term (σy(τ)) * Jitter, Period (peak-peak) * Tj(LT) tj(ΔP) On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPX=50, no other PLLs active On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, =14.318MHz, NF=220, NR=63, NPX=50, all other PLLs active (B=60MHz, C=40MHz, D=14.318MHz) From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPX=50, no other PLLs active From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPX=50, all other PLLs active (B=60MHz, C=40MHz, D=14.318MHz) 100 100 45 50 165 100 110 50 390 % ps ps Clock Output (PLL B clock via CLK_B pin) Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period Duty Cycle * Jitter, Long Term (σy(τ)) * Jitter, Period (peak-peak) * Tj(LT) tj(ΔP) On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPX=50, no other PLLs active On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, =14.318MHz, NF=220, NR=63, NPX=50, all other PLLs active (A=50MHz, C=40MHz, D=14.318MHz) From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPX=50, no other PLLs active From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPX=50, all other PLLs active (A=50MHz, C=40MHz, D=14.318MHz) Rev. 3 | Page 21 of 28 | www.onsemi.com 100 45 55 100 45 60 75 100 120 60 400 % ps ps FS6370 Table 13: AC Timing Specifications (Continued) Parameter Symbol Conditions/Description Clock (MHz) Min. 100 45 Typ. Max. Units 55 % Clock Output (PLL C clock via CLK_C pin) Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period Duty Cycle* Jitter, Long Term (σy(τ))* Jitter, Period (peak-peak)* Tj(LT) tj(ΔP) On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPx=50, no other PLLs active On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPx=50, all other PLLs active (A=50MHz, B=60MHz, D=14.318MHz) From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPx=50, no other PLLs active From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPx=50, all other PLLs active (A=50MHz, B=60MHz, D=14.318MHz) 100 45 40 105 100 120 40 440 ps ps Clock Output (Crystal Oscillator via CLK_D pin) Duty Cycle* Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period 14.318 45 55 % On rising edges 500µs apart at 2.5V relative to an ideal clock, CL=15pF, fXIN=14.318MHz, NF=220, NR=63, NPx=50, no other PLLs 14.318 20 active Tj(LT) ps Jitter, Long Term (σy(τ))* From rising edge to the next rising edge at 2.5V, CL=15pF, fXIN=14.318MHz, all other PLLs active (A=50MHz, B=60MHz, 14.318 40 C=40MHz) From rising edge to the next rising edge at 2.5V, CL=15pF, 14.318 90 fXIN=14.318MHz, no other PLLs active Jitter, Period (peak-peak)* ps From rising edge to the next rising edge at 2.5V, CL=15pF, tj(ΔP) fXIN=14.318MHz, all other PLLs active (A=50MHz, B=60MHz, 14.318 450 C=40MHz) Unless otherwise stated, VDD = 5.0V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not currently production tested to any specific limits. Min. and Max. characterization data are ± 3s from typical. Table 14: Serial Interface Timing Specifications Parameter Symbol Conditions/Description Max. Units 0 100 kHz Clock frequency fSCL Bus free time between STOP and START tBUF 4.7 μs tsu:STA 4.7 μs Set up time, START (repeated) SCL Min. Hold time, START thd:STA 4.0 μs Set up time, data input tsu:DAT SDA 250 ns Hold time, data input thd:DAT SDA 0 μs Output data valid from clock tAA Minimum delay to bridge undefined region of the falling edge of SCL to avoid unintended START or STOP Rise time, data and clock tR Fall time, data and clock tF High time, clock tHI SCL 4.0 μs tLO SCL 4.7 μs 4.0 μs Low time, clock Set up time, STOP 3.5 μs SDA, SCL 1000 ns SDA, SCL 300 ns tsu:STO Rev. 3 | Page 22 of 28 | www.onsemi.com FS6370 Figure 12: Bus Timing Data Figure 13: Data Transfer Sequence Rev. 3 | Page 23 of 28 | www.onsemi.com FS6370 11.0 Package Information for Both ‘Green’ and ‘Non-Green’ Table 15: 16-pin SOIC (0.150") Package Dimensions Dimension Inches Millimeters Min. Max. Min. Max. 0.061 0.068 1.55 1.73 A1 0.004 0.0098 0.102 0.249 A2 0.055 0.061 1.40 1.55 A B 0.013 0.019 0.33 0.49 C 0.0075 0.0098 0.191 0.249 D 0.386 0.393 9.80 9.98 E 0.150 0.157 3.81 3.99 e H 0.050 BSC 0.230 0.244 1.27 BSC 5.84 6.20 h 0.010 0.016 0.25 0.41 L 0.016 0.035 0.41 0.89 Θ 0° 8° 0° 8° Table 16: 16-pin SOIC (0.150") Package Characteristics Parameter Symbol Conditions/Description Typ. Units Air flow = 0 m/s 109 °C/W Corner lead 4.0 Center lead 3.0 L12 Any lead to any adjacent lead 0.4 nH C11 Any lead to VSS 0.5 pF Thermal Impedance, Junction to Free-Air 16-pin 0.150” SOIC ΘJA Lead Inductance, Self L11 Lead Inductance, Mutual Lead Capacitance, Bulk 12.0 Ordering Information Part Number Package Shipping Configuration Temperature Range FS6370-01G-XTD 16-pin (0.150”) SOIC (green, ROHS or lead free packaging) Tube/Tray 0°C to 70°C (Commercial) FS6370-01G-XTP 16-pin (0.150”) SOIC (green, ROHS or lead free packaging) Tape & Reel 0°C to 70°C (Commercial) Rev. 3 | Page 24 of 28 | www.onsemi.com nH FS6370 13.0 Demonstration Software Windows 3.1x/95/98-based software is available from ON Semiconductor that illustrates the capabilities of the FS6370. The software can operate under Windows NT. Contact your local sales representative for more information. 13.1 Software Requirements • PC running MS Windows 3.1x or 95/98. Software also runs on Windows NT in a calculation mode only. • 1.8MB available space on hard drive C. 13.2 Software Installation Instructions At the appropriate disk drive prompt (A:\) unzip the compressed demo files to a directory of your choice. Run setup.exe to install the software. 13.3 Demo Program Operation Launch the fs6370.exe program. Note that the parallel port can not be accessed if your machine is running Windows NT. A warning message will appear stating: "This version of the demo program cannot communicate with the FS6370 hardware when running on a Windows NT operating system. Do you want to continue anyway, using just the calculation features of this program?" Clicking OK starts the program for calculation only. The FS6370 demonstration hardware is no longer available nor supported. The opening screen is shown in Figure 14 . Figure 14: Opening Screen Rev. 3 | Page 25 of 28 | www.onsemi.com FS6370 13.3.1. Example Programming Type a value for the crystal resonator frequency in MHz in the reference crystal box. This frequency provides the basis for all of the PLL calculations that follow. Next, click on the PLL A box. A pop-up screen similar to Figure 15 should appear. Type in a desired output clock frequency in MHz, set the operating voltage (3.3 V or 5 V), and the desired maximum output frequency error. Pressing calculate solutions generates several possible divider and VCO-speed combinations. Figure 15: PLL Screen For a 100 MHz output, the VCO should ideally operate at a higher frequency, and the reference and feedback dividers should be as small as possible. In this example, highlight solution #7. Notice the VCO operates at 200MHz with a post divider of 2 to obtain an optimal 50 percent duty cycle. Now choose which mux and post divider to use (that is, choose an output pin for the 100 MHz output). Selecting A places the PostDiv value in solution #7 into post divider A and switches mux A to take the output of PLL A. The PLL screen should disappear, and now the value in the PLL A box is the new VCO frequency chosen in solution #7. Note that mux A has been switched to PLL A and the post divider A has the chosen 100MHz output displayed. Repeat the steps for PLL B. PLL C supports two different output frequencies depending on the setting of the SEL_CD pin. Both mux C and mux D are also affected by the logic level on the SEL_CD pin, as are the post dividers C and D (see Section 4.2 for more detail). Rev. 3 | Page 26 of 28 | www.onsemi.com FS6370 Figure 16: Post Divider Menu Click on PLL C1 to open the PLL screen. Set a desired frequency, however, now choose the post divider B as the output divider. Notice the post divider box has split in two (as shown in Figure 16). The post divider B box now shows that the divider is dependent on the setting of the SEL_CD pin for as long as mux B is the PLL C output. Clicking on post divider A reveals a pull-down menu provided to permit adjustment of the post divider value independently of the PLL screen. A typical menu is shown in Figure 16. The range of possible post divider values is also given in Table 7. The EEPROM settings are shown to the left in the screen shown in Figure 14. Clicking on a register location displays a screen shown in Figure 17. Individual bits can be poked, or the entire register value can be changed. Figure 17: Register Screen Rev. 3 | Page 27 of 28 | www.onsemi.com FS6370 14.0 Revision History Revision Date Modification ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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