K6F2008S2E Family CMOS SRAM Document Title 256Kx8 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft February 28, 2001 1.0 Finalize September 27, 2001 Final The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices. 1 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM 256Kx8 bit Super Low Power and Low Voltage Full CMOS Static RAM FEATURES GENERAL DESCRIPTION • Process Technology: Full CMOS • Organization: 256Kx8 • Power Supply Voltage: 2.3~2.7V • Low Data Retention Voltage: 1.5V(Min) • Three State Outputs • Package Type: 32-TSOP1-0813.4F The K6F2008S2E families are fabricated by SAMSUNG′s advanced Full CMOS process technology. The families support various operating temperature ranges and have various package types for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family Operating Temperature Vcc Range Speed(ns) Standby (ISB1, Typ) Operating (ICC1, Max) PKG Type K6F2008S2E-F Industrial(-40~85°C) 2.3~2.7V 701)/85ns 0.5µA2) 2mA 32-TSOP1-0813.4F 1. The parameter is measured with 30pF test load. 2. Typical value are measured at VCC=2.5V, TA=25°C, and not 100% tested. PIN DESCRIPTION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 32-sTSOP Type1-Forward Clk gen. OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 Address A11 A9 A8 A13 WE CS2 A15 VCC A17 A16 A14 A12 A7 A6 A5 A4 FUNCTIONAL BLOCK DIAGRAM Row select Data cont I/O1 I/O8 Precharge circuit. Memory array 1024 rows 256x8 columns I/O Circuit Column select Data cont Name Function CS1, CS2 Chip Select Input Name Function Address I/O1~I/O8 Data Inputs/Outputs OE Output Enable Vcc Power WE Write Enable Input Vss Ground CS1 CS2 WE OE A0~A17 Address Inputs Control logic SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice. 2 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM PRODUCT LIST Industrial Temperature Products(-40~85°C) Part Name Function K6F2008S2E-YF70 K6F2008S2E-YF85 32-sTSOP1-F, 70ns, 2.5V, LL 32-sTSOP1-F, 85ns, 2.5V, LL FUNCTIONAL DESCRIPTION CS 1 CS2 OE WE I/O Mode Power 1) X 1) X High-Z Deselected Standby X1) X1) High-Z Deselected Standby H H H High-Z Output Disable Active L H L H Dout Read Active L H L Din Write Active H X X1) L L 1) 1) X 1. X means don′t care (Must be high or low states) ABSOLUTE MAXIMUM RATINGS1) Item Voltage on any pin relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Storage temperature Operating Temperature Symbol Ratings Unit VIN,VOUT -0.2 to VCC+0.3V V VCC -0.2 to 3.0 V PD 1.0 W TSTG -65 to 150 °C TA -40 to 85 °C 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 3 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM RECOMMENDED DC OPERATING CONDITIONS1) Item Symbol Min Typ Max Unit Supply voltage Vcc 2.3 2.5 2.7 V Ground Vss 0 0 0 V Input high voltage VIH 2.0 - Vcc+0.2 2) V Input low voltage VIL -0.23) - 0.6 V Max Unit Note: 1. Industrial Product: TA=-40 to 85°C, unless otherwise specified. 2. Overshoot: Vcc+1.0V in case of pulse width≤20ns. 3. Undershoot: -1.0V in case of pulse width≤20ns. 4. Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE1) (f=1MHz, TA=25°C) Item Symbol Test Condition Min Input capacitance CIN VIN=0V - 8 pF Input/Output capacitance CIO VIO=0V - 10 pF 1. Capacitance is sampled, not 100% tested DC AND OPERATING CHARACTERISTICS Item Symbol Test Conditions Min Typ 1) Max Unit Input leakage current ILI VIN=Vss to Vcc -1 - 1 µA Output leakage current ILO CS1=VIH or CS2=VIL or OE=VIH or WE=VIL, VIO=Vss to Vcc -1 - 1 µA ICC1 Cycle time=1µs, 100% duty, I IO=0mA, CS1≤0.2V, CS2≥VCC-0.2V, VIN≤0.2V or VIN≥VCC-0.2V - - 2 mA ICC2 Cycle time=Min, 100% duty, IIO=0mA, CS1=VIL, CS2=VIH, VIN=VIL or VIH - - 12 mA - - 15 mA Output low voltage VOL IOL=0.5mA - - 0.4 V Output high voltage VOH IOH=-0.5mA 2.0 - - V ISB1 Other inputs=Vss to Vcc 1) CS1≥Vcc-0.2V, CS2≥Vcc-0.2V(CS1 controlled) or 2) 0V≤CS2≤0.2V CS2 controlled) - 0.5 5 µA Average operating current Standby Current(CMOS) 85ns 70ns 1. Typical value are measured at VCC=2.5V, TA=25°C, and not 100% tested. 4 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM AC OPERATING CONDITIONS VTM3) TEST CONDITIONS (Test Load and Test Input/Output Reference) R12) Input pulse level: 0.4 to 2.2V Input rising and falling time: 5ns Input and output reference voltage: 1.1V Output load (See right): CL=100pF+1TTL CL=30pF+1TTL CL1) R23) 1. Including scope and jig capacitance 2. R 1=3070Ω, R2 =3150Ω 3. VTM =2.3V AC CHARACTERISTICS(Vcc=2.3~2.7V, Industrial product: TA=-40 to 85°C) Speed Bins Parameter List Symbol Min Read Write Units 85ns 70ns1) Max Min Max Read Cycle Time tRC 70 - 85 - ns Address Access Time tAA - 70 - 85 ns Chip Select to Output tCO - 70 - 85 ns Output Enable to Valid Output tOE - 35 - 40 ns Chip Select to Low-Z Output tLZ 10 - 10 - ns Output Enable to Low-Z Output tOLZ 5 - 5 - ns Chip Disable to High-Z Output tHZ 0 25 0 25 ns Output Disable to High-Z Output tOHZ 0 25 0 25 ns Output Hold from Address Change tOH 10 - 10 - ns Write Cycle Time tWC 70 - 85 - ns Chip Select to End of Write tCW 60 - 70 - ns Address Set-up Time tAS 0 - 0 - ns Address Valid to End of Write tAW 60 - 70 - ns Write Pulse Width tWP 50 - 60 - ns Write Recovery Time tWR 0 - 0 - ns Write to Output High-Z tWHZ 0 20 0 25 ns Data to Write Time Overlap tDW 30 - 35 - ns Data Hold from Write Time tDH 0 - 0 - ns End Write to Output Low-Z tOW 5 - 5 - ns Typ2) Max Unit 1.5 - 2.7 V - 0.5 2 µA 0 - - tRC - - 1. The parameter is measured with 30pF test load. DATA RETENTION CHARACTERISTICS Item Symbol Vcc for data retention VDR Data retention current IDR Data retention set-up time tSDR Recovery time tRDR Test Condition CS1≥Vcc-0.2V1) Vcc=1.5V, CS1≥Vcc-0.2V1) See data retention waveform Min ns 1. 1) CS1≥Vcc-0.2V, CS2 ≥Vcc-0.2V(CS1 controlled) or 2) 0≤CS2 ≤0.2V(CS2 controlled). 2. Typical value are measured at TA=25°C and not 100% tested. 5 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM TIMING DIAGRAMS TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS1=OE=VIL, WE=VIH ) tRC Address tAA tOH Data Out Data Valid Previous Data Valid TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH) tRC Address tOH tAA tCO1 CS1 tHZ(1,2) CS2 tCO2 tOE OE Data out High-Z tOHZ tOLZ tLZ Data Valid NOTES (READ CYCLE) 1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. 2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ (Min.) both for a given device and from device to device interconnection. 6 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM TIMING WAVEFORM OF WRITE CYCLE(1) (WE Controlled) tWC Address tWR(4) tCW(2) CS1 tAW CS2 tCW(2) tWP(1) WE tAS(3) tDW tDH Data Valid Data in tWHZ Data out tOW Data Undefined TIMING WAVEFORM OF WRITE CYCLE(2) (CS1 Controlled) tWC Address tAS(3) tCW(2) tWR(4) CS 1 tAW CS 2 tWP(1) WE tDW Data in Data out tDH Data Valid High-Z High-Z 7 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM TIMING WAVEFORM OF WRITE CYCLE(3) (CS2 Controlled) tWC Address tAS(3) tCW(2) tWR(4) CS1 tAW CS2 tWP(2) tWP(1) WE tDW Data in Data out tDH Data Valid High-Z High-Z NOTES (WRITE CYCLE) 1. A write occurs during the overlap of a low CS1 , a high CS2 and a low WE. A write begins at the latest transition among CS1 goes low, CS2 going high and WE going low : A write end at the earliest transition among CS1 going high, CS 2 going low and WE going high, tWP is measured from the begining of write to the end of write. 2. tCW is measured from the CS1 going low or CS2 going high to the end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. t WR(1) applied in case a write ends as CS1 or WE going high tWR(2) applied in case a write ends as CS2 going to low. DATA RETENTION WAVE FORM CS1 controlled VCC tSDR Data Retention Mode tRDR 2.3V 2.0V VDR CS1≥VCC - 0.2V CS1 GND CS2 controlled Data Retention Mode VCC 2.3V CS 2 tSDR tRDR VDR CS2≤0.2V 0.4V GND 8 Revision 1.0 September 2001 K6F2008S2E Family CMOS SRAM PACKAGE DIMENSIONS Units: millimeters(inches) 0.20 0.008 +0.10 -0.05 +0.004 -0.002 0.10 MAX 0.004 32 PIN THIN SMALL OUTLINE PACKAGE TYPE I (0813.4F) 13.40 ±0.20 0.528 ±0.008 #1 #32 0.50 0.0197 #16 0.25 ) 0.010 8.00 0.315 8.40 0.331 MAX ( #17 1.00 ±0.10 0.039 ±0.004 0.25 TYP 0.010 11.80 ±0.10 0.465 ±0.004 +0.10 -0.05 0.006 +0.004 -0.002 0.15 0.05 0.002 MIN 1.20 0.047 MAX 0~8° 0.45~0.75 0.018~0.030 ( 9 0.50 ) 0.020 Revision 1.0 September 2001