DIODES BC847PN_1

BC847PN
BC847PN
NPN
PNP
Complementary Surface Mount General Purpose Si-Planar Transistors
Komplementäre Si-Planar Transistoren für die Oberflächenmontage
NPN
PNP
Version 2006-09-05
2±0.1
2 x 0.65
5
Type
Code
1
2
1.25±0.1
4
2.1±0.1
6
0.9±0.1
3
2.4
Dimensions - Maße [mm]
6 = C1
5 = B2
4 = E2
1 = E1
2 = B1
3 = C2
Power dissipation
Verlustleistung
300 mW
Plastic case
Kunststoffgehäuse
SOT-363
Weight approx. – Gewicht ca.
0.01 g
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Maximum ratings (TA = 25°C)
Grenzwerte (TA = 25°C)
per transistor – pro Transistor
BC847PN
Collector-Emitter-volt. – Kollektor-Emitter-Spannung
B open
VCBO
45 V
Collector-Base-voltage – Kollektor-Basis-Spannung
E open
VCEO
50 V
Emitter-Base-voltage – Emitter-Basis-Spannung
C open
VEB0
6V
Power dissipation – Verlustleistung
Ptot
300 mW 1)
Collector current – Kollektorstrom (dc)
IC
100 mA
Peak Collector current – Kollektor-Spitzenstrom
ICM
200 mA
Peak Base current – Basis-Spitzenstrom
IBM
200 mA
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
Tj
TS
-55...+150°C
-55…+150°C
Characteristics (Tj = 25°C)
Kennwerte (Tj = 25°C)
Min.
Typ.
Max.
DC current gain – Kollektor-Basis-Stromverhältnis
VCE = 5 V, IC = 2 mA
T1 - NPN
hFE
200
–
450
- VCE = 5 V, - IC = 2 mA
T2 - PNP
hFE
220
–
475
Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung 2)
1
2
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
T1 - NPN
VCEsat
VCEsat
–
–
–
–
250 mV
600 mV
- IC = 10 mA, - IB = 0.5 mA
- IC = 100 mA, - IB = 5 mA
T2 - PNP
- VCEsat
- VCEsat
–
–
–
–
300 mV
650 mV
Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
© Diotec Semiconductor AG
http://www.diotec.com/
1
BC847PN
Characteristics (Tj = 25°C)
Kennwerte (Tj = 25°C)
Min.
Typ.
Max.
Base-Emitter saturation voltage – Basis-Sättigungsspannung 2)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
T1 - NPN
VBEsat
VBEsat
–
–
700 mV
900 mV
–
–
- IC = 10 mA, - IB = 0.5 mA
- IC = 100 mA, - IB = 5 mA
T2 - PNP
- VBEsat
- VBEsat
–
–
700 mV
–
–
950 mV
IC = 2 mA, VCE = 5 V
IC = 10 mA, VCE = 5 V
T1 - NPN
VBE
VBE
580 mV
–
–
–
700 mV
720 mV
- IC = 2 mA, - VCE = 5 V
- IC = 10 mA, - VCE = 5 V
T2 - PNP
- VBE
- VBE
600 mV
–
–
–
750 mV
820 mV
Base-Emitter-voltage – Basis-Emitter-Spannung 2)
Collector-Base cutoff current – Kollektor-Basis-Reststrom
VCB = 30 V, (E open)
T1 - NPN
ICB0
–
–
15 nA
- VCB = 30 V, (E open)
T2 - PNP
- ICB0
–
–
15 nA
VEB = 5 V, (C open)
T1 - NPN
IEB0
–
–
100 nA
- VEB = 5 V, (C open)
T2 - PNP
- IEB0
–
–
100 nA
VCE = 5 V, IC = 10 mA, f = 100 MHz
T1 - NPN
fT
100 MHz
–
–
- VCE = 5 V, - IC = 10 mA, f = 100 MHz
T2 - PNP
fT
100 MHz
–
–
Emitter-Base cutoff current
Gain-Bandwidth Product – Transitfrequenz
Collector-Base Capacitance – Kollektor-Basis-Kapazität
VCB = 10 V, IE =ie = 0, f = 1 MHz
T1 - NPN
CCBO
–
–
6 pF
- VCB = 10 V, IE =ie = 0, f = 1 MHz
T2 - PNP
CCBO
–
–
4.5 pF
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft
< 420 K/W 1)
RthA
Pinning – Anschlussbelegung
6
T1: E1 = 1, C1 = 6, B1 = 2
T2: E2 = 4, C2 = 3, B2 = 5
2
4
T2
T1
1
2
1
5
2
3
Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
http://www.diotec.com/
© Diotec Semiconductor AG