NL17SV08XV5T2 Single 2−Input AND Gate The NL17SV08 is an ultra−high performance 2−Input AND gate manufactured in 0.35m CMOS technology with excellent performance down to 0.9 volts. This device is ideal for extremely high−speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. http://onsemi.com MARKING DIAGRAM Features • • • • • • • Extremely High Speed: tPD = 1.0 ns (Typ) @ VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation Balanced "24 mA Output Drive @ 3.3 V Near Zero Static Supply Current Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm All Devices in Package SOT−553 are Inherently Pb−Free Typical Applications • • • • Cellular Digital Camera PDA Digital Video 5 SOT−553 CASE 463B 1 UG M G G UG = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN DIAGRAM Industry Standard IN A 1 IN B 2 GND 3 5 VCC 4 OUT Y • Functionally Similar to NC7SV08 and SN74AUC1G08 PIN ASSIGNMENT PIN # FUNCTION 1 IN A 2 IN B 3 GND 4 OUT Y 5 VCC FUNCTION TABLE Input A Input B Output Y L L H H L H L H L L L H ORDERING INFORMATION *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. © Semiconductor Components Industries, LLC, 2005 October, 2005 − Rev. 4 1 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Publication Order Number: NL17SV08XV5T2/D NL17SV08XV5T2 MAXIMUM RATINGS Symbol VCC Rating DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO Value Unit −0.5 to + 4.6 V −0.5 to + 4.6 V −0.5 to VCC +0.5 V VI < GND ±50 mA VO = GND VO = VCC −50 +50 mA DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±50 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range TL Lead Temperature, 1.0 mm from Case for 10 seconds ±50 mA − 65 to +150 °C 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity FR Flammability Rating Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage Min Max Unit 0.9 3.6 V VIN Digital Input Voltage 0 3.6 V Vout Output Voltage 0 VCC V IOH/IOL Output Current ±24 ±18 ±6 ±4 ±2 ±0.1 mA −40 +85 °C 0 10 nS/V tA VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V Operating Temperature Range. All Package Types tr, tf VCC = 3.3V ± 0.3 V Input Rise or Fall Time DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 2 NL17SV08XV5T2 DC CHARACTERISTICS– Digital Section (Voltages Referenced to GND) TA = 25°C Symbol Parameter VCC Min VIH High Level Input Voltage 0.90 1.10 v= VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIL Low Level Input Voltage 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = −40 to 85°C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Unit V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V IOH = −100 mA 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 IOH = −2.0 mA 1.10 v VCC v 1.30 0.75 x VCC 0.75 x VCC IOH = −4.0 mA 1.40 v VCC v 1.60 0.75 x VCC 0.75 x VCC IOH = −6.0 mA 1.65 v VCC v 1.95 2.30 v VCC v 2.70 1.25 2.0 1.25 2.0 IOH = −12 mA 2.30 v VCC v 2.70 2.70 v VCC v 3.60 1.8 2.2 1.8 2.2 IOH = −18 mA 2.30 v VCC v 2.70 2.70 v VCC v 3.60 1.7 2.4 1.7 2.4 IOH = −24 mA 2.70 v VCC v 3.60 2.2 2.2 IOL = 100 mA 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 v VCC v 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 v VCC v 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 v VCC v 1.95 0.3 0.3 IOL = 12 mA 2.30 v VCC v 2.70 2.70 v VCC v 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 v VCC v 2.70 2.70 v VCC v 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 v VCC v 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 mA 0 10 10 mA 0.90 to 3.60 0.9 5 mA VI = VCC or GND http://onsemi.com 3 V V NL17SV08XV5T2 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C 25°C Symbol Parameter Condition TPHL, TPLH Propagation Delay CL = 15 pF, RL = 1.0 MW 0.90 CL = 15 pF, RL = 2.0 kW CL = 30 pF, RL = 500 kW CIN Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance VCC Min Typ 1.10 v VCC v 1.30 1.40 v VCC v 1.60 3.0 1.0 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 1.0 0.8 0.7 VI = 0 V or VCC F = 10 MHz 85°C Max Min Max Unit 6.0 3.2 10.0 6.0 1.0 1.0 14.6 7.2 nS 2.0 1.2 1.0 4.5 2.6 2.3 1.0 0.7 0.6 5.3 3.7 3.0 nS 13 nS 0 2.0 pF 0 4.5 pF 0.90 to 3.60 20 pF ORDERING INFORMATION Package Type Shipping† NL17SV08XV5T2 SOT−553* 178 mm, 4000 Units / Tape & Reel NL17SV08XV5T2G SOT−553* 178 mm, 4000 Units / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 4 NL17SV08XV5T2 PACKAGE DIMENSIONS SOT−553 5−LEAD PACKAGE CASE 463B−01 ISSUE B D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 e 2 3 E −Y− HE b 5 PL 0.08 (0.003) c M MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 DIM A b c D E e L HE X Y MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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