Card Bus Socket Connectors IC9 Series ■Features 1. Compliant with PC Card Standards Complies with latest requirements of PC Card Standard. 2. Repairable Repairable terminations of connector solder joints after installation on the board. 3. Lead Offset Available with two board mounting levels of terminations, to allow use of different height components. ■Product Specifications Current rating 0.5 A Ratings Operating temperature -55ç to +85ç (Note 1) Voltage rating 125 V AC Operating humidity Item Storage temperature 95% R.H. or less (No condensation) Storage humidity Specification -10ç to +60ç (Note 2) 40 to 70% (Note 2) Conditions 1. Insulation resistance 1000M ohms min. 500 V DC 2. Withstanding voltage No flashover or insulation breakdown. 500 V AC / 1 minute 3. Contact resistance 40 m ohms max. (initial value) 1 mA 4. Vibration No electrical discontinuity of 100ns or more Frequency: 10 to 2000 Hz, single amplitude of 0.75 mm or acceleration of 147 m/s2(peak), 4 hours in each of the 3 directions. 5. Humidity (Steady state) Insulation resistance: 100 M ohms min. 96 hours at temperature of 40ç and humidity of 90% to 95% 6. Temperature cycle No damage, cracks, or parts looseness. -55ç, 30 min/15 to 30ç, within 5 min/85ç30 min /15 to 35ç, within 5 min, for 5 cycles 7. Durability (Insertion/withdrawal) Change of contact resistance from the start should be 20 m ohms max. 10000 cycles at 400 to 600 cycles per hour 8. Resistance to soldering heat No deformation of components affecting performance. Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials A48 Part Material Insulator PA Contact Phosphor bronze Ground plate Brass Finish Notes Black UL94V-0 Contact Area : gold plating Lead Area : solder plating Contact Area : gold plating Lead Area : solder plating --------------------------------- ■Ordering Information IC9 - 68 R D - 0.635 SFA 1 2 3 1 Series name : IC9 2 Number of contacts : 68 3 R : card connector 4 D : 2-row alignment 5 Lead pitch : 0.635 mm 6 Offset type 4 5 6 SF : 0.3 mm offset SFA : 0.9 mm offset BLead Offset ●Type with 0.3 mm offset ●Type with 0.9 mm offset BMounting Method 1. Place and solder the connector without the ground plate as shown in fig.(a). 2. Place the ground plate over the connector as shown in Fig.(b), making sure that the locking tabs are correctly aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock. Note: Care should be taken that the termination leads of the ground plate are not deformed or damaged during this operation. 3. Solder the termination leads of the ground plate to the board. A49 ■Card Connectors Socket Connector Ground Plate Combined Condition A50 Part Number CL No. A IC9-68RD-0.635SF 640-0901-2 0.3 IC9-68RD-0.635SFA 640-0902-5 0.9 BPCB mounting pattern BTemperature Profile 5 s.max 250 240ç Temperature(ç) 200 200ç Solder 160ç 150 Applicable Conditions Reflow system : IR reflow 150ç : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board Glass epoxy 60mm x 60mm x 1.6 mm 100 Metal mask thickness: 0.15 mm 50 Recommended temperature profile. (30s) 25ç 0 start (20 to 30s) (60 to 90s) Preheating (60s) 60 Soldering The temperature may be slightly changed according to the solder paste type and amount. 120 Time(seconds) A51