HITACHI HD74AC670

HD74AC670
4 × 4 Register File with 3-State Output
Description
The HD74AC670 contains 16 high speed, low power, transparent D-type latches arranged as four words of
four bits each, to function as a 4 × 4 register file. Separate read and write inputs, both address and enable,
allow simultaneous read and write operation. The 3-state outputs make it possible to connect up to 128
outputs to increase the word capacity up to 512 words. Any number of these devices can be operated in
parallel to generate an n-bit length.
Features
• 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
• Outputs Source/Sink 24 mA
Pin Arrangement
D2 1
16 VCC
D3 2
15 D1
D4 3
14 WA0
RA1 4
13 WA1
RA0 5
12 WE
O4 6
11 OE
O3 7
10 O1
GND 8
9 O2
(Top view)
HD74AC670
Logic Symbol
12
15
1
2
3
WE
D1
D2
D3
D4
OE
O1
O2
O3
O4
11
10
9
7
6
14
WA0
13
WA1
5
RA0
4
RA0
VCC=Pin 16
GND=Pin 8
Pin Names
D1 to D4
WA 0, WA 1
WE
RA0, RA1
OE
O1 to O4
Data Inputs
Write Address Inputs
Write Enable Input (Active Low)
Read Address Inputs
3-State Output Enable Input (Active Low)
Data Outputs
Write Function Table
Write Inputs
WE
WA1
WA0
D Inputs to
L
L
L
Word 0
L
L
H
Word 1
L
H
L
Word 2
L
H
H
Word 3
H
X
X
None (hold)
H :
L :
X :
2
High Voltage Level
Low Voltage Level
Immaterial
HD74AC670
Read Function Table
Read Inputs
OE
RA1
RA0
Outputs from
L
L
L
Word 0
L
L
H
Word 1
L
H
L
Word 2
L
H
H
Word 3
H
X
X
None (HIGH Z)
H :
L :
X :
High Voltage Level
Low Voltage Level
Immaterial
3
HD74AC670
Logic Diagram
D4
D3
D2
D1
WE
WA1
WA0
G
D
G
Q
G
G
Q
D
G
Q
G
D
D
G
Q
G
Q
G
Q
D
D
D
G
Q
Word
0
Q
G
Q
D
D
D
Word
1
Q
D
G
Q
D
Word
2
Q
Word
3
G
D
G
Q
D
G
Q
D
G
Q
D
Q
RA1
OE
RA0
O4
O3
O2
O1
DC Characteristics (unless otherwise specified)
Item
Symbol
Max
Unit
Condition
Maximum quiescent supply current
I CC
80
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current
I CC
8.0
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
4
HD74AC670
AC Characteristics: HD74AC670
Ta = +25°C
CL = 50 pF
Ta = –40°C to +85°C
CL = 50 pF
Item
Symbol
VCC (V)*1
Min
Typ
Max
Min
Max
Unit
Propagation delay
t PLH
3.3
1.0
14.0
17.5
1.0
19.0
ns
5.0
1.0
11.5
13.5
1.0
15.0
3.3
1.0
13.5
17.0
1.0
18.5
5.0
1.0
11.0
13.0
1.0
14.5
3.3
1.0
12.5
15.5
1.0
17.0
5.0
1.0
10.0
12.0
1.0
13.0
3.3
1.0
12.5
15.5
1.0
17.0
5.0
1.0
10.0
12.0
1.0
13.0
3.3
1.0
12.0
15.0
1.0
16.5
5.0
1.0
9.5
11.5
1.0
12.5
3.3
1.0
11.5
14.5
1.0
16.0
5.0
1.0
9.0
11.0
1.0
12.0
3.3
1.0
8.0
11.0
1.0
12.0
5.0
1.0
6.0
8.5
1.0
9.5
3.3
1.0
10.0
12.0
1.0
13.0
5.0
1.0
7.5
9.5
1.0
10.5
3.3
1.0
8.0
11.0
1.0
12.0
5.0
1.0
6.0
8.5
1.0
9.5
3.3
1.0
9.0
11.5
1.0
12.5
5.0
1.0
7.0
9.0
1.0
10.0
WE to On
Propagation delay
t PHL
WE to On
Propagation delay
t PLH
RA1 or RA0 to On
Propagation delay
t PHL
RA1 or RA0 to On
Propagation delay
t PLH
Data to O n
Propagation delay
t PHL
Data to O n
Enable time
t PZH
OE to O n
Enable time
t PZL
OE to O n
Disable time
t PHZ
OE to O n
Disable time
OE to O n
Note:
t PLZ
ns
ns
ns
ns
ns
ns
ns
ns
ns
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
5
HD74AC670
AC Operating Requirements: HD74AC670
Ta = –40°C
to +85°C
CL = 50 pF
Ta = +25°C
CL = 50 pF
Item
Symbol
VCC (V)*1 Typ
Guaranteed Minimum
Unit
Setup time
t su
3.3
3.0
5.5
6.0
ns
Data to WE
5.0
2.0
4.0
4.5
Setup time
3.3
3.0
5.5
6.0
WA1 or WA0 to WE
5.0
2.0
4.5
4.5
3.3
3.0
4.0
4.0
WE to Data
5.0
2.5
4.0
4.0
Hold time
3.3
3.0
4.0
4.0
WE to WA1 or WA2
5.0
2.5
4.0
4.0
3.3
3.5
5.5
7.0
5.0
2.5
4.5
5.0
3.3
0.5
10.0
10.0
5.0
0.5
10.0
10.0
Hold time
Pulse width
th
tw
WE
Latch width
t latch
WE to 1
Note:
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item
Symbol
Typ
Unit
Condition
Input capacitance
CIN
4.5
pF
VCC = 5.5 V
Power dissipation capacitance
CPD
60
pF
VCC = 5.0 V
6
ns
ns
ns
ns
ns
Unit: mm
19.20
20.00 Max
1
7.40 Max
9
6.30
16
8
1.3
0.48 ± 0.10
2.54 Min 5.06 Max
2.54 ± 0.25
0.51 Min
1.11 Max
7.62
+ 0.13
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
10.06
10.5 Max
9
1
8
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
16
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DA
—
Conforms
0.24 g
Unit: mm
9.9
10.3 Max
9
1
8
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
0.15
*0.22 ± 0.03
0.20 ± 0.03
1.27
0.11
0.14 +– 0.04
1.75 Max
3.95
16
0.10
6.10 +– 0.30
1.08
0° – 8°
0.67
0.60 +– 0.20
0.25 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DN
Conforms
Conforms
0.15 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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