Order this document from Logic Marketing SEMICONDUCTOR TECHNICAL DATA The MC88913 is a high–speed, low power, hex divide–by–two D–type flip–flop with two inverting and four non–inverting outputs that have closely matched propagation delays. With a TTL compatible buffered clock input that is common to all flip–flops, the MC88913 is ideal for use in high–frequency systems as a clock driver, providing multiple outputs that are synchronous. • • • • • • LOW SKEW CMOS CLOCK DRIVER Minimum Clock Input fMAX of 110MHz TTL Compatible Positive Edge–Triggered Clock Matched Outputs for Synchronous Applications Outputs Source/Sink 24mA Part–to–Part Skew of Less Than 4.0ns Guaranteed Rise and Fall Times for a Given Capacitive Load 14 1 N SUFFIX PLASTIC PACKAGE CASE 646–06 Pinout: 14–Lead Plastic (Top View) VCC GND Q5 Q4 Q3 GND GND 14 13 12 11 10 9 8 14 1 D SUFFIX PLASTIC PACKAGE CASE 751A–03 1 2 3 4 5 6 7 GND CLK Q0 Q1 Q2 GND GND MAXIMUM RATINGS* Parameter Symbol VCC DC Supply Voltage (Referenced to GND) Value Units –0.5 to +7.0 V Vin DC Input Voltage (Referenced to GND) –0.5 to VCC + 0.5 V Vout DC Output Voltage (Referenced to GND) –0.5 to VCC + 0.5 V DC Input Current, per Pin ± 20 mA Iin Iout DC Output Sink/Source Current, per Pin ± 50 mA ICC DC VCC or GND Current per Output Pin ± 50 mA PD Power Dissipation in Still Air 750 500 mW Tstg Storage Temperature –65 to +150 °C 260 °C TL Plastic Package** SOIC Package** Lead Temperature, 1mm from Case for 10s (Plastic or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. ** Derating: Plastic Package: –10mW/°C from 65°C to 125°C SOIC Package: –7.0mW/°C from 65°C to 125°C 11/93 Motorola, Inc. 1995 1 REV 3 MC88913 LOGIC DIAGRAM CLK CLK D CLK D CLK D CLK D CLK D CLK D Q Q Q Q Q Q Q Q0 Q1 Q2 Q3 Q4 Q5 NOTE: This diagram is provided only for understanding of logic operation and should not be used to estimate propagation delays RECOMMENDED OPERATING CONDITIONS Parameter Symbol VCC DC Supply Voltage (Referenced to GND) Vin, Vout DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature tr, tf Input Rise and Fall Time Vin from 0.8 to 2.0V Vmeas from 0.8 to 2.0V Min Max Unit 2.0 6.0 V 0 VCC V –40 +85 °C 0 0 10 8.0 ns/V DC CHARACTERISTICS (unless otherwise specified) Parameter Symbol Unit Condition ICC Maximum Quiescent Supply Current 80 µA VIN = VCC or GND VCC = 5.5V, TA = Worst Case ICC Maximum Quiescent Supply Current 8.0 µA VIN = VCC or GND VCC = 5.5V, TA = 25°C ICCT Maximum Additional ICC/Input 1.5 mA VIN = VCC –2.1V VCC = 5.5V, TA = Worst Case AC OPERATING REQUIREMENTS TA = 25°C CL = 50 pF Symbol tW Parameter CLK Pulse Width (HIGH to LOW) VCC (V) Min 5.0 3.0 Max TA = –40 to +85°C CL = 50 pF Min Max 3.0 Unit ns CAPACITANCE Symbol Parameter Typ Unit Condition CIN Input Capacitance 4.5 pF VCC = 5.0V CPD Power Dissipation Capacitance 30 pF VCC = 5.0V MOTOROLA 2 TIMING SOLUTIONS BR1333 — REV 5 MC88913 DC CHARACTERISTICS TA = +25°C Symbol Parameter VCC Typ TA = –40 to +85°C Guaranteed Max Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1V or VCC – 0.1V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1V or VCC – 0.1V VOH Minimum High Level 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V IOUT = –50µA V 3.86 4.86 3.76 4.76 *VIN = VIL or VIH IOH = –24mA –24mA 0.1 0.1 0.1 0.1 V IOUT = 50µA V 4.5 5.5 0.36 0.36 0.44 0.44 *VIN = VIL or VIH IOH = 24mA 24mA ±0.1 ±0.1 µA VI = VCC, GND 1.5 mA VI = VCC –2.1V 4.5 5.5 VOL Maximum Low Level Output Voltage 4.5 5.5 0.001 0.001 IIN Maximum Input 5.5 ICCT Maximum ICC/Input 5.5 IOLD Minimum Dynamic Output Current** 5.5 75 mA VOLD = 1.65V 5.5 –75 mA VOHD = 3.85V IOHD 0.6 * All outputs loaded; thresholds on inputs associated with output under test. ** Maximum test duration 20ms, one output at a time. AC CHARACTERISTICS (VCC = 5.0V ±10%) TA = 25°C CL = 50 pF Symbol Parameter VCC (V) Min fMAX Maximum Clock Frequency (50% Duty Cycle) 5.0 110 tPLH, tPHL Propagation Delay CLK to Qn, Qn 5.0 4.0 tPV Propagation Delay Variation CLK to Q0, Q1, Q2 (see Note 1) 5.0 Propagation Delay Variation CLK to All Outputs (see Note 1) tPS tOS trise tfall Max TA = –40 to +85°C CL = 50 pF Min Max 110 10.5 4.0 Unit MHz 11.5 ns 4.0 5.0 ns 5.0 4.5 5.5 ns Propagation Delay Skew (Q0, Q1, Q2) |tPHL Actual – tPLH Actual| 5.0 1.0 1.0 ns Propagation Delay Skew (All Outputs) |tPHL Actual – tPLH Actual| 5.0 1.5 1.5 ns Output–to–Output Skew (Q0, Q1, Q2) |tp Qn – tp Qm| (see Note 2) 5.0 1.0 1.0 ns Output–to–Output Skew (All Outputs) |tp Qn – tp Qm| (see Note 2) 5.0 1.5 1.5 ns Rise/Fall Time for Q0, Q1, Q2 (0.2 x VCC to 0.8 x VCC) 5.0 3.0 4.0 ns Rise/Fall Time for All Outputs (0.2 x VCC to 0.8 x VCC) 5.0 3.5 4.5 ns 1. For a given set of conditions (i.e., capacitive load, temperature and VCC) the variation from device to device is guaranteed to be less than or equal to the maximum. 2. Where tp Qn and tp Qm are the actual propagation delays (any combination of HIGH or LOW) for any two separate outputs from a given high transition of CLK. TIMING SOLUTIONS BR1333 — REV 5 3 MOTOROLA MC88913 OUTLINE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 646–06 ISSUE L 14 8 1 7 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. B A F DIM A B C D F G H J K L M N L C J N H G D K SEATING PLANE M D SUFFIX PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F –A – 14 1 P7 PL 0.25 (0.010) 7 G D 0.25 (0.010) M T F J M K 14 PL B S M R X 45° C SEATING PLANE B M A S MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0° 10° 1.01 0.39 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 8 –B – INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0° 10° 0.015 0.039 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7° 0° 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 7° 0° 0.228 0.244 0.010 0.019 Motorola reserves the right to make changes without further notice to any products herein. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] –TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MOTOROLA ◊ CODELINE 4 *MC88913/D* MC88913/D TIMING SOLUTIONS BR1333 — REV 5