MC74VHC1GT04 Inverting Buffer / CMOS Logic Level Shifter with LSTTL–Compatible Inputs The MC74VHC1GT04 is a single gate inverting buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL–type input thresholds and the output has a full 5V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic–level translator from 3.0V CMOS logic to 5.0V CMOS Logic or from 1.8V CMOS logic to 3.0V CMOS Logic while operating at the high–voltage power supply. The MC74VHC1GT04 input structure provides protection when voltages up to 7V are applied, regardless of the supply voltage. This allows the MC74VHC1GT04 to be used to interface 5V circuits to 3V circuits. The output structures also provide protection when VCC = 0V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc. • High Speed: tPD = 3.8ns (Typ) at VCC = 5V • Low Power Dissipation: ICC = 2µA (Max) at TA = 25°C • TTL–Compatible Inputs: VIL = 0.8V; VIH = 2.0V • CMOS–Compatible Outputs: VOH > 0.8VCC; VOL < 0.1VCC @Load • Power Down Protection Provided on Inputs and Outputs • Balanced Propagation Delays • Pin and Function Compatible with Other Standard Logic Families • Latchup Performance Exceeds 300mA • ESD Performance: HBM > 1500V; MM > 200V NC 1 http://onsemi.com SC–88A / SOT–353 DF SUFFIX CASE 419A MARKING DIAGRAM VKd Pin 1 d = Date Code PIN ASSIGNMENT 1 NC 2 IN A 3 GND 4 OUT Y 5 VCC ORDERING INFORMATION 5 VCC See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. IN A 2 GND 3 4 OUT Y FUNCTION TABLE Figure 1. 5–Lead SOT–353 Pinout (Top View) LOGIC SYMBOL IN A 1 Semiconductor Components Industries, LLC, 1999 November, 1999 – Rev. 1 OUT Y 1 A Input Y Output L H H L Publication Order Number: MC74VHC1GT04/D MC74VHC1GT04 MAXIMUM RATINGS* Symbol Value Unit DC Supply Voltage Characteristics VCC –0.5 to +7.0 V DC Input Voltage VIN –0.5 to +7.0 V VOUT –0.5 to 7.0 –0.5 to VCC + 0.5 V IIK –20 mA IOK +20 mA IOUT +25 mA DC Supply Current, VCC and GND ICC +50 mA Power dissipation in still air, SC–88A † PD 200 mW Lead temperature, 1 mm from case for 10 s TL 260 °C DC Output Voltage VCC = 0 High or Low State Input Diode Current Output Diode Current (VOUT < GND; VOUT > VCC) DC Output Current, per Pin Storage temperature Tstg –65 to +150 °C * Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. †Derating — SC–88A Package: –3 mW/_C from 65_ to 125_C RECOMMENDED OPERATING CONDITIONS Characteristics DC Supply Voltage DC Input Voltage DC Output Voltage VCC = 0 High or Low State Operating Temperature Range Input Rise and Fall Time VCC = 3.3V ± 0.3V VCC = 5.0V ± 0.5V Symbol Min Max Unit VCC 4.5 5.5 V VIN 0.0 5.5 V VOUT 0.0 0.0 5.5 VCC V TA –55 +85 °C tr , tf 0 0 100 20 ns/V http://onsemi.com 2 MC74VHC1GT04 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Test Conditions (V) Min 1.4 2.0 2.0 VIH Minimum High–Level Input Voltage 3.0 4.5 5.5 VIL Maximum Low–Level Input Voltage 3.0 4.5 5.5 VOH Minimum High–Level Output Voltage VIN = VIH or VIL VOL Maximum Low–Level Output Voltage VIN = VIH or VIL TA ≤ 85°C TA = 25°C Typ Max Min 1.4 2.0 2.0 0.53 0.8 0.8 VIN = VIH or VIL IOH = –50µA 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = –4mA IOH = –8mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50µA 3.0 4.5 VIN = VIH or VIL IOL = 4mA IOL = 8mA Max TA ≤ 125°C Min 1.4 2.0 2.0 0.53 0.8 0.8 3.0 4.5 Max V 0.53 0.8 0.8 2.9 4.4 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V V 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V IIN Maximum Input Leakage Current VIN = 5.5V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 2.0 20 40 µA ICCT Quiescent Supply Current Input: VIN = 3.4V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5V 0.0 0.5 5.0 10 µA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Cload = 50 pF, Input tr = tf = 3.0ns) TA ≤ 85°C TA = 25°C Symbol tPLH, tPHL CIN Parameter Maximum Propogation Delay, Input A to Y Test Conditions Min Typ Max Min Max TA ≤ 125°C Min Max Unit ns VCC = 3.0 ± 0.3V CL = 15 pF CL = 50 pF 5.0 6.2 10.0 13.5 11.0 15.0 13.0 17.5 VCC = 5.0 ± 0.5V CL = 15 pF CL = 50 pF 3.8 4.2 6.7 7.7 7.5 8.5 8.5 9.5 5 10 10 10 Maximum Input Capacitance pF Typical @ 25°C, VCC = 5.0V CPD Power Dissipation Capacitance (Note 1.) 10 pF 1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 MC74VHC1GT04 TEST POINT 3.0V A OUTPUT 50% DEVICE UNDER TEST GND tPLH tPHL CL* VOH Y 50% VCC VOL *Includes all probe and jig capacitance Figure 2. Switching Waveforms Figure 3. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Circuit Indicator Temp Range Identifier Tech– nology Input Type Device Function Package Suffix Tape & Reel Suffix Package Type Tape and Reel Size MC74VHC1GT04DFT1 MC 74 VHC1G T 04 DF T1 SC–88A/ SOT–353 7–Inch/3000 Unit PACKAGE DIMENSIONS SC–88A / SOT–353 DF SUFFIX 5–LEAD PACKAGE CASE 419A–01 ISSUE B A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MM. G V 4 –B– S 1 2 3 D 5 PL 0.2 (0.008) M B M MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC ––– 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 0.5 mm (min) N J C K 0.4 mm (min) H INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC ––– 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.9 mm http://onsemi.com 4 0.65 mm 0.65 mm 5 DIM A B C D G H J K N S V MC74VHC1GT04 10 PITCHES CUMULATIVE TOLERANCE ON TAPE ±0.2 mm (±0.008”) P0 K P2 D t TOP COVER TAPE E A0 + K0 SEE NOTE 2 B1 SEE NOTE 2 F + B0 W + D1 FOR COMPONENTS 2.0 mm × 1.2 mm AND LARGER P EMBOSSMENT FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC AROUND B0 CENTER LINES OF CAVITY USER DIRECTION OF FEED *TOP COVER TAPE THICKNESS (t1) 0.10 mm (0.004”) MAX. R MIN. TAPE AND COMPONENTS SHALL PASS AROUND RADIUS “R” WITHOUT DAMAGE EMBOSSED CARRIER BENDING RADIUS 100 mm (3.937”) MAXIMUM COMPONENT ROTATION 10° EMBOSSMENT 1 mm MAX TYPICAL COMPONENT CAVITY CENTER LINE TAPE 1 mm (0.039”) MAX TYPICAL COMPONENT CENTER LINE 250 mm (9.843”) CAMBER (TOP VIEW) ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm Figure 4. Carrier Tape Specifications EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2) Tape Size B1 Max 8 mm 4.35 mm (0.171”) D D1 E F K P P0 P2 R T W 1.5 +0.1/ –0.0 mm (0.059 +0.004/ –0.0”) 1.0 mm Min (0.039”) 1.75 ±0.1 mm (0.069 ±0.004”) 3.5 ±0.5 mm (1.38 ±0.002”) 2.4 mm (0.094”) 4.0 ±0.10 mm (0.157 ±0.004”) 4.0 ±0.1 mm (0.156 ±0.004”) 2.0 ±0.1 mm (0.079 ±0.002”) 25 mm (0.98”) 0.3 ±0.05 mm (0.01 +0.0038/ –0.0002”) 8.0 ±0.3 mm (0.315 ±0.012”) 1. Metric Dimensions Govern–English are in parentheses for reference only. 2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10° within the determined cavity http://onsemi.com 5 MC74VHC1GT04 t MAX 13.0 mm ±0.2 mm (0.512” ±0.008”) 1.5 mm MIN (0.06”) A 20.2 mm MIN (0.795”) 50 mm MIN (1.969”) FULL RADIUS G Figure 5. Reel Dimensions REEL DIMENSIONS Tape Size 8 mm A Max G t Max 330 mm (13”) 8.400 mm, +1.5 mm, –0.0 (0.33”, +0.059”, –0.00) 14.4 mm (0.56”) DIRECTION OF FEED BARCODE LABEL POCKET Figure 6. Reel Winding Direction http://onsemi.com 6 HOLE MC74VHC1GT04 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS DIRECTION OF FEED Figure 7. Tape Ends for Finished Goods “T1” PIN ONE TOWARDS SPROCKET HOLE SC–88A/SOT–353 (5 Pin) DEVICE User Direction of Feed Figure 8. Reel Configuration http://onsemi.com 7 TAPE LEADER NO COMPONENTS 400 mm MIN MC74VHC1GT04 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). 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