SEMICONDUCTOR TECHNICAL DATA The MC10H113 is a Quad Exclusive OR Gate with an enable common to all four gates. The outputs may be wire–ORed together to perform a 4–bit comparison function (A = B). The enable is active LOW. L SUFFIX CERAMIC PACKAGE CASE 620–10 • Propagation Delay, 1.3 ns Typical • Power Dissipation 175 mW Typ/Pkg (No Load) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) 0 to VEE Vdc Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic LOGIC DIAGRAM E 4 9 2 5 ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° 6 Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 46 — 42 — 46 mA — — — 430 510 1100 — — — 270 320 740 — — — 270 320 740 0.5 — 0.5 — 0.3 — µA Input Current High Pins 5, 7, 11, 13 Pins 4, 6, 10, 12 Pin 9 IinH Input Current Low IinL VOH High Output Voltage L IN L E OUTPUT L L L H L H H L L H H H L L X X H L µA 10 14 11 –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc 12 –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc 13 High Input Voltage VOL VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Low Output Voltage 3 7 TRUTH TABLE 15 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 AC PARAMETERS Propagation Delay Data Enable Rise Time Fall Time tpd tr tf DIP PIN ASSIGNMENT ns 0.4 0.5 1.7 2.3 0.4 0.5 1.8 2.4 0.5 0.6 1.9 2.5 0.5 1.8 0.6 1.9 0.6 2.0 ns VCC1 1 16 VCC2 0.5 1.8 0.6 1.9 0.6 2.0 ns AOUT 2 15 DOUT BOUT 3 14 COUT AIN 4 13 DIN AIN 5 12 DIN BIN 6 11 CIN BIN 7 10 CIN VEE 8 9 NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. ENABLE Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 9/96 Motorola, Inc. 1996 2–213 REV 6 MC10H113 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M N S S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–214 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MECL Data DL122 — Rev 6 MC10H113 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 2–215 *MC10H113/D* MC10H113/D MOTOROLA