INTEGRATED CIRCUITS MB2623 16-bit transceiver with dual enable, non-inverting (3-State) Product specification Supersedes data of 1993 Aug 24 IC23 Data Handbook 1998 Jan 16 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) FEATURES MB2623 DESCRIPTION • Two 8-bit bidirectional bus interfaces • 3-State buffers • Power-up 3-State • Multiple VCC and GND pins minimize switching noise • Output capability: +64mA/–32mA • Latch-up protection exceeds 500mA per Jedec Std 17 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 The MB2623 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The MB2623 is a 16-bit transceiver featuring non-inverting 3-State bus compatible outputs in both send and receive directions. The MB2623 is designed for asynchronous two-way communication between data buses. The control function implementation allows for maximum flexibility in timing. This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic levels at the Enable inputs (nOEBA and nOEAB). The Enable inputs can be used to disable the device so that the buses are effectively isolated. and 200 V per Machine Model • Inputs are disabled during 3-State mode QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 3.2 3.1 ns tPLH tPHL Propagation delay nAx to nBx, or nBx to nAx CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 4 pF CI/O I/O capacitance VO = 0V or VCC; 3-State 7 pF ICCZ Total supply current Outputs disabled; VCC =5.5V 50 µA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER –40°C to +85°C MB2623 BB MB2623 BB SOT379-1 52–pin plastic Quad Flat Pack 52 51 50 49 48 47 46 45 44 43 42 1A3 1A2 GND 1A1 1A0 1OEBA GND 1OEAB 1B0 PIN DESCRIPTION 1B1 GND 1B2 1B3 LOGIC SYMBOL 41 40 VCC 1 39 V CC 1B4 2 38 1A4 1B5 3 37 1A5 GND È 4 36 GND 1B6 5 35 1A6 1B7 6 GND 7 33 GND 2B0 8 32 2A0 2B1 9 31 2A1 È 52-pin PQFP 34 1A7 29 2A2 2B3 12 28 2A3 VCC 13 27 V CC 1998 Jan 16 SYMBOL FUNCTION 44, 43, 41, 40, 38, 37, 35, 34, 32, 31, 29, 28, 26, 25, 23, 22 1A0 – 1A7 2A0 – 2A7 Data inputs/outputs (A side) 48, 49, 51, 52, 2, 3, 5, 6, 8, 9, 11, 12, 14, 15, 17, 18 1B0 – 1B7 2B0 – 2B7 Data inputs/outputs (B side) 47, 19 1OEAB, 2OEAB Output enable inputs (active-High) 45, 21 1OEBA, 2OEBA Output enable inputs (active-Low) 4, 7, 10, 16, 20, 24, 30, 33, 36, 42, 46, 50 GND Ground (0V) 1, 13, 27, 39 VCC Positive supply voltage 26 2A4 2A5 GND 2A6 2A7 GND 2OEBA 2B7 21 22 23 2A5 25 GND 17 18 19 20 2B5 14 15 16 2OEBA 2B2 11 2B6 30 GND 2B4 GND 10 PIN NUMBER SB00104 2 853–1575 18869 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) FUNCTION TABLE INPUTS MB2623 PIN CONFIGURATION OUTPUTS nOEBA nOEAB nAx nBx L L A=B Inputs H H Inputs B=A H L Z Z L H A=B H = High voltage level L = Low voltage level Z = High impedance “off” state 45 47 19 1OEBA 1OEAB 44 2OEBA 32 1A0 2A0 48 43 8 1B0 31 1A1 2B0 2A1 49 B=A 21 2OEAB 41 9 1B1 29 1A2 2B1 2A2 51 40 11 1B2 28 1A3 2B2 2A3 52 38 12 1B3 26 1A4 2B3 2A4 2 37 14 1B4 25 1A5 2B4 2A5 3 35 15 1B5 23 1A6 2B5 2A6 5 34 17 1B6 22 1A7 2B6 2A7 6 18 1B7 2B7 SB00105 LOGIC SYMBOL (IEEE/IEC) 47 EN1 19 EN1 45 EN2 21 EN2 44 1 32 1 48 2 43 41 10 38 37 35 34 8 2 49 31 51 29 52 28 2 26 3 25 5 23 6 22 9 11 12 14 15 17 18 SB00106 1998 Jan 16 3 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) MB2623 ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC IIK CONDITIONS RATING UNIT –0.5 to +7.0 V –18 mA –1.2 to +7.0 V VO < 0 –50 mA output in Off or High state –0.5 to +5.5 V output in Low state 128 mA –65 to 150 °C DC supply voltage DC input diode current VI < 0 voltage3 VI DC input IOK DC output diode current voltage3 VOUT DC output IOUT DC output current Tstg Storage temperature range NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER LIMITS DC supply voltage UNIT Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 10 ns/V –40 +85 °C ∆t/∆v Input transition rise or fall rate Tamb operating free-air temperature range 1998 Jan 16 2.0 4 V Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) MB2623 DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Min VIK VOH VOL II Input clamp voltage High-level output voltage Tamb = –40°C to +85°C Tamb = +25°C VCC = 4.5V; IIK = –18mA Typ Max –0.9 –1.2 Min UNIT Max –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V Input leakage Control pins VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA current Data pins VCC = 5.5V; VI = GND or 5.5V ±5 ±100 ±100 µA Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±50 ±50 µA Power-up/down 3-State output current VCC = 2.0V; VO = 0.5V; VI = GND or VCC; VOE = VCC; VOE = GND ±5.0 ±100 ±100 µA IIH + IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IIL + IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA –100 –180 –180 mA VCC = 5.5V; Outputs High, VI = GND or VCC 50 100 100 µA VCC = 5.5V; Outputs Low, VI = GND or VCC 48 60 60 mA VCC = 5.5V; Outputs 3-State; VI = GND or VCC 50 100 100 µA VCC = 5.5V; one input at 3.4V, other inputs at VCC or GND 0.5 1.5 1.5 mA IOFF IPU/IPD ICEX IO Output current1 ICCH ICCL Quiescent supply current ICCZ ∆ICC Additional supply current per input pin2 VCC = 5.5V; VO = 2.5V –50 –50 NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. AC CHARACTERISTICS GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER Tamb = -40 to +85oC VCC = +5.0V ±0.5V Tamb = +25oC VCC = +5.0V WAVEFORM Min Typ Max Min Max UNIT tPLH tPHL Propagation delay An to Bn or Bn to An 1 1.2 1.2 3.2 3.1 4.5 4.5 1.2 1.2 5.1 5.1 ns tPZH tPZL Output enable time to High and Low level 2 1.5 1.7 4.8 5.4 6.5 6.8 1.5 1.7 7.2 7.8 ns tPHZ tPLZ Output disable time from High and Low level 2 1.5 1.4 4.7 4.2 6.5 5.8 1.5 1.4 7.2 6.5 ns 1998 Jan 16 5 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) MB2623 AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V nOEBA INPUT VM VM INPUT nOEAB INPUT VM VM tPHL OUTPUT tPLH tPLZ tPZL VM VOL + 0.3V VOL tPHZ tPZH VM VM OUTPUT 3.5V VOH VOH – 0.3V OUTPUT VM SB00044 0V SB00107 Waveform 1. Waveforms Showing the Input to Output Propagation Delays Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORM VCC 7.0V RL VOUT VIN PULSE GENERATOR tW 90% NEGATIVE PULSE 90% CL VM VM 10% 10% 0V D.U.T. RT RL tTHL (tF) tTLH (tR) tTLH (tR) tTHL (tF) 90% POSITIVE PULSE Test Circuit for 3-State Outputs AMP (V) 90% VM VM 10% 10% tW SWITCH POSITION TEST SWITCH tPLZ closed tPZL closed All other open Load resistor; see AC CHARACTERISTICS for value. CL = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. RT = Termination resistance should be equal to ZOUT of pulse generators. 0V VM = 1.5V Input Pulse Definition INPUT PULSE REQUIREMENTS DEFINITIONS RL = AMP (V) FAMILY MB Amplitude Rep. Rate tW tR tF 3.0V 1MHz 500ns 2.5ns 2.5ns SB00010 1998 Jan 16 6 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) tPLH vs Temperature (Tamb) CL = 50pF, 1 Output Switching nAx to nBx Adjustment of tPLH for Load Capacitance and # of Outputs Switching nAx to nBx 6 4 5 3 MAX 4 16 switching 8 switching 1 switching 2 Offset in ns ns MB2623 4.5VCC 5.5VCC 3 1 2 0 MIN 1 –1 0 –2 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 100 150 200 pF tPHL vs Temperature (Tamb) CL = 50pF, 1 Output Switching nAx to nBx Adjustment of tPHL for Load Capacitance and # of Outputs Switching nAx to nBx 7 4 6 3 16 switching 8 switching 1 switching MAX 5 Offset in ns 2 4 ns 4.5VCC 5.5VCC 3 1 0 2 MIN –1 1 0 –2 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 150 200 pF tPZH vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx Adjustment of tPZH for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx 9 5 7 MAX 6 4.5VCC 5.5VCC 5 Offset in ns 8 ns 100 4 4 16 switching 8 switching 3 1 switching 2 1 3 0 2 MIN –1 1 0 –55 –2 –35 –15 5 25 45 65 85 105 125 0 °C 50 100 150 200 pF SB00108 1998 Jan 16 7 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) tPZL vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx Adjustment of tPZL for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx 9 4 8 MAX 7 4.5VCC 5.5VCC Offset in ns 6 5 ns MB2623 4 3 16 switching 8 switching 2 1 switching 1 3 0 2 MIN –1 1 0 –2 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 200 Adjustment of tPHZ for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx 9 6 8 5 MAX 7 4.5VCC 4 5.5VCC 3 Offset in ns 5 2 1 3 0 MIN 2 16 switching 8 switching 1 switching 4 6 ns 150 pF tPHZ vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx –1 1 0 –2 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 150 200 Adjustment of tPLZ for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx 8 6 7 16 switching 8 switching 1 switching 5 MAX 6 4 Offset in ns 5 4.5VCC 4 5.5VCC 3 MIN 2 3 2 1 0 1 –1 0 –55 100 pF tPLZ vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx ns 100 –2 –35 –15 5 25 45 65 85 105 125 0 °C 50 100 150 200 pF SB00109 1998 Jan 16 8 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) tTLH vs Temperature (Tamb) CL = 50pF, 1 Output Switching MB2623 Adjustment of tTLH for Load Capacitance and # of Outputs Switching 4 9 8 16 switching 8 switching 1 switching 7 6 3 5 ns Offset in ns 4.5VCC 5.5VCC 2 4 3 2 1 0 –1 –2 1 –3 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 100 150 200 pF tTHL vs Temperature (Tamb) CL = 50pF, 1 Output Switching Adjustment of tTHL for Load Capacitance and # of Outputs Switching 3.0 5 4 2.5 16 switching 8 switching 1 switching Offset in ns 3 4.5VCC ns 2.0 5.5VCC 2 1 0 1.5 –1 1 –2 –55 –35 –15 5 25 45 65 85 105 0 125 50 °C 100 150 VOHP and VOLV vs Load Capacitance VCC = 5V, VIN = 0 to 3V VOHV and VOLP vs Load Capacitance VCC = 5V, VIN = 0 to 3V 4.0 6 125°C 25°C –55°C 3.5 3.0 5 4 125°C 25°C –55°C 2.5 3 volts 2.0 volts 200 pF 1.5 1.0 2 1 125°C 25°C –55°C 0.5 0.0 125°C 25°C –55°C 0 –1 –0.5 –1 –2 0 50 100 150 200 0 pF 50 100 150 200 pF SB00110 1998 Jan 16 9 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm 1998 Jan 16 10 MB2623 SOT379-1 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) NOTES 1998 Jan 16 11 MB2623 Philips Semiconductors Product specification 16-bit transceiver with dual enable, non-inverting (3-State) MB2623 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: yyyy mmm dd 12 Date of release: 05-96 9397-750-03513