SAMSUNG KM23V8105D

KM23V8105D(G)
CMOS MASK ROM
8M-Bit (1Mx8 /512Kx16) CMOS MASK ROM
FEATURES
GENERAL DESCRIPTION
• Switchable organization
1,048,576 x 8(byte mode)
524,288 x 16(word mode)
• Random access time/Page Access Time
3.3V Operation : 100/30ns(Max.)
3.0V Operation : 120/50ns(Max.)
• 4 Words / 8 bytes page access
• Supply voltage : single +3.0V/ single +3.3V
• Current consumption
Operating : 40mA(Max.)
Standby : 30µA(Max.)
• Fully static operation
• All inputs and outputs TTL compatible
• Three state outputs
• Package
-. KM23V8105D : 42-DIP-600
-. KM23V8105DG : 44-SOP-600
The KM23V8105D(G) is a fully static mask programmable ROM
fabricated using silicon gate CMOS process technology, and is
organized either as 1,048,576 x 8 bit(byte mode) or as 524,288
x 16 bit(word mode) depending on BHE voltage level.(See
mode selection table)
This device includes PAGE read mode function, page read
mode allows 4 words(or 8 bytes) of data to read fast in the
same page, CE and A2 ~ A18 should not be changed.
This device operates with 3.0V or 3.3V power supply, and all
inputs and outputs are TTL compatible.
Because of its asynchronous operation, it requires no external
clock assuring extremely easy operation.
It is suitable for use in program memory of microprocessor, and
data memory, character generator.
The KM23V8105D is packaged in a 42-DIP and the
KM23V8105DG in a 44-SOP.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
A18
.
.
.
.
.
.
.
.
A2
A0~A1
A-1
X
BUFFERS
AND
DECODER
MEMORY CELL
MATRIX
(524,288x16/
1,048,576x8)
Y
BUFFERS
AND
DECODER
SENSE AMP.
DATA OUT
BUFFERS
. . .
A18
1
42 N.C
N.C 1
44 N.C
A17
2
41 A8
A18
2
43 N.C
A7
3
40 A9
A17
3
42 A8
A6
4
39 A10
A7
4
41 A9
A5
5
38 A11
A6
5
40 A10
A4
6
37 A12
A5
6
39 A11
A3
7
36 A13
A4
7
38 A12
A2
8
35 A14
A3
8
37 A13
A1
9
34 A15
A2
9
36 A14
A0 10
33 A16
A1 10
35 A15
CE 11
VSS 12
CE
OE
Q0/Q8
CONTROL
LOGIC
BHE
Pin Name
A0 - A1
A2 - A18
Pin Function
Page Address Inputs
Address Inputs
Q7/Q15
DIP
OE 13
Q15 /A-1
Q0 14
29 Q7
Q8 15
28 Q14
Q1 16
27 Q6
Q9 17
26 Q13
Q2 18
25 Q5
Q10 19
24 Q12
Q3 20
23 Q4
BHE
22 VCC
Data Outputs
Output 15(Word mode)/
LSB Address(Byte mode)
Word/Byte selection
CE
Chip Enable
OE
Output Enable
VCC
Power
VSS
Ground
N.C
No Connection
31 VSS
30 Q15/A-1
Q11 21
Q0 - Q14
32 BHE
A0 11
CE 12
SOP
34 A16
33 BHE
VSS 13
32 VSS
OE 14
31 Q15/A-1
Q0 15
30 Q7
Q8 16
29 Q14
Q1 17
28 Q6
Q9 18
27 Q13
Q2 19
26 Q5
Q10 20
25 Q12
Q3 21
24 Q4
Q11 22
23 VCC
KM23V8105D
KM23V8105DG
KM23V8105D(G)
CMOS MASK ROM
ABSOLUTE MAXIMUM RATINGS
Item
Voltage on Any Pin Relative to VSS
Symbol
Rating
Unit
VIN
-0.3 to +4.5
V
Temperature Under Bias
TBIAS
-10 to +85
°C
Storage Temperature
TSTG
-55 to +150
°C
NOTE : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to th
e
conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extend
ed periods may
affect device reliability.
RECOMMENDED OPERATING CONDITIONS (Voltage reference to VSS, TA=0 to 70°C)
Symbol
Min
Typ
Max
Unit
Supply Voltage
Item
VCC
2.7/3.0
3.0/3.3
3.3/3.6
V
Supply Voltage
VSS
0
0
0
V
DC CHARACTERISTICS
Min
Max
Unit
Operating Current
Parameter
Symbol
ICC
CE=OE=VIL, all outputs open
-
40
mA
Standby Current(TTL)
ISB1
CE=VIH, all outputs open
-
500
µA
Standby Current(CMOS)
ISB2
CE=VCC, all outputs open
-
30
µA
ILI
VIN=0 to VCC
-
10
µA
Output Leakage Current
ILO
VOUT=0 to VCC
Input High Voltage, All Inputs
VIH
Input Leakage Current
Test Conditions
-
10
µA
2.0
VCC+0.3
V
Input Low Voltage, All Inputs
VIL
-0.3
0.6
V
Output High Voltage Level
VOH
IOH=-400µA
2.4
-
V
Output Low Voltage Level
VOL
IOL=2.1mA
-
0.4
V
NOTE : Minimum DC Voltage(VIL) is -0.3V an input pins. During transitions, this level may undershoot to -2.0V for periods <20ns.
Maximum DC voltage on input pins(VIH) is VCC+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
MODE SELECTION
CE
OE
BHE
Q15/A-1
Mode
Data
Power
H
X
X
X
Standby
High-Z
Standby
L
H
L
L
X
X
Operating
High-Z
Active
H
Output
Operating
Q0~Q15 : Dout
Active
L
Input
Operating
Q0~Q7 : Dout
Q8~Q14 : Hi-Z
Active
Max
Unit
CAPACITANCE (TA=25°C, f=1.0MHz)
Item
Output Capacitance
Input Capacitance
Symbol
Test Conditions
COUT
VOUT=0V
-
12
pF
CIN
VIN=0V
-
12
pF
NOTE : Capacitance is periodically sampled and not 100% tested.
MIN
KM23V8105D(G)
CMOS MASK ROM
AC CHARACTERISTICS (TA=0°C to +70°C, VCC=3.3V/3.0V±0.3V, unless otherwise noted.)
TEST CONDITIONS
Item
Value
Input Pulse Levels
0.45V to 2.4V
Input Rise and Fall Times
10ns
Input and Output timing Levels
1.5V
Output Loads
1 TTL Gate and CL=100pF
READ CYCLE
Item
Symbol
Vcc=3.3V±0.3V
Min
Max
Min
Unit
Max
Read Cycle Time
tRC
Chip Enable Access Time
tACE
100
120
ns
Address Access Time
tAA
100
120
ns
Page Address Access Time
tPA
30
50
ns
Output Enable Access Time
tOE
30
50
ns
Output or Chip Disable to
Output High-Z
tDF
20
20
ns
Output Hold from Address Change
tOH
NOTE : Page Address is determined as below.
Word mode (BHE = VIH) : A0, A1
Byte mode (BHE = VIL) : A-1, A0, A1
100
Vcc=3.0V±0.3V
0
120
0
ns
ns
KM23V8105D(G)
CMOS MASK ROM
TIMING DIAGRAM
READ
ADD
A0~A18
A-1(*1)
ADD2
ADD1
tRC
tDF(*3)
tACE
CE
tOE
tAA
OE
tOH
DOUT
D0~D7
D8~D15(*2)
VALID DATA
VALID DATA
PAGE READ
CE
tDF(*3)
OE
∼
∼
ADD
A2~A18
∼
ADD
A0,A1
A-1(*1)
1 st
2 nd
∼
tAA
tPA
∼
VALID DATA
VALID DATA
VALID DATA
VALID DATA
∼
DOUT
D0~D7
D8~D15(*2)
3 rd
NOTES :
*1. Byte Mode only. A-1 is Least Significant Bit Address.(BHE = VIL)
*2. Word Mode only.(BHE = VIH)
*3. tDF is defined as the time at which the outputs achieve the open circuit condition and is not referenced to V
OH or VOL level.
KM23V8105D(G)
CMOS MASK ROM
PACKAGE DIMENSIONS
42-DIP-600
0.25 +0.10
-0.05
0.010 +0.004
-0.002
#42
#22
#1
#21
15.24
0.600
13.80±0.20
0.543±0.008
3.91±0.20
0.154±0.008
5.08
0.200MAX
52.82 MAX
2.080
52.42±0.20
2.064±0.008
0.46±0.10
0.018±0.004
1.27±.10
0.050±0.004
( 0.81 )
0.032
0~15°
2.54
0.100
3.1±0.30
0.122±0.012
0.38 MIN
0.015
44-SOP-600
0~8°
#23
15.24
0.600
#44
16.04±0.30 12.60±0.20
0.631±0.012 0.496±0.008
#1
#22
+0.10
-0.05
0.008+0.004
-0.002
0.20
2.80±0.20
0.110±0.008
3.10
0.122 MAX
28.95
MAX
1.140
28.50±0.20
1.122±0.008
0.10 MAX
0.004 MAX
( 0.915 )
0.036
0.40 +0.100
-0.050
0.016+0.004
-0.002
1.27
0.050
0.05
MIN
0.002
0.80±0.20
0.031±0.008