DRAM MODULE KMM5364003CSW/CSWG 4Byte 4Mx36 SIMM (4Mx16 & Quad CAS 4Mx4 base) Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM5364003CSW/CSWG DRAM MODULE KMM5364003CSW/CSWG KMM5364003CSW/CSWG Fast Page Mode 4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung KMM5364003C is a 4Mx36bits Dynamic RAM high density memory module. The Samsung KMM5364003C consists of two CMOS 4Mx16bits and one CMOS Quad CAS 4Mx4bits DRAMs in TSOP packages mounted on a 72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM5364003C is a Single In-line Memory Module with edge connections and is intended for mounting into 72 pin edge connector sockets. • Part Identification PERFORMANCE RANGE • JEDEC standard PDpin & pinout - KMM5364003CSW(4K cycles/64ms Ref, TSOP, Solder) - KMM5364003CSWG(4K cycles/64ms Ref, TSOP, Gold) • Fast Page Mode Operation • CAS-before-RAS & Hidden Refresh capability • RAS-only refresh capability • TTL compatible inputs and outputs • Single +5V±10% power supply • PCB : Height(1000mil), single sided component Speed tRAC tCAC tRC tPC -5 50ns 13ns 90ns 35ns -6 60ns 15ns 110ns 40ns PIN CONFIGURATIONS Pin Symbol Pin Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 VSS DQ0 DQ18 DQ1 DQ19 DQ2 DQ20 DQ3 DQ21 Vcc NC A0 A1 A2 A3 A4 A5 A6 A10 DQ4 DQ22 DQ5 DQ23 DQ6 DQ24 DQ7 DQ25 A7 A11 Vcc A8 A9 NC RAS2 DQ26 DQ8 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 DQ17 DQ35 Vss CAS0 CAS2 CAS3 CAS1 RAS0 NC NC W NC DQ9 DQ27 DQ10 DQ28 DQ11 DQ29 DQ12 DQ30 DQ13 DQ31 Vcc DQ32 DQ14 DQ33 DQ15 DQ34 DQ16 NC PD1 PD2 PD3 PD4 NC Vss PIN NAMES Pin Name Function A0 - A11 Address Inputs DQ0 - 35 Data In/Out W Read/Write Enable RAS0, RAS2 Row Address Strobe CAS0 - CAS3 Column Address Strobe PD1 -PD4 Presence Detect Vcc Power(+5V) Vss Ground NC No Connection PRESENCE DETECT PINS (Optional) Pin 50NS 60NS PD1 PD2 PD3 PD4 Vss NC Vss Vss Vss NC NC NC SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice. DRAM MODULE KMM5364003CSW/CSWG FUNCTIONAL BLOCK DIAGRAM RAS RAS0/RAS2 47Ω LCAS CAS0 47Ω CAS1 UCAS DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ0 DQ1 DQ2 DQ3 DQ8 DQ17 DQ26 DQ35 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ27 DQ28 DQ29 DQ30 DQ31 DQ32 DQ33 DQ34 U0 OE W A0-A11 RAS CAS0 CAS1 U1 CAS2 CAS3 W A0-A11 RAS 47Ω LCAS CAS2 47Ω CAS3 UCAS U2 OE W A0-A11 W A0-A11 Vcc 0.1 or 0.22uF Capacitor for each DRAM Vss To all DRAMs DRAM MODULE KMM5364003CSW/CSWG ABSOLUTE MAXIMUM RATINGS * Item Voltage on any pin relative to VSS Voltage on VCC supply relative to VSS Storage Temperature Power Dissipation Short Circuit Output Current Symbol VIN, VOUT VCC Tstg Pd IOS Rating -1 to +7.0 -1 to +7.0 -55 to +125 3 50 Unit V V °C W mA * Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for intended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS (Voltage referenced to VSS, TA = 0 to 70°C) Item Symbol Min VCC VSS VIH VIL 4.5 0 2.4 Supply Voltage Ground Input High Voltage Input Low Voltage -1.0 *2 Typ Max Unit 5.0 0 - 5.5 0 V V V V VCC*1 0.8 *1 : VCC+2.0V at pulse width≤20ns, which is measured at VCC. *2 : -2.0V at pulse width≤20ns, which is measured at VSS. DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted) Symbol Speed ICC1 KMM5364003CSW/CSWG Unit Min Max -5 -6 - 330 300 mA mA ICC2 Don′t care - 6 mA ICC3 -5 -6 - 330 300 mA mA ICC4 -5 -6 - 220 190 mA mA ICC5 Don′t care - 3 mA ICC6 -5 -6 - 330 300 mA mA II(L) IO(L) Don′t care -10 -5 10 5 uA uA VOH VOL Don′t care 2.4 - 0.4 V V ICC1 : Operating Current * (RAS, CAS, Address cycling @tRC=min) ICC2 : Standby Current (RAS=CAS=W=V IH) ICC3 : RAS Only Refresh Current * (CAS=VIH, RAS cycling @tRC=min) ICC4 : Fast Page Mode Current * (RAS=VIL, CAS cycling : tPC=min) ICC5 : Standby Current (RAS=CAS=W=Vcc-0.2V) ICC6 : CAS-Before-RAS Refresh Current * (RAS and CAS cycling @tRC=min) I(IL) : Input Leakage Current (Any input 0≤VIN≤Vcc+0.5V, all other pins not under test=0 V) I(OL) : Output Leakage Current(Data Out is disabled, 0V≤VOUT≤Vcc) VOH : Output High Voltage Level (IOH = -5mA) VOL : Output Low Voltage Level (IOL = 4.2mA) * NOTE : ICC1, ICC3, ICC4 and I CC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open. ICC is specified as an average current. In ICC1 and ICC3, address can be changed maximum once while RAS=VIL. In ICC4, address can be changed maximum once within one Fast page mode cycle time, tPC. DRAM MODULE KMM5364003CSW/CSWG CAPACITANCE (TA = 25°C, VCC=5V, f = 1MHz) Item Input capacitance[A0-A11] Input capacitance[W] Input capacitance[RAS0/RAS2] Input capacitance[CAS0 - CAS3] Input/Output capacitance[DQ0 - 35] Symbol CIN1 CIN2 CIN3 CIN4 CDQ Min Max - 25 31 31 24 17 Unit pF pF pF pF pF AC CHARACTERISTICS (0°C≤TA≤70°C, VCC=5.0V±10%. See notes 1,2.) Test condition : Vih/Vil=2.6/0.8V, Voh/Vol=2.4/0.4V, output loading CL=100pF Parameter Random read or write cycle time Access time from RAS Access time from CAS Access time from column address CAS to output in Low-Z Output buffer turn-off delay Transition time(rise and fall) RAS precharge time RAS pulse width RAS hold time CAS hold time CAS pulse width RAS to CAS delay time RAS to column address delay time CAS to RAS precharge time Row address set-up time Row address hold time Column address set-up time Column address hold time Column address to RAS lead time Read command set-up time Read command hold referenced to CAS Read command hold referenced to RAS Write command hold time Write command pulse width Write command to RAS lead time Write command to CAS lead time Data set-up time Data hold time Refresh period Write command set-up time CAS setup time(CAS-before-RAS refresh) CAS hold time(CAS-before-RAS refresh) RAS to CAS precharge time Access time from CAS precharge Symbol tRC tRAC tCAC tAA tCLZ tOFF tT tRP tRAS tRSH tCSH tCAS tRCD tRAD tCRP tASR tRAH tASC tCAH tRAL tRCS tRCH tRRH tWCH tWP tRWL tCWL tDS tDH tREF tWCS tCSR tCHR tRPC tCPA -5 Min -6 Max 90 Max 110 Unit Note ns 50 60 ns 3,4,10 13 15 ns 3,4,5 25 30 ns 3,10 0 0 0 13 1 50 30 50 Min ns 3 0 15 ns 6 1 50 ns 2 40 10K 60 13 15 50 60 ns 10K ns ns ns 13 10K 15 10K ns 20 37 20 45 ns 4 15 25 15 30 ns 10 5 5 ns 0 0 ns 10 10 ns 0 0 ns 10 10 ns 25 30 ns 0 0 ns 0 0 ns 8 0 0 ns 8 10 10 ns 10 10 ns 15 15 ns 13 15 ns 0 0 ns 9 ns 9 10 10 64 0 64 ms 0 ns ns 5 5 10 10 ns 5 5 ns 30 35 ns 7 3 DRAM MODULE KMM5364003CSW/CSWG AC CHARACTERISTICS (0°C≤TA≤70°C, VCC=5.0V±10%. See notes 1,2.) Test condition : Vih/Vil=2.6/0.8V, Voh/Vol=2.4/0.4V, output loading CL=100pF Parameter Fast page mode cycle time CAS precharge time(Fast page cycle) RAS pulse width(Fast page cycle) W to RAS precharge time(C-B-R refresh) W to RAS hold time(C-B-R refresh) Symbol tPC tCP tRASP tWRP tWRH -5 Min -6 Max 35 Max 40 10 50 Min 60 Note ns 10 200K Unit ns 200K ns 10 10 ns 10 10 ns NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 6. This parameter defines the time at which the output achieves the open circuit condition and is not referenced to VOH or VOL. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Transition times are measured between VIH(min) and VIL(max) and are assumed to be 5ns for all inputs. 7. tWCS is non-restrictive operating parameter. It is included in the data sheet as electrical characteristics only. If tWCS≥tWCS(min), the cycle is an early write cycle and the data out pin will remain high impedance for the duration of the cycle. 3. Measured with a load equivalent to 2 TTL loads and 100pF. 8. Either tRCH or tRRH must be satisfied for a read cycle. 4. Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only. If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. 5. Assumes that tRCD≥tRCD(max). 9. These parameters are referenced to the CAS leading edge in early write cycles. 10. Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as reference point only. If tRAD is greater than the specified tRAD(max) limit, then access time is controlled by tAA. DRAM MODULE KMM5364003CSW/CSWG READ CYCLE tRC tRAS RAS tRP VIH VIL - tCSH tCRP CAS tRCD tCRP tRSH tCAS VIH VIL - tRAD tASR A VIH VIL - tRAH tASC tRAL tCAH COLUMN ADDRESS ROW ADDRESS tRCH tRCS W tRRH VIH VIL - tOFF tAA OE VIH - tOEZ tOEA VIL - tCAC DQ VOH VOL - tRAC OPEN tCLZ DATA-OUT Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG WRITE CYCLE ( EARLY WRITE ) NOTE : DOUT = OPEN tRAS RAS tRC tRP VIH VIL - tCSH tCRP CAS tRCD tRSH tCAS VIH VIL - tRAD tASR A tCRP VIH VIL - tRAH tASC ROW ADDRESS tRAL tCAH COLUMN ADDRESS tCWL tRWL tWCS W OE tWP VIL - VIH VIL - tDS DQ tWCH VIH - VIH VIL - tDH DATA-IN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG WRITE CYCLE ( OE CONTROLLED WRITE ) NOTE : DOUT = OPEN tRC tRAS RAS tRP VIH VIL - tCSH tCRP CAS tRSH tCAS VIH VIL - VIH VIL - tCRP tRAD tASR A tRCD tRAH tRAL tASC tCAH COLUMN ADDRESS ROW ADDRESS tCWL tRWL W OE VIH - tWP VIL - VIH VIL - tOED tOEH tDS DQ VIH VIL - tDH DATA-IN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG READ - MODIFY - WRTIE CYCLE tRWC tRP tRAS VIH - RAS VIL - tCRP tRCD tRSH tCAS VIH - CAS tRAD VIL - tASR tRAH tASC tCAH tCSH VIH - A VIL - ROW ADDR COLUMN ADDRESS tRWL tCWL tAWD tCWD W OE VIH - tWP VIL - tRWD tOEA VIH VIL - tCLZ tCAC tAA DQ VI/OH VI/OL - tOED tOEZ tRAC VALID DATA-OUT tDS tDH VALID DATA-IN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG FAST PAGE READ CYCLE NOTE : DOUT = OPEN tRP tRASP RAS VIH - tRHCP VIL - ¡ó tCRP CAS VIH - VIH VIL - tCP tCAS tCAS tRAD tASC VIL - tASR A tPC tCP tRCD tRSH tCAS ¡ó tCSH tRAH tCAH ROW ADDR tASC COLUMN ADDRESS tCAH COLUMN ADDRESS tASC ¡ó tCAH COLUMN ADDRESS ¡ó tRRH tRCS W tRCH tRCS VIL - tCAC tOEA VIH VIL - VOH VOL - tCAC tOEA ¡ó ¡ó tAA tAA DQ tRCH ¡ó VIH - tCAC tOEA OE tRCS tRAC tCLZ tOEZ VALID DATA-OUT tOFF tCLZ tOEZ VALID DATA-OUT tAA tOFF tCLZ tOFF tOEZ VALID DATA-OUT Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG FAST PAGE WRITE CYCLE ( EARLY WRITE ) NOTE : DOUT = OPEN tRP tRASP RAS tRHCP VIH VIL - ¡ó tPC tCRP CAS VIH - tRAD tASC VIH VIL - tCSH tCAH tRAH ROW ADDR tASC COLUMN ADDRESS VIH - tWCH tCAH tASC ¡ó tWCS tWP ¡ó tWCH tWP tCAH COLUMN ADDRESS tWCS ¡ó tWCH tWP VIL - ¡ó VIL - VIH VIL - tCWL tRWL tCWL VIH - ¡ó tDS DQ tCAS COLUMN ADDRESS tCWL OE tRSH ¡ó tWCS W tCP tCAS tCAS VIL - tASR A tPC tCP tRCD tDH VALID DATA-IN tDS tDH VALID DATA-IN tDS tDH ¡ó VALID DATA-IN ¡ó Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG FAST PAGE READ - MODIFY - WRITE CYCLE tRP tRASP RAS VIH - tCSH VIL - tRSH tRCD CAS tCP VIH - tCRP tCAS tCAS VIL - tRAD tPRWC tRAH tASR A VIH VIL - ROW ADDR tCAH tASC COL. ADDR COL. ADDR tRWL tRCS W tRAL tCAH tASC tCWL VIH - tCWL tWP VIL - tWP tCWD tCWD tAWD OE tAWD tCPWD tRWD tOEA VIH - tOEA VIL - tOED tCAC tCAC tAA tRAC DQ tOEZ tDH tOED tDH tAA tDS tDS tOEZ VI/OH VI/OL - tCLZ tCLZ VALID DATA-OUT VALID DATA-IN VALID DATA-OUT VALID DATA-IN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG RAS - ONLY REFRESH CYCLE NOTE : W, OE, DIN = Don′t care DOUT = OPEN tRAS RAS tRC tRP VIH VIL - tRPC tCRP CAS VIH VIL - tASR A tCRP VIH VIL - tRAH ROW ADDR CAS - BEFORE - RAS REFRESH CYCLE NOTE : OE, A = Don′t care tRC tRP RAS tRAS tRP VIH VIL - tRPC tCP CAS tRPC tCSR VIH - tWRP W tCHR VIL - tWRH VIH VIL - tOFF DQ VOH VOL - OPEN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG HIDDEN REFRESH CYCLE ( READ ) tRC tRC tRP tRAS RAS VIH VIL - tCRP CAS tRP tRAS tRCD tRSH tCHR VIH VIL - tRAD tASR A VIH VIL - tRAH tASC ROW ADDRESS tCAH COLUMN ADDRESS tWRH tRCS W tRRH tWRP VIH VIL - tAA OE VIH - tOEA VIL - tOFF tCAC tRAC DQ VOH VOL - OPEN tCLZ tOEZ DATA-OUT Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG HIDDEN REFRESH CYCLE ( WRITE ) NOTE : DOUT = OPEN tRC RAS VIH - tRP tRCD tRSH tCHR VIH VIL - tRAD tASR A tRAS VIL - tCRP CAS tRC tRP tRAS VIH VIL - tRAH tASC ROW ADDRESS tCAH COLUMN ADDRESS tWRH tWRP W OE VIH - tWCS tWCH tWP VIL - VIH VIL - tDS DQ VIH VIL - tDH DATA-IN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG CAS-BEFORE-RAS REFRESH COUNTER TEST CYCLE tRP VIH - RAS tRAS VIL VIH - CAS tCPT tCSR tRSH tCAS tCHR VIL - tRAL tASC VIH - A VIL - READ CYCLE tWRP tWRH tRRH tAA tRCS tRCH tCAC VIH - W VIL VIH - OE VIL - tOEA tCLZ VOH - DQ tCAH COLUMN ADDRESS tOEZ DATA-OUT VOL - WRITE CYCLE W tOFF tWRP tRWL tWRH VIH - tCWL tWCS tWCH VIL - tWP OE VIH VIL - tDS DQ tDH VIH DATA-IN VIL - READ-MODIFY-WRITE tWRP W tWRH tAWD tRCS tCWL tCWD VIH - tRWL tWP tCAC VIL - tAA tOEA OE VIH - tOED VIL - tCLZ DQ tOEZ tDH tDS VI/OH VI/OL VALID DATA-OUT VALID DATA-IN Don′t care NOTE : This timing diagram is applied to all devices besides 16M DRAM 4th & 64M DRAM. Undefined DRAM MODULE KMM5364003CSW/CSWG CAS - BEFORE - RAS SELF REFRESH CYCLE NOTE : OE, A = Don′t care tRP RAS tRASS tRPS VIH VIL - tRPC tRPC tCP CAS tCHS VIH - tCSR VIL - tOFF DQ VOH - OPEN VOL - tWRP W tWRH VIH VIL - TEST MODE IN CYCLE NOTE : OE, A = Don′t care tRC tRP RAS tRAS tRP VIH VIL - tRPC tCP CAS tRPC VIH - tCSR tWTS W tCHR VIL - tWTH VIH VIL - tOFF DQ VOH VOL - OPEN Don′t care Undefined DRAM MODULE KMM5364003CSW/CSWG PACKAGE DIMENSIONS Units : Inches (millimeters) 4.250(107.95) 3.984(101.19) .133(3.38) .125 DIA±.002(3.18±.051) R.062(1.57) .400(10.16) 1.000(25.40) .250(6.35) .080(2.03) .250(6.35) R.062±.004(R1.57±.10) .250(6.35) 3.750(95.25) ( Front view ) ( Back view ) Gold/Solder Plating Lead .100(2.54) MAX .010(.25)MAX .050(1.27) .041±.004(1.04±.10) 0.125 MIN (3.20MIN) .054(1.37) .047(1.19) Tolerances : ±.005(.13) unless otherwise specified NOTE : The used device is 4Mx16 & Quad CAS 4Mx4 DRAM, TSOPII DRAM Part No. : KMM5364003CSW/CSWG -- KM416C4100CS & KM44C4003CS(300 mil)