ONSEMI CS5253B

CS5253B−8
3.0 A LDO 5−Pin 2.5 V Fixed
Linear Regulator for
Remote Sense Applications
This new very low dropout linear regulator reduces total power
dissipation in the application. To achieve very low dropout, the
internal pass transistor is powered separately from the control
circuitry. Furthermore, with the control and power inputs tied together,
this device can be used in single supply configuration and still offer a
better dropout voltage than conventional PNP−NPN based LDO
regulators. In this mode the dropout is determined by the minimum
control voltage.
The CS5253B−8 is offered in a five−terminal D2PAK−5 package,
which allows for the implementation of a remote−sense pin permitting
very accurate regulation of output voltage directly at the load, where it
counts, rather than at the regulator. This remote sensing feature
virtually eliminates output voltage variations due to load changes and
resistive voltage drops. Typical load regulation measured at the sense
pin is less than 1.0 mV for an output voltage of 2.5 V with a load step
of 10 mA to 3.0 A.
The CS5253B−8 has a very fast transient loop response.
Internal protection circuitry provides for “bust−proof” operation,
similar to three−terminal regulators. This circuitry, which includes
overcurrent, short circuit, and overtemperature protection will self
protect the regulator under all fault conditions.
The CS5253B−8 is ideal for generating a 2.5 V supply to power
graphics controllers used on VGA cards. Its remote sense and low
value capacitance requirements make this a low cost high performance
solution. The CS5253B−8 is optimized from the CS5253−1 to allow a
lower value of output capacitor to be used at the expense of a slower
transient response.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
VOUT Fixed @ 2.5 V ± 1.5%
VPOWER Dropout < 0.40 V @ 3.0 A
VCONTROL Dropout < 1.05 V @ 3.0 A
1.5% Trimmed Reference
Fast Transient Response
Remote Voltage Sensing
Thermal Shutdown
Current Limit
Short Circuit Protection
Drop−In Replacement for EZ1582
Backwards Compatible with 3−Pin Regulators
Very Low Dropout Reduces Total Power Consumption
Pb−Free Packages are Available*
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1
D2PAK−5
DP SUFFIX
CASE 936AC
5
Tab = VOUT
Pin 1. VSENSE
2. GND
3. VOUT
4. VCONTROL
5. VPOWER
MARKING DIAGRAM
CS
5253B−8
AWLYWWG
1
CS5253B−8
A
WL
Y
WW
G
= Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping †
CS5253B−8GDP5
D2PAK−5
50 Units/Rail
CS5253B−8GDP5G
D2PAK−5
50 Units/Rail
Device
(Pb−Free)
CS5253B−8GDPR5
D2PAK−5
CS5253B−8GDPR5G
D2PAK−5 750/Tape & Reel
(Pb−Free)
750/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
October, 2005− Rev. 6
1
Publication Order Number:
CS5253B−8/D
CS5253B−8
RDIS
+5.0 V
VCONTROL
2.5 V @ 3.0 A
VOUT
VSENSE
CS5253B−8
+3.3 V
10 mF
10 V
VPOWER
GND
33 mF
5.0 V
CLOAD
(Optional)
100 mF
5.0 V
GND
GND
RDIS
Figure 1. Application Diagram
MAXIMUM RATINGS
Rating
Value
Unit
VPOWER Input Voltage
6.0
V
VCONTROL Input Voltage
13
V
Operating Junction Temperature Range, TJ
Storage Temperature Range
ESD Damage Threshold
Lead Temperature Soldering:
Reflow: (SMD styles only) (Note 1)
0 to 150
°C
−65 to +150
°C
2.0
kV
230 Peak
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 60 second maximum above 183°C.
ELECTRICAL CHARACTERISTICS (0°C ≤ TA ≤ 70°C; 0°C ≤ TJ ≤ 150°C; VSENSE = VOUT and GND = 0 V; unless otherwise specified.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
Output Voltage
VCONTROL = 3.9 V to 12 V, VPOWER = 3.13 V to 5.5 V,
IOUT = 10 mA to 3.0 A
2.463
(−1.5%)
2.5
2.538
(+1.5%)
V
Line Regulation
VCONTROL = 3.9 V to 12 V, VPOWER = 3.13 V to 5.5 V,
IOUT = 10 mA
−
0.02
0.2
%
Load Regulation
VCONTROL = 3.9 V, VPOWER = 3.13 V,
IOUT = 10 mA to 3.0 A, with Remote Sense
−
0.04
0.3
%
Minimum Load Current (Note 2)
VCONTROL = 5.0 V, VPOWER = 3.3 V, DVOUT = +1.0%
−
0
0
mA
Control Pin Current (Note 3)
VCONTROL = 3.9 V,
VCONTROL = 3.9 V,
−
−
6.0
35
10
120
mA
mA
Ground Pin Current
VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 10 mA
−
7
10
mA
Current Limit
VCONTROL = 3.9 V, VPOWER = 3.13 V, DVOUT = −4.0%
3.1
4.0
−
A
Short Circuit Current
VCONTROL = 3.9 V, VPOWER = 3.13 V, VOUT = 0 V
2.0
3.5
−
A
Ripple Rejection (Note 4)
VCONTROL = VPOWER = 3.9 V, VRIPPLE = 1.0 VP−P @
120 Hz, IOUT = 3.0 A
60
80
−
dB
Thermal Regulation
30 ms Pulse, TA = 25°C
−
0.002
−
%/W
VPOWER = 3.13 V, IOUT = 100 mA
VPOWER = 3.13 V, IOUT = 3.0 A
2. The minimum load current is the minimum current required to maintain regulation.
3. The VCONTROL pin current is the drive current required for the output transistor. This current will track output current with roughly a 1:100
ratio. The minimum value is equal to the quiescent current of the device.
4. This parameter is guaranteed by design and is not 100% production tested.
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2
CS5253B−8
ELECTRICAL CHARACTERISTICS (continued) (0°C ≤ TA ≤ 70°C; 0°C ≤ TJ ≤ 150°C; VSENSE = VOUT and GND = 0 V; unless
otherwise specified.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
VCONTROL Dropout Voltage
(Minimum VCONTROL − VOUT)
(Note 5)
VPOWER = 3.13 V, IOUT = 100 mA
VPOWER = 3.13 V, IOUT = 1.0 A
VPOWER = 3.13 V, IOUT = 3.0 A
−
−
−
0.90
1.00
1.05
1.15
1.15
1.30
V
V
V
VPOWER Dropout Voltage
(Minimum VPOWER − VOUT)
(Note 5)
VCONTROL = 3.9 V, IOUT = 100 mA
VCONTROL = 3.9 V, IOUT = 1.0 A
VCONTROL = 3.9 V, IOUT = 3.0 A
−
−
−
0.05
0.15
0.40
0.15
0.25
0.60
V
V
V
RMS Output Noise
Freq = 10 Hz to 10 kHz, TA = 25°C
−
0.003
−
%VOUT
Temperature Stability
−
0.5
−
−
%
Thermal Shutdown (Note 6)
−
150
180
210
°C
Thermal Shutdown Hysteresis
−
−
25
−
°C
VCONTROL Supply Only Output
Current
VCONTROL = 13 V, VPOWER Not Connected,
GND = VOUT = VSENSE = 0 V
−
−
50
mA
VPOWER Supply Only Output
Current
VPOWER = 6.0 V, VCONTROL Not Connected,
GND = VOUT = VSENSE = 0 V
−
0.1
1.0
mA
5. Dropout is defined as either the minimum control voltage (VCONTROL) or minimum power voltage (VPOWER) to output voltage differential
required to maintain 1.5% regulation at a particular load current.
6. This parameter is guaranteed by design, but not parametrically tested in production. However, a 100% thermal shutdown functional test
is performed on each part.
PACKAGE PIN DESCRIPTION
Package
Pin #
Pin
Symbol
1
VSENSE
Function
This Kelvin sense pin allows for remote sensing of the output voltage at the load for improved regulation. It is
internally connected to the positive input of the voltage sensing error amplifier.
2
GND
This pin is connected to system ground.
3
VOUT
This pin is connected to the emitter of the power pass transistor and provides a regulated voltage capable of
sourcing 3.0 A of current.
4
VCONTROL
This is the supply voltage for the regulator control circuitry. For the device to regulate, this voltage should be
between 0.9 V and 1.3 V (depending on the output current) greater than the output voltage. The control pin current
will be about 1.0% of the output current.
5
VPOWER
This is the power input voltage. This pin is physically connected to the collector of the power pass transistor. For
the device to regulate, this voltage should be between 0.1 V and 0.6 V greater than the output voltage depending
on the output current. The output load current of 3.0 A is supplied through this pin.
VPOWER
VCONTROL
BIAS
and
TSD
VREF
−
+
EA
IA
+
−
VOUT
VSENSE
Figure 2. Block Diagram
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3
GND
CS5253B−8
TYPICAL PERFORMANCE CHARACTERISTICS
2.501
5.0
4.0
Output Current (A)
2.499
2.498
2.497
2.496
2.494
3.5
3.0
2.5
2.0
1.5
1.0
2.495
0.5
0
20
40
60
80
100
0
120
0
1
2
Junction Temperature (°C)
3
4
5
6
VPOWER − VOUT (V)
Figure 3. Output Voltage vs Junction Temperature
Figure 4. Output Current vs VPOWER − VOUT
VCONTROL = 5.0 V
VPOWER = 3.3 V
VOUT = 2.5 V
CCONTROL = 10 mF
CADJ = 0.1 mF
15 A/ms
Short Circuit Output current Limit (A)
3.9
VOUT
CS5253−1
COUT = 330 mF
VOUT
CS5253B−8
COUT = 33 mF
80 A/ms
ILOAD
10 mA to 3.0 A
VCONTROL = 5.0 V
VPOWER = 3.3 V
3.8
3.7
3.6
3.5
3.4
3.3
0
20
40
60
80
100
120
140
Junction Temperature (°C)
Figure 5. Transient Response Comparison between
CS5253−1 and CS5253B−8
Figure 6. Short Circuit Output Current vs Junction
Temperature
0.12
12
0.10
10
VCONTROL = 13 V
VOUT = 0 V
VPOWER Not Connected
TJ = 120°C
8
0.08
IOUT (mA)
Load Regulation (%)
Reference Voltage (V)
Measured at DVOUT = −1.5%
4.5
2.500
0.06
TJ = 20°C
6
4
0.04
TJ = 0°C
2
0.02
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0
Output Current (A)
20
40
60
80
100
120
140
Junction Temperature (°C)
Figure 7. Load Regulation vs Output Current
Figure 8. VCONTROL Only Output Current vs Junction
Temperature
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CS5253B−8
30
500
VPOWER = 6.0 V
VOUT = 0 V
VCONTROL Not Connected
25
400
TJ = 120°C
350
20
IOUT (mA)
VPOWER Dropout Voltage (V)
450
300
TJ = 0°C
250
200
TJ = 20°C
150
15
10
100
5
50
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
20
40
80
60
90
VPOWER = 3.3 V
VCONTROL = 5.0 V
VOUT = 2.5 V
TA = 25°C
70
Current Limit (A)
Ripple Rejection (dB)
140
5.0
80
60
50
VIN − VOUT = 2.0 V
IOUT = 3.0 A
VRIPPLE = 1.0 VP−P
COUT = 22 mF
CADJ = 0.1 mF
40
30
20
10
101
102
103
104
105
4.5
4.0
3.5
106
0
0.5
1.0
Frequency (Hz)
1.5
2.0
2.5
3.0
VOUT (V)
Figure 12. Current Limit vs VOUT
Figure 11. Ripple Rejection vs Frequency
1100
40
VPOWER = 2.05 V
VCONTROL = 3.9 V
VPOWER = 3.13 V
35
TJ = 0°C
IOUT = 3.0 A
30
ICONTROL (mA)
VCONTROL Dropout Voltage (mV)
120
Figure 10. VPOWER Only Output Current vs Junction
Temperature
Figure 9. VPOWER Dropout Voltage vs Output Current
1000
TJ = 20°C
900
25
20
15
IOUT = 1.0 A
10
TJ = 120°C
IOUT = 100 mA
5
800
100
Junction Temperature (°C)
Output Current (A)
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0
Output Current (A)
20
40
60
80
100
120
Junction Temperature (°C)
Figure 14. VCONTROL Supply Current vs Junction
Temperature
Figure 13. VCONTROL Dropout Voltage vs Output
Current
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5
140
CS5253B−8
6
VPOWER = 3.3 V
VCONTROL = 5.0 V
ILOAD = 0 to 3.0 A
5
VOUT = 2.5 V
VOUT Shorted to VSENSE
TJ = 0°C to 150°C
ESR (W)
4
Unstable
3
2
Stable Region
1
0
0
10
20
30
40
50
60
70
80
90
100
Capacitance (mF)
Figure 15. Stability vs ESR
APPLICATIONS NOTES
THEORY OF OPERATION
DESIGN GUIDELINES
The CS5253B−8 linear regulator is fixed at 2.5 V at
currents up to 3.0 A. The regulator is protected against short
circuits, and includes a thermal shutdown circuit with
hysteresis. The output, which is current limited, consists of
a PNP−NPN transistor pair and requires an output capacitor
for stability.
Remote Sense
Remote sense operation can be easily obtained with the
CS5253B−8 but some care must be paid to the layout and
positioning of the filter capacitors around the part. The
ground side of the input capacitors on the +5.0 V and +3.3 V
lines and the local VOUT−to−ground output capacitor on the
IC must be tied close to the ground pin of the regulator. This
will establish the stability of the part. The IC ground may
then be connected to ground remotely at the load, giving the
ground portion remote sense operation.
The VSENSE line can then be tied remotely at the positive
load connection, giving the feedback remote sense
operation. The remote sense lines should be Kelvin
connected so as to eliminate the effect of load current
voltage drop. An optional bypass capacitor may be used at
the load to reduce the effect of load variations and spikes.
VPOWER Function
The CS5253B−8 utilizes a two supply approach to
maximize efficiency. The collector of the power device is
brought out to the VPOWER pin to minimize internal power
dissipation under high current loads. VCONTROL provides
for the control circuitry and the drive for the output NPN
transistor. VCONTROL should be at least 1.0 V greater than
the output voltage. Special care has been taken to ensure that
there are no supply sequencing problems. The output
voltage will not turn on until both supplies are operating. If
the control voltage comes up first, the output current will be
limited to about three milliamperes until the power input
voltage comes up. If the power input voltage comes up first,
the output will not turn on at all until the control voltage
comes up. The output can never come up unregulated.
The CS5253B−8 can also be used as a single supply device
with the control and power inputs tied together. In this mode,
the dropout will be determined by the minimum control
voltage.
Current Limit
The internal current limit circuit limits the output current
under excessive load conditions.
Short Circuit Protection
The device includes short circuit protection circuitry that
clamps the output current at approximately 500mA less than
its current limit value. This provides for a current foldback
function, which reduces power dissipation under a direct
shorted load.
Output Voltage Sensing
The CS5253B−8 five terminal linear regulator includes a
dedicated VSENSE function. This allows for true Kelvin
sensing of the output voltage. This feature can virtually
eliminate errors in the output voltage due to load regulation.
Regulation will be optimized at the point where the sense pin
is tied to the output.
Thermal Shutdown
The thermal shutdown circuitry is guaranteed by design to
activate above a die junction temperature of approximately
150°C and to shut down the regulator output. This circuitry
has 25°C of typical hysteresis, thereby allowing the
regulator to recover from a thermal fault automatically.
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6
CS5253B−8
RDIS
+5.0 V
VCONTROL
+3.3 V
VPOWER
+Load
VOUT
VSENSE
CS5253B−8
+
10 mF
+
GND
100 mF
+
33 mF
Remote
Connections
+
Optional
Local
Connections
−Load
GND
RDIS
Figure 16. Remote Sense
Calculating Power Dissipation and Heatsink
Requirements
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment has a thermal
resistance which is measured in degrees per watt. Like series
electrical resistances, these thermal resistances are summed
to determine the total thermal resistance between the die
junction and the surrounding air, RqJA. This total thermal
resistance is comprised of three components. These resistive
terms are measured from junction−to−case (RqJC),
case−to−heatsink (RqCS), and heatsink−to−ambient air
(RqSA). The equation is:
High power regulators such as the CS5253B−8 usually
operate at high junction temperatures. Therefore, it is
important to calculate the power dissipation and junction
temperatures accurately to ensure that an adequate heatsink
is used. Since the package tab is connected to VOUT on the
CS5253B−8, electrical isolation may be required for some
applications. Also, as with all high power packages, thermal
compound in necessary to ensure proper heat flow. For
added safety, this high current LDO includes an internal
thermal shutdown circuit
The thermal characteristics of an IC depend on the
following four factors: junction temperature, ambient
temperature, die power dissipation, and the thermal
resistance from the die junction to ambient air. The
maximum junction temperature can be determined by:
TJ(max) + TA(max) ) PD(max)
RqJA + RqJC ) RqCS ) RqSA
The value for RqJC is 2.5°C/watt for the CS5253B−8 in the
D2PAK−5 package. For a high current regulator such as the
CS5253B−8 the majority of heat is generated in the power
transistor section. The value for RqSA depends on the
heatsink type, while the RqCS depends on factors such as
package type, heatsink interface (is an insulator and thermal
grease used?), and the contact area between the heatsink and
the package. Once these calculations are complete, the
maximum permissible value of RqJA can be calculated and
the proper heatsink selected. For further discussion on
heatsink selection, see our application note “Thermal
Management,” document number AND8036/D.
RqJA
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type. The
maximum power dissipation for a regulator is:
PD(max) + (VIN(max) * VOUT(min))IOUT(max)
) VIN(max) IIN(max)
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CS5253B−8
PACKAGE DIMENSIONS
D2PAK−5
DP SUFFIX
CASE 936AC−01
ISSUE O
A
TERMINAL 6
E
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. PACKAGE OUTLINE EXCLUSIVE OF
MOLD FLASH AND METAL BURR.
4. PACKAGE OUTLINE INCLUSIVE OF
PLATING THICKNESS.
5. FOOT LENGTH MEASURED AT
INTERCEPT POINT BETWEEN DATUM A
AND LEAD SURFACE.
U
K
S
V
B
M
H
L
W
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
W
P
G
N
R
D
−A−
C
INCHES
MIN
MAX
0.396
0.406
0.330
0.340
0.170
0.180
0.026
0.036
0.045
0.055
0.067 REF
0.580
0.620
0.055
0.066
0.000
0.010
0.098
0.108
0.017
0.023
0.090
0.110
0_
8_
0.095
0.105
0.30 REF
0.305 REF
0.010
MILLIMETERS
MIN
MAX
10.05
10.31
8.38
8.64
4.31
4.57
0.66
0.91
1.14
1.40
1.70 REF
14.73
15.75
1.40
1.68
0.00
0.25
2.49
2.74
0.43
0.58
2.29
2.79
0_
8_
2.41
2.67
7.62 REF
7.75 REF
0.25
PACKAGE THERMAL DATA
Parameter
D2PAK−5
Unit
RqJC
Typical
2.5
°C/W
RqJA
Typical
10−50*
°C/W
*Depending on thermal properties of substrate. RqJA = RqJC + RqCA.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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CS5253B−8/D