HITACHI HD74HC670

HD74HC670
4-by-4 Register File (with 3-state outputs)
Description
The HD74HC670, 16-bit register file is organized as 4 words of 4 bits each and separate on-chip decoding
is provided for addressing the four word locations to either write-in or retrieve data.
This permits simultaneous writing into one location and reading from another word location. Four data
inputs are available which are used to supply the 4-bit word to be stored. Location of the word is
determined by the write-address inputs A and B in conjunction with a write-enable signal. Data applied at
the inputs should be in its true form. That is, if a high-level signal is desired from the output, a high-level is
applied at the data input for that particular bit location. The latch inputs are arranged so that new data will
be accepted only if both internal address gate inputs are high. When this condition exists, data at the D
input is transferred to the latch output. When the write-enable input, (G W ) is high, the data inputs are
inhibited and their levels can cuase no change in the information stored in the internal latches. When the
read-enable input, (GR) is high, the data outputs are inhibited and go into the high-impedance state. The
individual address lines permit direct acquisition of data stored in any four of the latches. Four individual
decoding gates are used to complete the address for reading a word. when the read address is made in
conjunction with the read-enable signal, the word appears at the four outputs.
Features
•
•
•
•
•
High Speed Operation: tpd (Read Select to Q) = 21 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
HD74HC670
Function Table
Write Inputs
Word
WB
WA
GW
0
1
2
3
L
L
L
Q=D
Q0
Q0
Q0
L
H
L
Q0
Q=D
Q0
Q0
H
L
L
Q0
Q0
Q=D
Q0
H
H
L
Q0
Q0
Q0
Q=D
X
X
H
Q0
Q0
Q0
Q0
Read Inputs
Outputs
RB
RA
GR
Q1
Q2
Q3
Q4
L
L
L
W0 B 1
W0 B 2
W0 B 3
W0 B 4
L
H
L
W1 B 1
W1 B 2
W1 B 3
W1 B 4
H
L
L
W2 B 1
W2 B 2
W2 B 3
W2 B 4
H
H
L
W3 B 1
W3 B 2
W3 B 3
W3 B 4
X
X
H
Z
Z
Z
Z
H :
high level
L :
low level
X :
irrelevant
Z :
high impedance (off)
(Q = D) : The four selected internal flip-flop outputs will assume the states applied to the four external data
inputs.
Q0 :
The level of Q before the indicated input conditions were established.
W0 B 1 : The first bit of word 0, etc.
2
HD74HC670
Pin Arrangement
16
VCC
D1
15
Data
D1
D4
WA
14
WA
4
RB
WB
13
WB
RA
5
RA
CW
12
Write
Q4
6
Q4
CR
11
Read
Q3
7
Q3
Q1
10
Q1
GND
8
9
Q2
Data
Read
select
D2
1
D3
2
D3
D4
3
RB
D2
Write
select
Enable
Outputs
Q2
Outputs
(Top view)
Logic Diagram
To other three bits
D
G
Q
D
G
Q
D
G
Q
D
G
VCC
Q
Q
Data
WA
RA
WB
GR
GW
RB
3
HD74HC670
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Input voltage
VIH
2.0
1.5 —
—
1.5
—
V
4.5
3.15 —
—
3.15
—
6.0
4.2 —
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35 —
1.35
6.0
—
—
1.8
—
1.8
2.0
1.9 2.0 —
1.9
—
4.5
4.4 4.5 —
4.4
—
6.0
5.9 6.0 —
5.9
—
4.5
4.18 —
—
4.13
—
I OH = –6 mA
6.0
5.68 —
—
5.63
—
I OH = –7.8 mA
2.0
—
0.0 0.1
—
0.1
4.5
—
0.0 0.1
—
0.1
6.0
—
0.0 0.1
—
0.1
4.5
—
—
0.26 —
0.33
I OL = 6 mA
6.0
—
—
0.26 —
0.33
I OL = 7.8 mA
VIL
Output voltage
VOH
VOL
Test Conditions
V
V
V
Vin = VIH or VIL I OH = –20 µA
Vin = VIH or VIL I OL = 20 µA
Off-state output
current
I OZ
6.0
—
—
±0.5 —
±5.0
µA
Vin = VIN or VIL,
Vout = VCC or GND
Input current
Iin
6.0
—
—
±0.1 —
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
I CC
6.0
—
—
4.0
40
µA
Vin = VCC or GND, Iout = 0 µA
4
—
HD74HC670
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
VCC (V) Min Typ Max Min
Max
Unit
Test Conditions
Propagation delay t PLH
2.0
—
—
160 —
200
ns
Read select to Q
time
4.5
—
21
32
—
40
6.0
—
—
27
—
34
t PLH
2.0
—
—
200 —
250
ns
Write enable to Q
t PHL
4.5
—
24
40
—
50
6.0
—
—
34
—
43
t PLH
2.0
—
—
150 —
190
ns
Data to Q
t PHL
4.5
—
18
30
—
38
6.0
—
—
26
—
33
Item
Symbol
t PHL
Output enable
t ZH
2.0
—
—
150 —
190
time
t ZL
4.5
—
18
30
—
38
6.0
—
—
26
—
33
Output disable
t HZ
2.0
—
—
150 —
190
time
t LZ
4.5
—
17
30
—
38
6.0
—
—
26
—
33
2.0
80
—
—
100
—
4.5
16
—
—
20
—
6.0
14
—
—
17
—
2.0
60
—
—
75
—
4.5
12
4
—
15
—
6.0
10
—
—
13
—
2.0
60
—
—
75
—
4.5
12
—
—
15
—
6.0
10
—
—
13
—
2.0
50
—
—
63
—
4.5
10
6
—
13
—
6.0
9
—
—
11
—
2.0
50
—
—
63
—
4.5
10
—
—
13
—
6.0
9
—
—
11
—
Pulse width
Setup time
tw
t su
t su
Hold time
th
ns
ns
ns
ns
Data to Write enable
ns
Write select to Write enable
ns
Write enable to Data
ns
Write enable to Write select
5
HD74HC670
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) (cont)
Ta = –40 to
+85°C
Ta = 25°C
VCC (V) Min Typ Max Min
Max
Unit
Latch time for new t latch
2.5
100 —
—
125
—
ns
data
4.5
20
—
—
25
—
6.0
17
—
—
21
—
Item
Symbol
Output rise/fall
t TLH
2.0
—
—
75
—
95
time
t THL
4.5
—
5
15
—
19
6.0
—
—
13
—
16
—
—
5
10
—
10
Input capacitance
6
Cin
ns
pF
Test Conditions
Unit: mm
19.20
20.00 Max
1
7.40 Max
9
6.30
16
8
1.3
0.48 ± 0.10
2.54 Min 5.06 Max
2.54 ± 0.25
0.51 Min
1.11 Max
7.62
+ 0.13
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
10.06
10.5 Max
9
1
8
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
16
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DA
—
Conforms
0.24 g
Unit: mm
9.9
10.3 Max
9
1
8
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
0.15
*0.22 ± 0.03
0.20 ± 0.03
1.27
0.11
0.14 +– 0.04
1.75 Max
3.95
16
0.10
6.10 +– 0.30
1.08
0° – 8°
0.67
0.60 +– 0.20
0.25 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DN
Conforms
Conforms
0.15 g
Cautions
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intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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