FAIRCHILD 74LCX573MTCX_NL

Revised March 2005
74LCX573
Low Voltage Octal Latch with 5V Tolerant
Inputs and Outputs
General Description
Features
The LCX573 is a high-speed octal latch with buffered common Latch Enable (LE) and buffered common Output
Enable (OE) inputs.
■ 5V tolerant inputs and outputs
The LCX573 is functionally identical to the LCX373 but has
inputs and outputs on opposite sides.
The LCX573 is designed for low voltage (3.3V or 2.5V)
applications with capability of interfacing to a 5V signal
environment. The LCX573 is fabricated with an advanced
CMOS technology to achieve high speed operation while
maintaining CMOS low power dissipation.
■ 2.3V–3.6V VCC specifications provided
■ 7.0 ns tPD max (VCC
3.3V), 10 PA ICC max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ r24 mA output drive (VCC
3.0V)
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds JEDEC 78 conditions
■ ESD performance:
Human body model ! 2000V
Machine model ! 200V
■ Leadless Pb-Free DQFN package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
Package
Package Description
Number
74LCX573WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX573SJ
M20D
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX573BQX
(Preliminary)
(Note 2)
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX573MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX573MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX573MTCX_NL
(Note 3)
MTC20
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 2: DQFN package available in Tape and Reel only.
Note 3: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012405
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74LCX573 Low Voltage Octal Latch with 5V Tolerant Inputs and Outputs
March 1995
74LCX573
Logic Symbol
Pin Descriptions
Pin Names
Description
D0–D7
Data Inputs
LE
Latch Enable Input
OE
3-STATE Output Enable Input
O0–O7
3-STATE Latch Outputs
Connection Diagrams
Truth Table
Pin Assignments for
SOIC, SOP, SSOP, TSSOP
Inputs
H
L
Z
X
O0
Pad Assignments for DQFN
Outputs
OE
LE
D
On
L
H
H
H
L
H
L
L
L
L
X
O0
H
X
X
Z
HIGH Voltage
LOW Voltage
High Impedance
Immaterial
Previous O0 before HIGH-to-LOW transition of Latch Enable
Functional Description
The LCX573 contains eight D-type latches with 3-STATE
output buffers. When the Latch Enable (LE) input is HIGH,
data on the Dn inputs enters the latches. In this condition
the latches are transparent, i.e., a latch output will change
state each time its D input changes. When LE is LOW the
latches store the information that was present on the D
inputs a setup time preceding the HIGH-to-LOW transition
of LE. The 3-STATE buffers are controlled by the Output
Enable (OE) input. When OE is LOW, the buffers are
enabled. When OE is HIGH the buffers are in the high
impedance mode but this does not interfere with entering
new data into the latches.
(Top View)
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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2
Symbol
Parameter
VCC
Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Value
IO
DC Output Source/Sink Current
ICC
DC Supply Current per Supply Pin
IGND
DC Ground Current per Ground Pin
TSTG
Storage Temperature
Conditions
0.5 to 7.0
0.5 to 7.0
0.5 to 7.0
0.5 to VCC 0.5
50
50
50
r50
r100
r100
65 to 150
Units
V
V
Output in 3-STATE
Output in HIGH or LOW State (Note 5)
VI GND
V
mA
VO GND
mA
VO ! VCC
mA
mA
mA
qC
Recommended Operating Conditions (Note 6)
Symbol
VCC
Parameter
VI
Input Voltage
VO
Output Voltage
IOH/IOL
Min
Max
Operating
2.0
3.6
Data Retention
1.5
3.6
Supply Voltage
Output Current
TA
Free-Air Operating Temperature
't/'V
Input Edge Rate, VIN
0.8V 2.0V, VCC
0
5.5
HIGH or LOW State
0
VCC
3-STATE
0
5.5
VCC
3.0V 3.6V
VCC
2.7V 3.0V
VCC
2.3V 2.7V
3.0V
r24
r12
r8
Units
V
V
V
mA
40
85
qC
0
10
ns/V
Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation.
Note 5: IO Absolute Maximum Rating must be observed.
Note 6: Unused (inputs or I/O's) must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
VIH
VIL
VOH
VOL
Parameter
Conditions
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
40qC to 85qC
Min
2.3 2.7
1.7
2.7 3.6
2.0
Max
0.7
2.7 3.6
0.8
100 PA
2.3 3.6
VCC 0.2
8 mA
2.3
1.8
IOH
12 mA
2.7
2.2
IOH
18 mA
3.0
2.4
2.2
24 mA
3.0
IOL
100 PA
2.3 3.6
IOL
8 mA
2.3
0.6
IOL
12 mA
2.7
0.4
IOL
16 mA
3.0
0.4
IOL
24 mA
IOZ
3-STATE Output Leakage
0 d VO d 5.5V
VI
V IH or VIL
VI or VO
5.5V
3
V
V
IOH
0 d VI d 5.5V
Units
V
2.3 2.7
IOH
Input Leakage Current
Power-Off Leakage Current
TA
(V)
IOH
II
IOFF
VCC
0.2
V
3.0
0.55
2.3 3.6
r5.0
PA
2.3 3.6
r5.0
PA
0
10
PA
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74LCX573
Absolute Maximum Ratings(Note 4)
74LCX573
DC Electrical Characteristics
Symbol
(Continued)
Parameter
VCC
Conditions
(V)
Quiescent Supply Current
ICC
VI
VCC or GND
3.6V d VI, VO d 5.5V (Note 7)
'ICC
Increase in ICC per Input
VIH
VCC 0.6V
40qC to 85qC
TA
Min
Units
Max
2.3 3.6
10
2.3 3.6
r10
2.3 3.6
500
PA
PA
Note 7: Outputs disabled or 3-STATE only.
AC Electrical Characteristics
TA
Symbol
VCC
Parameter
40qC to 85qC, RL
3.3V r 0.3V
CL
50pF
VCC
2.7V
CL
50pF
500 :
VCC
2.5 r 0.2V
CL
30pF
Min
Max
Min
Max
Min
Max
tPHL
Propagation Delay
1.5
8.0
1.5
9.0
1.5
9.6
tPLH
Dn to On
1.5
8.0
1.5
9.0
1.5
9.6
tPHL
Propagation Delay
1.5
8.5
1.5
9.5
1.5
10.5
tPLH
LE to On
1.5
8.5
1.5
9.5
1.5
10.5
tPZL
Output Enable Time
1.5
8.5
1.5
9.5
1.5
10.5
1.5
8.5
1.5
9.5
1.5
10.5
tPZH
tPLZ
Output Disable Time
tPHZ
1.5
6.5
1.5
7.0
1.5
7.8
1.5
6.5
1.5
7.0
1.5
7.8
Units
ns
ns
ns
ns
tS
Setup Time, Dn to LE
2.5
2.5
4.0
ns
tH
Hold Time, Dn to LE
1.5
1.5
2.0
ns
tW
LE Pulse Width
3.3
3.3
4.0
ns
tOSHL
Output to Output Skew (Note 8)
1.0
tOSLH
ns
1.0
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Dynamic Switching Characteristics
Symbol
VOLP
VOLV
Parameter
Quiet Output Dynamic Peak VOL
Quiet Output Dynamic Valley VOL
VCC
Conditions
25qC
TA
(V)
Typical
CL
50 pF, VIH
3.3V, VIL
0V
3.3
0.8
CL
30 pF, VIH
2.5V, VIL
0V
2.5
0.6
CL
50 pF, VIH
3.3V, VIL
0V
3.3
0.8
CL
30 pF, VIH
2.5V, VIL
0V
2.5
0.6
Units
V
V
Capacitance
Symbol
Parameter
Conditions
Typical
Units
0V or VCC
7
pF
CIN
Input Capacitance
VCC
Open, VI
COUT
Output Capacitance
VCC
3.3V, VI
0V or VCC
CPD
Power Dissipation Capacitance
VCC
3.3V, VI
0V or VCC, f
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4
10 MHz
8
pF
25
pF
74LCX573
AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
Test
Switch
tPLH, tPHL
Open
tPZL, tPLZ
6V at VCC 3.3 r 0.3V
VCC x 2 at VCC 2.5 r 0.2V
tPZH,tPHZ
GND
Waveform for Inverting and Non-Inverting Functions
3-STATE Output High Enable and
Disable Times for Logic
Propagation Delay. Pulse Width and trec Waveforms
Setup Time, Hold Time and Recovery Time for Logic
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tr = tf = 3ns)
Symbol
VCC
3.3V r 0.3V
2.7V
2.5V r 0.2V
Vmi
1.5V
1.5V
VCC/2
Vmo
1.5V
1.5V
VCC/2
Vx
VOL 0.3V
VOL 0.3V
VOL 0.15V
Vy
VOH 0.3V
VOH 0.3V
VOH 0.15V
5
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74LCX573
Schematic Diagram Generic for LCX Family
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Tape Format for DQFN
Package
Designator
BQX
Tape
Number
Cavity
Section
Cavities
Status
Cover Tape
Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
3000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
12 mm
A
B
C
D
N
W1
W2
13.0
0.059
0.512
0.795
2.165
0.488
0.724
(330.0)
(1.50)
(13.00)
(20.20)
(55.00)
(12.4)
(18.4)
7
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74LCX573
Tape and Reel Specification
74LCX573
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
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74LCX573
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
9
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74LCX573
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Package Number MLP020B
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74LCX573
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package Number MSA20
11
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74LCX573 Low Voltage Octal Latch with 5V Tolerant Inputs and Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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