ONSEMI MC14028BDR2

MC14028B
BCD-To-Decimal Decoder
Binary-To-Octal Decoder
The MC14028B decoder is constructed so that an 8421 BCD code
on the four inputs provides a decimal (one–of–ten) decoded output,
while a 3–bit binary input provides a decoded octal (one–of–eight)
code output with D forced to a logic “0”. Expanded decoding such as
binary–to–hexadecimal (one–of–16), etc., can be achieved by using
other MC14028B devices. The part is useful for code conversion,
address decoding, memory selection control, demultiplexing, or
readout decoding.
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MARKING
DIAGRAMS
16
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–power TTL Loads or One Low–power
•
•
•
PDIP–16
P SUFFIX
CASE 648
MC14028BCP
AWLYYWW
1
Schottky TTL Load Over the Rated Temperature Range
Positive Logic Design
Low Outputs on All Illegal Input Combinations
Similar to CD4028B.
16
SOIC–16
D SUFFIX
CASE 751B
14028B
AWLYWW
1
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol
Value
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
VDD
Vin, Vout
Iin, Iout
Parameter
16
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
v
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1
MC14028B
AWLYWW
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Device
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
v
SOEIAJ–16
F SUFFIX
CASE 966
Package
Shipping
MC14028BCP
PDIP–16
2000/Box
MC14028BD
SOIC–16
2400/Box
MC14028BDR2
SOIC–16
2500/Tape & Reel
MC14028BF
SOEIAJ–16
See Note 1.
MC14028BFEL
SOEIAJ–16
See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
Publication Order Number:
MC14028B/D
MC14028B
PIN ASSIGNMENT
Q4
1
16
VDD
Q2
2
15
Q3
Q0
3
14
Q1
Q7
4
13
B
Q9
5
12
C
Q5
6
11
D
Q6
7
10
A
VSS
8
9
Q8
TRUTH TABLE
D C B A Q9 Q8 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
BLOCK DIAGRAM
8421
BCD
INPUTS
3–BIT
BINARY
INPUTS
10
A
13
B
12
C
11
D
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
VDD = PIN 16
VSS = PIN 8
http://onsemi.com
2
3
14
2
15
1
6
7
4
9
5
OCTAL
DECODED
OUTPUTS
DECIMAL
DECODED
OUTPUTS
MC14028B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (4.)
Max
Min
Max
Unit
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
VOL
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
VOH
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
IOL
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
“0” Level
“1” Level
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
mAdc
Source
IOH
Sink
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT = (0.3 µA/kHz) f + IDD
IT = (0.6 µA/kHz) f + IDD
IT = (0.9 µA/kHz) f + IDD
µAdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
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SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
tPLH, tPHL = (1.7 ns/pF) CL + 215 ns
tPLH, tPHL = (0.66 ns/pF) CL + 97 ns
tPLH, tPHL = (0.5 ns/pF) CL + 65 ns
tPLH,
tPHL
VDD
Min
Typ (8.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
300
130
90
600
260
180
Unit
ns
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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3
MC14028B
20 ns
Inputs B, C, and D
switching in respect
to a BCD code.
20 ns
All outputs connected
to respective CL loads.
f in respect to a system
clock.
VDD
90%
INPUT A
50%
10%
VSS
1/f
20 ns
20 ns
VDD
90%
INPUT C
50%
10%
Inputs A, B, and D low.
VSS
tPLH
tPHL
VOH
90%
Q4
50%
10%
VOL
tTLH
tTHL
Figure 1. Dynamic Signal Waveforms
LOGIC DIAGRAM
Q0
Q1
A
Q2
Q3
B
Q4
Q5
C
Q6
Q7
D
Q8
Q9
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4
MC14028B
INPUTS
APPLICATIONS INFORMATION
D
Expanded decoding can be performed by using the
MC14028B and other CMOS Integrated Circuits. The
circuit in Figure 2 converts any 4–bit code to a decimal or
hexadecimal code. The accompanying table shows the input
binary combinations, the associated “output numbers” that
go “high” when selected, and the “redefined output
numbers” needed for the proper code. For example: For the
combination DCBA = 0111 the output number 7 is redefined
for the 4–bit binary, 4–bit gray, excess–3, or excess–3 gray
codes as 7, 5, 4, or 2, respectively. Figure 3 shows a 6–bit
binary 1–of–64 decoder using nine MC14028B circuits and
two MC14069UB inverters.
The MC14028B can be used in decimal digit displays,
such as, neon readouts or incandescent projection indicators
as shown in Figure 4.
D
C
B
A
D
MC14028B
Q9
B
A
C
B
A
MC14028B
Q0
15
C
Q9
Q0
–8
15
–0
OUTPUT NUMBERS
Figure 2. Code Conversion Circuit and Truth Table
Code and Redefined
Output Numbers
B
A
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
0
1
2
3
0
1
3
2
0
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
5
6
7
7
6
4
5
1
2
3
4
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8
9
10
11
15
14
12
13
5
6
7
8
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
12
13
14
15
8
9
11
10
9
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5
4221
C
Aiken
D
Decimal
Excess–3
Gray
Output Numbers
Excess–3
Inputs
4–Bit
Binary
4–Bit
Gray
Hexadecimal
0
3
0
1
2
3
0
1
2
4
4
3
4
1
2
5
6
9
5
5
6
8
7
6
7
8
9
7
8
9
MC14028B
INPUTS
A
B
C
D
E
F
INHIBIT
A
B
C
MC14028B
–D
Q0
(NO SELECTION)
Q9
A B C D A B C D
A B C D A B C D A B C D A B C D A B C D
A B C D
MC14028B
MC14028B
MC14028B
MC14028B
MC14028B
MC14028B
MC14028B
MC14028B
Q0
Q9 Q0
Q9 Q0
Q9 Q0
Q9 Q0
Q9 Q0
Q9 Q0
Q9 Q0
Q9
0
7
8
*1/6 MC14069UB
15
16
23
24
31
32
39
40
47
48
55
56
63
64 OUTPUTS (SELECTED OUTPUT IS HIGH)
Figure 3. Six–Bit Binary 1–of–64 Decoder
A
B
MC14028B
C
D
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
APPROPRIATE
VOLTAGE
APPROPRIATE
VOLTAGE
INCANDESCENT
DISPLAY
NEON
DISPLAY
OR
0
9
9
Figure 4. Decimal Digit Display Application
http://onsemi.com
6
2
1
0
MC14028B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
–T–
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
M
T B
S
A
S
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14028B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
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MC14028B/D