ONSEMI NCP691MN18T2G

NCP690, NCP691, NCP692
1 A, Low IGND, Very Low
Dropout Regulator (VLDO)
with/without Enable
The NCP690, NCP691, NCP692 CMOS LDO family provides 1 A
of output current with enhanced ESD in either fixed voltage options or
an adjustable output voltage from 5.0 V down to 1.25 V. This device is
designed for space constrained and portable battery powered
applications and offer additional features such as high PSRR, low
Quiescent and Ground current consumption, low noise operation,
short circuit and thermal protection. The device is designed to be used
with low cost ceramic capacitors and is packaged in the 6−Lead
DFN3x3 package.
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DFN6 3x3
MN SUFFIX
CASE 506AH
1
MARKING DIAGRAM
Features
1
xxxzz
AYWW
G
• Output Voltage Options: Adjustable, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V
– Other Options Possible
• Adjustable Output by External Resistors from 5.0 V down to 1.25 V
• Guaranteed 1 A Output Current
• ±1.5% Output Voltage Tolerance over All Operating Conditions
EN
GND
IN
N/C
1
1
OUT
IN
EN
IN
GND
NCP691, NCP692 −
6 PIN DFN
Fixed Version
(Bottom View)
N/C
IN
NCP690 − 6 PIN DFN
Fixed Version
(Bottom View)
SNS
GND
OUT
SNS
GND
IN
1
NCP690 − 6 PIN DFN
Adjustable Version
(Bottom View)
ADJ
IN
GND
ADJ
OUT
IN
GND
OUT
Laptops and PCI Cards
Modem Banks and Telecom Boards
DSP, FPGA, Microprocessor Boards
Portable, Battery−Power Applications
Hard Disk Drives
These are Pb−Free Devices
GND
1
Applications
•
•
•
•
•
•
= 690, 691, 692
= 15, 18, 25, 33, 50, AD
= Assembly Location
= Year
= Work Week
= Pb−Free Package
PIN ASSIGNMENT
GND
•
•
•
•
•
•
xxx
zz
A
Y
WW
G
IN
•
(Adjustable)
±2% Output Voltage Tolerance over All Operating Conditions
(Fixed)
Typical Noise Voltage of 50 mVrms without a Bypass Capacitor
Typical Dropout Voltage of 190 mV at 1 A (Vout = 2.5 V, TJ = 25°C)
Active Output Discharge
Active Low Enable Pin (NCP691 Device)
Active High Enable Pin (NCP692 device)
Enhanced ESD: 4 kV and 400 V
Pb−Free
NCP691, NCP692 −
6 PIN DFN
Adjustable Version
(Bottom View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
September, 2009 − Rev. 6
1
Publication Order Number:
NCP690/D
NCP690, NCP691, NCP692
VIN
1,6
IN
3
EN*
NCP692
GND
CIN
1 mF**
OUT
SNS
VOUT
4
5
COUT
1 mF**
2, EPAD
Note: * NCP692 device has EN active high
Note: ** Minimum value required for stability
Figure 1. NCP692 Typical Application Circuit for Fixed Version
(Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V)
VIN
1,6
3
IN
EN*
CIN
1 mF**
NCP691
GND
OUT
SNS
VOUT
4
5
COUT
1 mF**
2, EPAD
Note: * NCP691 device has EN active low
Note: ** Minimum value required for stability
Figure 2. NCP691 Typical Application Circuit for Fixed Version
(Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V)
VIN
1,6
3
CIN
1 mF*
IN
N/C
NCP690
GND
OUT
SNS
VOUT
4
5
COUT
1 mF*
2, EPAD
Note: * Minimum value required for stability
Figure 3. NCP690 Typical Application Circuit for Fixed Version
(Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V)
VIN 3.3 V
VEN
CIN
1 mF**
VOUT 2.5 V
1,6
5
OUT
IN
NCP691−ADJ/
NCP692−ADJ
3
4
EN*
ADJ
GND
2, EPAD
R1
9.1 k
R2
9.1 k
COUT
1 mF**
Note: * NCP691−ADJ device has EN active low and
Note: * NCP692−ADJ device has EN active high
Note: ** Minimum value required for stability
Figure 4. NCP692 Typical Application Circuit for Adjustable Version
(Adjustable version for 1.25 V < VOUT ≤ 5.0 V)
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2
NCP690, NCP691, NCP692
OUT
IN
R2
SNS
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
N/C
R1
ENABLE
LOGIC
BANDGAP
REFERENCE
ACTIVE
DISCHARGE
GND
Figure 5. NCP690 Block Diagram (Fixed Version)
IN
OUT
R2
SNS
MOSFET
DRIVER WITH
CURRENT LIMIT
R1
THERMAL
SHUTDOWN
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
ACTIVE
DISCHARGE
GND
Figure 6. NCP691 Block Diagram (Fixed Version)
IN
OUT
R2
SNS
MOSFET
DRIVER WITH
CURRENT LIMIT
R1
THERMAL
SHUTDOWN
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
ACTIVE
DISCHARGE
GND
Figure 7. NCP692 Block Diagram (Fixed Version)
Table 1. PIN FUNCTION DESCRIPTION FOR FIXED VERSION
Pin No.
Pin Name
Description
1, 6
IN
2
GND
Power supply ground of the regulator. Connected to the die through the lead frame. Soldered to the
copper plane allows for effective heat removal.
3
EN
For NCP691 and NCP692 this pin functions as Enable Active Low and Enable Active High respectively. For NCP690 this pin has no special meaning and should be left disconnected.
4
OUT
Regulated output voltage
5
SNS
Sense input. This pin should be connected directly to OUT pin.
Voltage inputs which supplies the current to the regulator. Both of these pins should be connected
together for full output current capability
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3
NCP690, NCP691, NCP692
IN
OUT
ADJ
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
N/C
ENABLE
LOGIC
BANDGAP
REFERENCE
ACTIVE
DISCHARGE
GND
Figure 8. NCP690 Block Diagram (Adjustable Version)
IN
OUT
ADJ
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
ACTIVE
DISCHARGE
GND
Figure 9. NCP691 Block Diagram (Adjustable Version)
IN
OUT
ADJ
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
ACTIVE
DISCHARGE
GND
Figure 10. NCP692 Block Diagram (Adjustable Version)
Table 2. PIN FUNCTION DESCRIPTION FOR ADJUSTABLE VERSION
Pin No.
Pin Name
Description
1, 6
IN
2
GND
Power supply ground of the regulator. Connected to the die through the lead frame. Soldered to the
copper plane allows for effective heat removal.
3
EN
For NCP691 and NCP692 this pin functions as Enable Active Low and Enable Active High respectively. For NCP690 this pin has no special meaning and should be left disconnected.
4
ADJ
Feedback input. Connect to middle point of resistor divider for Adjustable version.
5
OUT
Regulated output voltage
Voltage inputs which supplies the current to the regulator. Both of these pins should be connected
together for full output current capability
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NCP690, NCP691, NCP692
Table 3. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
VIN
−0.3 to 6.5
V
Chip Enable Voltage
VEN
−0.3 to 6.5
V
Output Voltage
VOUT
−0.3 to 6.5
V
VSNS
−0.3 to 6.5
V
ESD
4000
V
Output Voltage / Sense Input, (SNS pin)
Electrostatic Discharge
Human Body Model
Machine Model
400
Maximum Junction Temperature
Storage Temperature Range
TJ_MAX
150
_C
TSTG
−65 to 150
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device series contains ESD protection and exceeds the following tests:
ESD HBM tested per JEDEC standard: JESD22−A114
ESD MM tested per JEDEC standard: JESD22−A115
Latch–up Current Maximum Rating: ≤ 150 mA per JEDEC standard: JESD78
Table 4. PACKAGE THERMAL CHARACTERISTICS
Rating
Thermal Resistance,
Junction−to−Ambient (Note 2)
Condition
Symbol
Value
Unit
DFN6 3x3, 1 oz Cu
mm2
64
Cu
645 mm2 Cu
RqJA
169
70
°C/W
DFN6 3x3, 2 oz Cu
64 mm2 Cu
645 mm2 Cu
RqJA
151
62
°C/W
RqJL
15
°C/W
Thermal Resistance, Junction−to−Pin
Table 5. OPERATING RANGES
Rating
1.
2.
3.
4.
Symbol
Value
Unit
Operating Input Voltage (Notes 3 and 4)
VIN
1.5 to 6.0
V
Operating Junction Temperature Range
TJ
−40 to 125
°C
Operating Ambient Temperature Range
TA
−40 to 85
°C
Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher.
Soldered on FR4 copper area, please refer to Applications Section for Safe Operating Area.
Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher.
Refer to Electrical Characteristics and Application Information for Safe Operating Area.
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NCP690, NCP691, NCP692
Table 6. ELECTRICAL CHARACTERISTICS VIN = (VOUT + 1 V), VEN = VIN, IOUT = 1 mA, CIN = 10 mF, COUT = 10 mF, for typical
values TJ = 25°C, for Min/Max values TJ = −40°C to 125°C; unless otherwise noted. (Note 5)
Test Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VOUT
1.231
(−1.5%)
1.250
1.269
(+1.5%)
V
VOUT
1.470
1.764
2.450
3.234
4.900
(−2%)
1.5
1.8
2.5
3.3
5.0
1.530
1.836
2.550
3.366
5.100
(+2%)
V
RegLINE
−
3.2
8
mV
RegLOAD
−
−
−
−
−
10
10
10
10
10
30
30
35
35
40
mV
VDO
−
450
470
mV
Output voltage
(Adjustable Version)
VIN = 1.75 V to 6.0 V
IOUT = 100 mA to 1 A
Output voltage (Fixed Version)
VIN = (VOUT + 1 V) to 6.0 V
IOUT = 100 mA to 1 A
Line regulation
VIN = (VOUT + 1 V) to 6.0 V
Load regulation
IOUT = 100 mA to 1 A
Dropout voltage
(Adjustable Version, Note 6)
VDO = VIN − VOUT
VOUT = 1.25 V
IOUT = 1 A
Dropout voltage
(Fixed Version, Note 9)
IOUT = 1 A
VOUT = 1.5 V
VOUT = 1.8 V
VOUT = 2.5 V
VOUT = 3.3 V
VOUT = 5.0 V
VDO
−
−
−
−
−
290
240
190
180
120
410
380
300
250
210
mV
Ground current
VIN = VOUT + 1 V,
VOUT = 1.5 V, 1.8 V,
2.5 V, 3.3 V
IOUT = 1 A
IOUT = 10 mA
IOUT = 100 mA
IGND
−
−
−
145
145
145
200
200
200
mA
VIN = VOUT + 1 V,
VOUT = 5.0 V
IOUT = 1 A
IOUT = 10 mA
IOUT = 100 mA
−
−
−
145
145
145
240
240
240
mA
VOUT = 1.5 V
VOUT = 1.8 V
VOUT = 2.5 V
VOUT = 3.3 V
VOUT = 5.0 V
VOUT = 1.5 V
VOUT = 1.8 V
VOUT = 2.5 V
VOUT = 3.3 V
VOUT = 5.0 V
Disable current (NCP692 only,
Notes 5 and 7)
VEN < 0.4 V
IDIS
−
0.1
1
mA
Output Current Limit
VIN = VOUT + 1 V, VOUT = 85% VOUT_NOM
ILIM
1.1
1.6
2.4
A
Short Circuit Current
VOUT = 0 V
Enable High Level Threshold
Enable Low Level Threshold
(NCP691 and NCP692)
VEN increasing from low to high logic level
VEN decreasing from high to low logic level
Enable Input Current
(Enable Active Low)
(NCP691 only, Note 8)
ISC
1.2
−
−
A
VEN_ HI
VEN_ LO
0.9
−
−
−
−
0.4
V
VEN = 0.9 V to VIN
IEN_HI
−
0.01
250
nA
Enable Input Current
(NCP692 only, Note 8)
VEN = 0 V
IEN_LO
−
0.01
100
nA
Feedback Current
VFB = 1.25 (Adjustable version only)
IIFB
−
210
320
nA
Turn−on Time (Note 8)
VIN = 0 V to (VOUT +1 V) or 1.75 V
VOUT = 0 V to 90% VOUT_NOM
tON
−
50
−
ms
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. Maximum dropout voltage is limited by minimum input voltage. VIN = 1.7 V recommended for guaranteed operation at maximum output
current.
7. Refer to the Applications Information Section.
8. Values based on design and/or characterization.
9. Dropout voltage is defined as the differential voltage between VOUT and VIN, when VOUT drops 100 mV below its nominal value.
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NCP690, NCP691, NCP692
Table 6. ELECTRICAL CHARACTERISTICS VIN = (VOUT + 1 V), VEN = VIN, IOUT = 1 mA, CIN = 10 mF, COUT = 10 mF, for typical
values TJ = 25°C, for Min/Max values TJ = −40°C to 125°C; unless otherwise noted. (Note 5) (continued)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
PSRR
−
−
−
62
55
40
−
−
−
dB
VN
−
50
−
mVrms
Thermal Shutdown Temperature
(Note 8)
TSD
−
175
−
°C
Thermal Shutdown Hysteresis
(Note 8)
TSH
−
10
−
°C
Power supply ripple rejection
(Note 8)
VOUT = 1.25 V
VIN = VOUT + 1 V, with
VPP = 0.5 V, COUT = 1 mF
f = 120 Hz
f = 1 kHz
f = 10 kHz
Output noise voltage (Note 8)
BW = 200 Hz to 100 kHz, CIN = 1 mF,
COUT = 10 mF, TA = 25°C
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. Maximum dropout voltage is limited by minimum input voltage. VIN = 1.7 V recommended for guaranteed operation at maximum output
current.
7. Refer to the Applications Information Section.
8. Values based on design and/or characterization.
9. Dropout voltage is defined as the differential voltage between VOUT and VIN, when VOUT drops 100 mV below its nominal value.
TYPICAL CHARACTERISTICS
1.27
1.55
VIN = VOUT_NOM + 1 V = 1.75 V,
CIN = COUT = 10 mF
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
1.28
1.26
IOUT = 100 mA
1.25
1.24
IOUT = 1 A
1.23
1.22
−40
−15
10
35
60
85
110
1.52
1.51
IOUT = 100 mA
1.50
IOUT = 1 A
1.49
1.48
1.47
−15
10
35
60
85
110
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 11. Output Voltage vs. Temperature
(Vout = 1.25 V)
Figure 12. Output Voltage vs. Temperature
(Vout = 1.5 V)
135
3.35
2.54
VIN = VOUT_NOM + 1 V = 3.5 V,
CIN = COUT = 10 mF
2.53
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
VIN = VOUT_NOM + 1 V = 2.5 V,
CIN = COUT = 10 mF
1.53
1.46
−40
135
2.55
2.52
IOUT = 100 mA
2.51
2.50
IOUT = 1 A
2.49
2.48
2.47
2.46
−40
1.54
−15
10
35
60
85
110
3.33
3.31
IOUT = 100 mA
3.29
IOUT = 1 A
3.27
3.25
−40
135
VIN = VOUT_NOM + 1 V = 4.3 V,
CIN = COUT = 10 mF
−15
10
35
60
85
110
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 13. Output Voltage vs. Temperature
(Vout = 2.5 V)
Figure 14. Output Voltage vs. Temperature
(Vout = 3.3 V)
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135
NCP690, NCP691, NCP692
TYPICAL CHARACTERISTICS
500
5.04
VDO, DROPOUT VOLTAGE (mV)
VOUT, OUTPUT VOLTAGE (V)
5.05
VIN = VOUT_NOM + 1 V = 6.0 V,
CIN = COUT = 10 mF
5.03
5.02
5.01
IOUT = 100 mA
5.00
4.99
4.98
IOUT = 1 A
4.97
4.96
−40
−15
10
35
60
85
110
350
300
VOUT = 2.5 V
250
200
VOUT = 3.3 V
150
VOUT = 5.0 V
−15
10
35
60
110
TA, AMBIENT TEMPERATURE (°C)
Figure 15. Output Voltage vs. Temperature
(Vout = 5.0 V)
Figure 16. Dropout Voltage vs. Temperature
(Vout = 1.25 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V)
VOUT = 5.0 V
IOUT = 1.0 A,
VIN = VOUT + 1 V
240
85
TA, AMBIENT TEMPERATURE (°C)
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
VOUT = 1.5 V
VOUT = 1.8 V
270
210
3.3 V
180
150
2.5 V
120
1.5 V
90
−40
1.25 V
−15
10
35
60
85
110
135
VOUT = 5.0 V
IOUT = 100 mA,
VIN = VOUT + 1 V
240
210
3.3 V
180
150
2.5 V
120
1.5 V
1.25 V
90
60
−40
135
−15
10
35
60
85
110
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 17. Ground Current vs. Temperature
(Vout = 1.25 V, 1.5 V, 2.5 V, 3.3 V, 5.0 V)
Figure 18. Ground Current vs. Temperature
(Vout = 1.25 V, 1.5 V, 2.5 V, 3.3 V, 5.0 V)
1.4
135
3.0
VIN = 2.5 V,
VOUT = 1.5 V,
CIN = COUT = 1 mF,
IOUT = 10 mA,
TA = 25°C
1.2
VN = 19 mVRMS
1.0
0.8
VN, NOISE DENSITY (mVrms/rtHz)
VN, NOISE DENSITY (mVrms/rtHz)
VOUT = 1.25 V
400
100
−40
135
270
0.6
0.4
0.2
0
IOUT = 1.0 A,
CIN = COUT = 10 mF
450
10
100
1000
10,000
100,000
VIN = 3.5 V,
VOUT = 2.5 V,
CIN = COUT = 1 mF,
IOUT = 10 mA,
TA = 25°C
2.5
VN = 35 mVRMS
2.0
1.5
1.0
0.5
0
10
100
1000
10,000
100,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 19. Noise Density vs. Frequency
(Vout = 1.5 V)
Figure 20. Noise Density vs. Frequency
(Vout = 2.5 V)
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NCP690, NCP691, NCP692
TYPICAL CHARACTERISTICS
2.0
VOUT, OUTPUT VOLTAGE (V)
VIN = 6.0 V,
VOUT = 5.0 V,
CIN = COUT = 1 mF,
IOUT = 10 mA,
TA = 25°C
2.5
1.75
VIN = 3.5 V,
CIN = COUT = 10 mF,
DIOUT/Dt = 0.5 A/1 ms
1.50
VOUT
1.0
1.25
1.5
1.0
0.5
10
1000
10,000
0.5
0
100,000
FREQUENCY (Hz)
TIME (100 ms/DIV)
Figure 21. Noise Density vs. Frequency
(Vout = 5.0 V)
Figure 22. Load Transient
(Vout = 1.5 V)
2.5
VOUT
2.3
IOUT
1.0
0.5
VIN = 6.0 V,
CIN = COUT = 10 mF,
DIOUT/Dt = 0.5 A/1 ms
5.25
5.00
VOUT
4.75
IOUT
1.0
0.5
0
CIN = COUT = 10 mF,
trise = 10 ms
4
VIN
3
VOUT
1.45
VOUT, OUTPUT VOLTAGE (V)
1.50
TIME (50 ms/DIV)
Figure 24. Load Transient
(Vout = 5.0 V)
5
VIN
2.55
VOUT
2.50
2.45
CIN = COUT = 10 mF,
trise = 10 ms
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 25. Line Transient
(Vout = 1.5 V)
Figure 26. Line Transient
(Vout = 2.5 V)
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4
VIN, INPUT VOLTAGE (V)
1.55
TIME (50 ms/DIV)
Figure 23. Load Transient
(Vout = 2.5 V)
VIN, INPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
0
IOUT, OUTPUT CURRENT (A)
VIN = 3.5 V,
CIN = COUT = 10 mF,
DIOUT/Dt = 0.5 A/1 ms
IOUT, OUTPUT CURRENT (A)
2.7
100
IOUT
VOUT, OUTPUT VOLTAGE (V)
0
VOUT, OUTPUT VOLTAGE (V)
VN = 64 mVRMS
3.0
IOUT, OUTPUT CURRENT (A)
VN, NOISE DENSITY (mVrms/rtHz)
3.5
NCP690, NCP691, NCP692
5
5.05
VOUT
5.00
CIN = COUT = 10 mF,
trise = 10 ms
2.0
VOUT
1.5
1.0
VIN = 2.5 V,
CIN = COUT = 10 mF,
IOUT = 1 A,
trise_EN = 10 ms
0.5
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 27. Line Transient
(Vout = 5.0 V)
Figure 28. Start−Up Transient
(Vout = 1.5 V)
VEN
VEN
6
3.0
2.5
2.0
0
VOUT
1.5
VIN = 3.5 V,
CIN = COUT = 10 mF,
IOUT = 1 A,
trise_EN = 10 ms
1.0
0.5
0
VEN, VOUT VOLTAGE (V)
4.95
VEN
2.5
VEN, VOUT VOLTAGE (V)
VIN
3.5
5
VOUT
4
3
2
VIN = 6.0 V,
CIN = COUT = 10 mF,
IOUT = 1 A,
trise_EN = 10 ms
1
0
TIME (50 ms/DIV)
TIME (50 ms/DIV)
Figure 29. Start−Up Transient
(Vout = 2.5 V)
Figure 30. Start−Up Transient
(Vout = 5.0 V)
70
60
50
PSRR (dB)
VEN, VOUT VOLTAGE (V)
6
VIN, INPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
TYPICAL CHARACTERISTICS
40
VIN = 2.5 V,
VOUT = 1.5 V,
VPP = 0.5 V,
COUT = 1 mF
30
20
10
0
10
100
1000
10,000
FREQUENCY (Hz)
Figure 31. PSRR vs. Frequency
(Vout = 1.5 V)
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10
100,000
NCP690, NCP691, NCP692
DEFINITIONS
Load Regulation
Line Regulation
The change in output voltage for a change in output load
current at a constant temperature.
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low
dissipation or by using pulse techniques such that the
average junction temperature is not significantly affected.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured, when the output drops 100 mV
below its nominal value. The junction temperature, load
current, and minimum input supply requirements affect the
dropout level.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Transient Response
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between no−load and full−load conditions.
Output Noise Voltage
This is the integrated value of the output noise over a
specified frequency range. Input voltage and output load
current are kept constant during the measurement. Results
are expressed in mVrms or nV √Hz.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Ground Current
Ground Current is the current that flows through the
ground pin when the regulator operates without a load on its
output (IGND). This consists of internal IC operation, bias,
etc. It is actually the difference between the input current
(measured through the LDO input pin) and the output load
current. If the regulator has an input pin that reduces its
internal bias and shuts off the output (enable/disable
function), this term is called the disable current (IDIS.)
Maximum Package Power Dissipation
The power dissipation level at which the junction
temperature reaches its maximum operating value.
APPLICATIONS INFORMATION
approximately 20 mV, this circuit becomes active and
clamps the output from further voltage increase. Tying the
ENABLE pin to VIN will ensure that the part is active
whenever the supply voltage is present,
The NCP690 regulator is self−protected with internal
thermal shutdown and internal current limit. Typical
application circuit is shown in Figure 1.
Input Decoupling (CIN)
A ceramic 10 mF capacitor is recommended and should be
connected close to the NCP690 package. Higher
capacitance and lower ESR will improve the overall line
transient response.
Noise Decoupling
The NCP690 is a low noise regulator and needs no
external noise reduction capacitor. Unlike other low noise
regulators which require an external capacitor and have slow
startup times, the NCP690 operates without a noise
reduction capacitor, has a typical 50 ms turn−on time and
achieves a 50 mVrms overall noise level between 10 Hz and
100 kHz.
Output Decoupling (COUT)
The NCP690 does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The
minimum output decoupling capacitor required for stability
is 1 mF. In order to improve the load transient response and
start up performance 10 mF capacitor is recommended. The
regulator is stable with ceramic chip as well as tantalum
capacitors. Larger values improve noise rejection and load
transient response.
Enable Operation
The enable pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet. The turn−on/turn−off transient
voltage being supplied to the enable pin should exceed a
slew rate of 10 mV/ms to ensure correct operation. If the
enable function is not to be used then the pin should be
connected to VIN.
No−Load Regulation Considerations
The required minimum 100 mA load current is assured by
the internal resistor divider network.
The NCP690 contain an overshoot clamp circuit to
improve transient response during a load current step
release. When output voltage exceeds the nominal by
Adjustable Operation
The output voltage can be adjusted from 1 to 4 times the
typical 1.250 V regulation voltage by the use of resistor
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11
NCP690, NCP691, NCP692
divider network as shown on Figure 4. The output voltage
and resistors should be chosen using Equations 1 and 2.
ǒ
V OUT + 1.250 1 )
R2 ^ R1
Ǔ
R1
) (I ADJ @ R 1)
R2
1
The power dissipated by the NCP690 can be calculated
from the following equations:
P D [ V IN(I GND@I OUT) ) I OUT(V IN * V OUT)
(eq. 1)
or
(eq. 2)
VOUT
*1
1.25
(eq. 4)
V IN(MAX) [
Input bias current IADJ is typically less than 210 nA.
Choose R1 arbitrarily to minimize errors due to the bias
current and to minimize noise contribution to the output
voltage. Use Equation 2 to find the required value for R2.
P D(MAX) ) (V OUT
I OUT)
I OUT ) I GND
(eq. 5)
250
200
RqJA (°C/W)
Thermal Characteristics
As power dissipated in the NCP690 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. When the NCP690 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power applications. The
maximum dissipation the NCP690 can handle is given by:
P D(MAX) +
[T J(MAX) * T A]
R qJA
150
FR4 − 1.0 oz
100
FR4 − 2.0 oz
50
0
0
200
400
COPPER AREA (mm2)
600
800
Figure 32. Thermal Resistance vs. Copper Area
(eq. 3)
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP690, and
make traces as short as possible.
Since TJ is not recommended to exceed 125°C (TJ(MAX)),
then the NCP690 can dissipate up to 1 W when the ambient
temperature (TA) is 25°C.
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12
NCP690, NCP691, NCP692
DEVICE ORDERING INFORMATION
Nominal
Output Voltage
Marking
Package
Shipping†
NCP690MN15T2G
1.5 V
69015
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP690MN18T2G
1.8 V
69018
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP690MN25T2G
2.5 V
69025
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP690MN33T2G
3.3 V
69033
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP690MN50T2G
5.0 V
69050
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP690MNADJT2G
ADJ
690AD
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP691MN15T2G
1.5 V
69115
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP691MN18T2G
1.8 V
69118
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP691MN25T2G
2.5 V
69125
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP691MN33T2G
3.3 V
69133
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP691MN50T2G
5.0 V
69150
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP691MNADJT2G
ADJ
691AD
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP692MN15T2G
1.5 V
69215
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP692MN18T2G
1.8 V
69218
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP692MN25T2G
2.5 V
69225
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP692MN33T2G
3.3 V
69233
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP692MN50T2G
5.0 V
69250
DFN6
(Pb-Free)
3000 / Tape & Reel
NCP692MNADJT2G
ADJ
692AD
DFN6
(Pb-Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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13
NCP690, NCP691, NCP692
PACKAGE DIMENSIONS
A
D
PIN 1
REFERENCE
2X
0.15 C
2X
0.15 C
DFN6 3*3 MM, 0.95 PITCH
CASE 506AH−01
ISSUE O
B
ÇÇÇ
ÇÇÇ
ÇÇÇ
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.10 C
A
6X
0.08 C
(A3)
SIDE VIEW
6X
D2
L
e
1
6X
C
A1
SEATING
PLANE
MILLIMETERS
MIN
NOM MAX
0.80
0.90
1.00
0.00
0.03
0.05
0.20 REF
0.35
0.40
0.45
3.00 BSC
2.40
2.50
2.60
3.00 BSC
1.50
1.60
1.70
0.95 BSC
0.21
−−−
−−−
0.30
0.40
0.50
SOLDERING FOOTPRINT*
4X
0.450
0.0177
3
0.950
0.0374
E2
K
6
4
6X
b
1.700
0.685
3.31
0.130
(NOTE 3)
0.10 C A B
BOTTOM VIEW
0.05 C
0.63
0.025
2.60
0.1023
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP690/D