M368L1713CTL 184pin Unbuffered DDR SDRAM MODULE 128MB DDR SDRAM MODULE (16Mx64 based on 16Mx8 DDR SDRAM) Unbuffered 184pin DIMM 64-bit Non-ECC/Parity Revision 0.3 May. 2002 Rev. 0.3 May. 2002 M368L1713CTL 184pin Unbuffered DDR SDRAM MODULE Revision History Revision 0.0 (Oct. 2001) 1. First release Revision 0.1 (Nov. 2001) 1. Added DDR333 function 2. Updated DDR333 test specification 3. Deleted typical current in IDD spec. table 4. Included address and control input setup/hold time(tIS/tIH) at slow slew rate in DDR200/266 AC specification 5. Deleted Exit self refresh to write command(tXSW) in DDR200/266 AC specification 6. Changed unit of tMRD from tCK to ns at DDR333 7. Rename tXSA(exit self refresh to bank active command) to tXSNR(exit self refresh to non read command) at DDR200/266 8. Rename tXSR(exit self refresh to read command) to tXSRD at DDR200/266 9. Rename tWPREH(DQS in hold time) to tWPRE at DDR200/266 10. Rename tREF(Refresh interval time) to tREFI at DDR200/266 11. Rename tCDLR(Last write data to Read command) to tWTR Revision 0.2 (Jan. 2002) 1. Added tRAP(Active to Read with auto precharge command) Revision 0.3 (May. 2002) 1. Change pin location of A13 from pin 103 to pin 167 Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL M368L1713CTL DDR SDRAM 184pin DIMM 16Mx64 DDR SDRAM 184pin DIMM based on 16Mx8 GENERAL DESCRIPTION FEATURE The Samsung M368L1713CTL is 16M bit x 64 Double Data • Performance range Part No. Rate SDRAM high density memory modules. Max Freq. Interface The Samsung M368L1713CTL consists of eight CMOS 16M x M368L1713CTL-C(L)B3 166MHz(6ns@CL=2.5) 8 bit with 4banks Double Data Rate SDRAMs in 66pin TSOP- M368L1713CTL-C(L)A2 133MHz(7.5ns@CL=2) II(400mil) packages mounted on a 184pin glass-epoxy sub- M368L1713CTL-C(L)B0 133MHz(7.5ns@CL=2.5) strate. Four 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each DDR SDRAM. The M368L1713CTL is Dual In-line Memory Modules and intended for mounting into 184pin edge connector sockets. Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable latencies and burst lengths allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. SSTL_2 • Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V • Double-data-rate architecture; two data transfers per clock cycle • Bidirectional data strobe(DQS) • Differential clock inputs(CK and CK) • DLL aligns DQ and DQS transition with CK transition • Programmable Read latency 2, 2.5 (clock) • Programmable Burst length (2, 4, 8) • Programmable Burst type (sequential & interleave) • Edge aligned data output, center aligned data input • Auto & Self refresh, 15.6us refresh interval(4K/64ms refresh) • Serial presence detect with EEPROM • PCB : Height 1250 mil , double sided component PIN CONFIGURATIONS (Front side/back side) Pin Front Pin Front Pin Front Pin Back Pin Back 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 VDDQ /WE DQ41 /CAS VSS DQS5 DQ42 DQ43 VDD */CS2 DQ48 DQ49 VSS /CK2 CK2 VDDQ DQS6 DQ50 DQ51 VSS VDDID DQ56 DQ57 VDD DQS7 DQ58 DQ59 VSS NC SDA SCL 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 VSS DQ4 DQ5 VDDQ DM0 DQ6 DQ7 VSS NC NC NC VDDQ DQ12 DQ13 DM1 VDD DQ14 DQ15 *CKE1 VDDQ *BA2 DQ20 *A12 VSS DQ21 A11 DM2 VDD DQ22 A8 DQ23 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 VSS A6 DQ28 DQ29 VDDQ DM3 A3 DQ30 VSS DQ31 *CB4 *CB5 VDDQ CK0 /CK0 VSS *DM8 A10 *CB6 VDDQ *CB7 KEY VSS DQ36 DQ37 VDD DM4 DQ38 DQ39 VSS DQ44 VREF DQ0 VSS DQ1 DQS0 DQ2 VDD DQ3 NC NC VSS DQ8 DQ9 DQS1 VDDQ CK1 /CK1 VSS DQ10 DQ11 CKE0 VDDQ DQ16 DQ17 DQS2 VSS A9 DQ18 A7 VDDQ DQ19 53 54 55 56 57 58 59 60 61 A5 DQ24 VSS DQ25 DQS3 A4 VDD DQ26 DQ27 A2 VSS A1 *CB0 *CB1 VDD *DQS8 A0 *CB2 VSS *CB3 BA1 KEY DQ32 VDDQ DQ33 DQS4 DQ34 VSS BA0 DQ35 DQ40 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 145 146 147 148 149 150 151 152 153 PIN DESCRIPTION Pin Back 154 /RAS 155 DQ45 156 VDDQ 157 /CS0 158 */CS1 159 DM5 160 VSS 161 DQ46 162 DQ47 163 */CS3 164 VDDQ 165 DQ52 166 DQ53 167 *A13 168 VDD 169 DM6 170 DQ54 171 DQ55 172 VDDQ 173 NC 174 DQ60 175 DQ61 176 VSS 177 DM7 178 DQ62 179 DQ63 180 VDDQ 181 SA0 182 SA1 183 SA2 184 VDDSPD Pin Name Function A0 ~ A11 Address input (Multiplexed) BA0 ~ BA1 Bank Select Address DQ0 ~ DQ63 Data input/output DQS0 ~ DQS7 Data Strobe input/output CK0,CK0 ~ CK2,CK2 Clock input CKE0 Clock enable input /CS0 Chip select input RAS Row address strobe CAS Column address strobe WE Write enable DM0 ~ DM7 Data - in mask VDD Power supply (2.5V) VDDQ Power Supply for DQ S(2.5V) VSS Ground VREF Power supply for reference VDDSPD Serial EEPROM Power Supply (2.3V to 3.6V) SDA Serial data I/O SCL Serial clock SA0 ~ 2 Address in EEPROM VDDID VDD identification flag NC No connection * These pins are not used in this module. SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice. Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL Functional Block Diagram DQS0 DM0 CS0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS4 DM4 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 CS CS DQ36 DQ37 DQ38 DQ39 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 CS DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 CS DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQS DQ32 DQ33 DQ34 DQ35 D0 DQS D4 DQS5 DM5 DQS1 DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 CS DQS D1 DQS D5 DQS6 DM6 DQS2 DM2 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 CS DQS D2 DQS3 DM3 DQS D6 * Clock Wiring DQS7 DM7 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 CS DQS DQ56 DQ57 DQ58 DQ59 D3 DQ60 DQ61 DQ62 DQ63 DM I/O 7 I/O 6 I/O 1 I/O 0 I/O 5 I/O 4 I/O 3 I/O 2 Clock Input SDRAMs C K 0 /CK0 C K 1 /CK1 C K 2 /CK2 2 SDRAMs 3 SDRAMs 3 SDRAMs C S DQS D7 *Clock Net Wiring Dram1 Cap R=120 Ω D r am3 *(Cap) Serial PD BA0 - BA1 BA0-BA1: SDRAMs D0 - D7 SCL A0 - A 13 A0-A13: SDRAMs D0 - D7 WP RAS RAS: SDRAMs D0 - D7 CAS CAS: SDRAMs D0 - D7 CKE0 CKE: SDRAMs D0 - D7 WE WE : SDRAMs D0 - D7 V DDSPD V DD/V DDQ SPD D0 - D7 D0 - D7 VREF D0 - D7 V SS D0 - D7 SDA A0 A1 A2 SA0 SA1 SA2 Card Edge Cap Dram5 Cap *If two DRAMs are loaded, Cap will replace DRAM3 Notes: 1. DQ-to-I/O wiring is shown as recommended but may be changed. 2. DQ/DQS/DM/CKE/CS relationships must be maintained as shown. 3. DQ, DQS, DM/DQS resistors: 22 Ohms. Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit V I N, V OUT -0.5 ~ 3.6 V VDD -1.0 ~ 3.6 V Voltage on VDDQ supply relative to Vss V DDQ -1.0 ~ 3.6 V Storage temperature TSTG -55 ~ +150 °C Power dissipation PD 12 W Short circuit current IOS 50 mA Voltage on any pin relative to Vss Voltage on VD D supply relative to Vss Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. POWER & DC OPERATING CONDITIONS (SSTL_2 In/Out) Recommended operating conditions(Voltage referenced to VSS =0V, TA =0 to 70°C) Parameter Symbol Min Max Supply voltage(for device with a nominal V DD of 2.5V) VDD 2.3 2.7 I/O Supply voltage V DDQ 2.3 2.7 V I/O Reference voltage VR E F VDDQ/2-50mV VDDQ/2+50mV V 1 VTT V REF-0.04 V R E F+0.04 V 2 Input logic high voltage VIH (DC) VR E F+0.15 V DDQ +0.3 V 4 Input logic low voltage V IL(DC) -0.3 VREF -0.15 V 4 Input Voltage Level, CK and CK inputs VIN (DC) -0.3 V DDQ +0.3 V Input Differential Voltage, CK and CK inputs VID (DC) 0.3 V DDQ +0.6 V 3 Input crossing point voltage, CK and CK inputs V IX (DC) 1.15 1.35 V 5 II -2 2 uA Output leakage current IO Z -5 5 uA Output High Current(Normal strengh driver) ;VOUT = VTT + 0.84V IO H -16.8 mA Output High Current(Normal strengh driver) ;VOUT = V TT - 0.84V I OL 16.8 mA Output High Current(Half strengh driver) ;VOUT = V TT + 0.45V IO H -9 mA Output High Current(Half strengh driver) ;VOUT = V TT - 0.45V I OL 9 mA I/O Termination voltage(system) Input leakage current Unit Note Notes 1. Includes ± 25mV margin for DC offset on VREF , and a combined total of ± 50mV margin for all AC noise and DC offset on V REF, bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on V REF and internal DRAM noise coupled TO VREF, both of which may result in V REF noise. VREF should be de-coupled with an inductance of ≤ 3nH. 2.VTT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to V REF , and must track variations in the DC level of V R E F 3. VID is the magnitude of the difference between the input level on CK and the input level on CK. 4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ. 5. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the dc level of the same. 6. These charactericteristics obey the SSTL-2 class II standards. Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL DDR SDRAM IDD spec table IDD6 (Vdd = 2.7V, T= 10’ C) Symbol B3(DDR333@CL=2.5) B0(DDR266@CL=2.5) Unit IDD0 880 A2(DDR266@CL=2) 760 760 mA IDD1 1120 1000 1000 mA IDD2P 32 32 32 mA IDD2F 256 200 200 mA IDD2Q 160 120 120 mA IDD3P 320 240 240 mA IDD3N 440 440 440 mA IDD4R 1280 1240 1240 mA IDD4W 1280 1240 1240 mA IDD5 1680 1600 1600 mA 16 16 16 mA Normal Low power IDD7A 8 8 8 mA 3200 2800 2800 mA Notes Optional * Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. AC OPERATING CONDITIONS Parameter/Condition Symbol Min Input High (Logic 1) Voltage, DQ, DQS and DM signals VIH(AC) VREF + 0.31 Input Low (Logic 0) Voltage, DQ, DQS and DM signals. VIL(AC) Input Differential Voltage, CK and CK inputs VID(AC) Input Crossing Point Voltage, CK and CK inputs VIX(AC) Max Unit Note V 3 VREF - 0.31 V 3 0.7 VDDQ+0.6 V 1 0.5*VDDQ-0.2 0.5*VDDQ+0.2 V 2 Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK. 2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same. 3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simulation. the AC and DC input specificatims are refation to a Vref envelope that has been bandwidth limited 20MHz. AC OPERATING TEST CONDITIONS Parameter (VDD =2.5V, VDDQ=2.5V, T A= 0 to 70 °C ) Value Unit Input reference voltage for Clock 0.5 * VDDQ V Input signal maximum peak swing 1.5 V VREF+0.31/VREF-0.31 V VREF V Vtt V Input Levels(VIH/VIL) Input timing measurement reference level Output timing measurement reference level Output load condition Note See Load Circuit Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL V tt=0.5*V DDQ RT=50Ω Output Z0=50Ω CLOAD =30pF VR E F =0.5*VDDQ Output Load Circuit (SSTL_2) Input/Output CAPACITANCE (VDD=2.5V, V DDQ =2.5V, TA= 25 °C , f=1MHz) Parameter Symbol Min Max Unit Input capacitance(A0 ~ A 11, BA0 ~ BA 1 ,RAS,CAS, WE ) C IN1 49 57 pF Input capacitance(CKE 0) C IN2 42 50 pF Input capacitance( CS 0 ) C IN3 42 50 pF Input capacitance( CLK 0 , CLK1,CLK2 ) C IN4 22 25 pF Data & DQS input/output capacitance(DQ0~DQ 63) COUT 6 8 pF Input capacitance(DM0 ~DM 8 ) C IN5 6 8 pF Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL AC Timming Parameters & Specifications (These AC charicteristics were Parameter -TCB3 (DDR333) Symbol Min Max -TCA2 (DDR266A) Min Max -TCB0 (DDR266B) Min Unit tRC 60 Refresh row cycle time tRFC 72 Row active time tRAS 42 65 RAS to CAS delay tRCD 18 20 20 ns 75 70K 45 ns 75 120K 45 ns 120K ns tRP 18 20 20 ns Row active to Row active delay tRRD 12 15 15 ns Write recovery time tWR 15 15 15 ns Last data in to Read command tWTR 1 1 1 tCK Col. address to Col. address delay tCCD 1 1 1 Clock cycle time CL=2.0 CL=2.5 tCK 7.5 12 7.5 12 10 tCK 12 ns 5 5 6 12 7.5 12 7.5 12 ns Clock high level width tCH 0.45 0.55 0.45 0.55 0.45 0.55 tCK Clock low level width tCL 0.45 0.55 0.45 0.55 0.45 0.55 tCK DQS-out access time from CK/CK tDQSCK -0.6 +0.6 -0.75 +0.75 -0.75 +0.75 ns Output data access time from CK/ CK tAC -0.7 +0.7 -0.75 +0.75 -0.75 +0.75 ns Data strobe edge to ouput data edge tDQSQ - 0.45 - 0.5 - 0.5 ns Read Preamble tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 tCK Read Postamble tRPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK CK to valid DQS-in tDQSS 0.75 1.25 0.75 1.25 0.75 1.25 tCK DQS-in setup time tWPRES 0 0 0 ns DQS-in hold time tWPRE 0.25 0.25 0.25 tCK tDSS 0.2 0.2 0.2 tCK DQS falling edge to CK rising-setup time DQS falling edge from CK rising-hold time tDSH 0.2 0.2 0.2 tCK DQS-in high level width tDQSH 0.35 0.35 0.35 tCK DQS-in low level width tDQSL 0.35 0.35 0.35 tCK DQS-in cycle time 0.9 1.1 0.9 1.1 5 2 tDSC 0.9 Address and Control Input setup time(fast) tIS 0.75 0.9 0.9 ns 6 Address and Control Input hold time(fast) tIH 0.75 0.9 0.9 ns 6 Address and Control Input setup time(slow) tIS 0.8 1.0 1.0 ns 6 Address and Control Input hold time(slow) tIH 0.8 1.0 1.0 ns 6 Data-out high impedence time from CK/ CK tHZ -0.7 +0.7 -0.75 +0.75 -0.75 +0.75 +0.7 -0.75 +0.75 -0.75 +0.75 Data-out low impedence time from CK/ CK 1.1 Note Max Row cycle time Row precharge time 65 tested on the Component) tCK ns tLZ -0.7 tSL(I) 0.5 0.5 0.5 V/ns 6 Input Slew Rate(for I/O pins) tSL(IO) 0.5 0.5 0.5 V/ns 7 Output Slew Rate(x4,x8) tSL(O) 1.0 4.5 1.0 4.5 1.0 4.5 V/ns 10 Output Slew Rate Matching Ratio(rise to fall) tSLMR 0.67 1.5 0.67 1.5 0.67 1.5 Input Slew Rate(for input only pins) ns Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL Parameter -TCB3 (DDR266A) Symbol Min Mode register set cycle time -TCA2 (DDR266A) Max Min -TCB0 (DDR266B) Max Min Unit Note Max tMRD 12 15 15 ns DQ & DM setup time to DQS tDS 0.45 0.5 0.5 ns 7,8,9 DQ & DM hold time to DQS tDH 0.45 0.5 0.5 ns 7,8,9 Control & Address input pulse width tIPW 2.2 2.2 2.2 ns DQ & DM input pulse width tDIPW 1.75 1.75 1.75 ns Power down exit time tPDEX 6 7.5 7.5 ns Exit self refresh to non-Read command tXSNR 75 75 75 ns Exit self refresh to read command tXSRD 200 200 200 tCK Refresh interval time tREFI 15.6 15.6 15.6 us 1 Output DQS valid window tQH tHP -tQHS - tHP -tQHS - tHP -tQHS - ns 5 Clock half period tHP tCLmin or tCHmin - tCLmin or tCHmin - tCLmin or tCHmin - ns 0.75 ns 0.6 tCK 3 tCK 11 Data hold skew factor DQS write postamble time Active to Read with Auto precharge command Autoprecharge write recovery + Precharge time tQHS 0.55 0.6 0.75 tWPST 0.4 0.4 0.6 0.4 tRAP 20 20 20 tDAL (tWR/tCK) + (tRP/tCK) (tWR/tCK) + (tRP/tCK) (tWR/tCK) + (tRP/tCK) 4 1. Maximum burst refresh cycle : 8 2. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress, DQS could be High at this time, depending on tDQSS. 3. The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter, but system performance (bus turnaround) will degrade accordingly. 4. A write command can be applied with t RCD satisfied after this command. 5. For registered DIMMs, t CL and tCH are ≥ 45% of the period including both the half period jitter (t JIT(HP) ) of the PLL and the half period jitter due to crosstalk (t JIT(crosstalk)) on the DIMM. 6. Input Setup/Hold Slew Rate Derating Input Setup/Hold Slew Rate ∆tIS ∆tIH (V/ns) (ps) (ps) 0.5 0 0 0.4 +50 +50 0.3 +100 +100 This derating table is used to increase tIS/tIH in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate based on the lesser of AC-AC slew rate and DC-DC slew rate. 7. I/O Setup/Hold Slew Rate Derating I/O Setup/Hold Slew Rate ∆tDS ∆tDH (V/ns) (ps) (ps) 0.5 0 0 0.4 +75 +75 0.3 +150 +150 This derating table is used to increase t DS/tDH in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate based on the lesser of AC-AC slew rate and DC-DC slew rate. Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL 8. I/O Setup/Hold Plateau Derating I/O Input Level ∆tDS ∆tDH (mV) (ps) (ps) ± 280 +50 +50 This derating table is used to increase tDS/tDH in the case where the input level is flat below VREF ± 310mV for a duration of up to 2ns. 9. I/O Delta Rise/Fall Rate(1/slew-rate) Derating Delta Rise/Fall Rate ∆tDS ∆tDH (ns/V) (ps) (ps) 0 0 0 ±0.25 +50 +50 ±0.5 +100 +100 This derating table is used to increase tDS /tD H in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate is calated as 1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall Rate =-0/5ns/V. Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall rate. 10. This parameter is fir system simulation purpose. It is guranteed by design. 11. For each of the terms, if not already an integer, round to the next highest integer. tCK is actual to the system clock cycle time. <Reference> The following table specifies derating values for the specifications listed if the single-ended clock skew rate is less than 1.0 V/ns. CK slew rate (Single ended) ∆tIH/tIS (ps) ∆tDSS/tDSH (ps) ∆tAC/tDQSCK (ps) ∆tLZ(min) (ps) ∆tHZ(max) (ps) 1.0V/ns 0 0 0 0 0 0.75V/ns +50 +50 +50 -50 +50 0.5V/ns +100 +100 +100 -100 +100 Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL Command Truth Table (V=Valid, X=Don′t Care, H=Logic High, L=Logic Low) COMMAND CKEn-1 CKEn CS RAS CAS WE BA 0,1 A10 /AP A 11 A9 ~ A 0 Note Register Extended MRS H X L L L L OP CODE 1, 2 Register Mode Register Set H X L L L L OP CODE 1, 2 L L L H X Auto Refresh Refresh Entry Self Refresh Exit H H L L H H H H X X X X L L H H V X L H L H V L H Bank Active & Row Addr. H Read & Column Address Auto Precharge Disable H Write & Column Address Auto Precharge Disable Auto Precharge Enable X L H L L H X L H H L H X L L H L Entry H L H X X X L V V V Exit L H X X X X Entry H L H X X X L H H H Exit L H H X X X L V V V Burst Stop Precharge Bank Selection All Banks Active Power Down Precharge Power Down Mode DM H No operation (NOP) : Not defined H X X X X X L H H H 3 V 3 Row Address L Column Address (A 0~ A9 ) H Column Address (A 0~ A9 ) H X V L X H 4 4 4 4, 6 7 X 5 X X X H 3 X L H Auto Precharge Enable 3 X 8 9 9 Note : 1. OP Code : Operand Code. A0 ~ A11 & BA 0 ~ BA 1 : Program keys. (@EMRS/MRS) 2. EMRS/ MRS can be issued only at all banks precharge state. A new command can be issued 2 clock cycles after EMRS or MRS. 3. Auto refresh functions are same as the CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. 4. BA 0 ~ BA1 : Bank select addresses. If both BA 0 and BA 1 are "Low" at read, write, row active and precharge, bank A is selected. If BA0 is "High" and BA 1 is "Low" at read, write, row active and precharge, bank B is selected. If BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected. If both BA 0 and BA 1 are "High" at read, write, row active and precharge, bank D is selected. 5. If A 10/AP is "High" at row precharge, BA0 and BA 1 are ignored and all banks are selected. 6. During burst write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at t RP after the end of burst. 7. Burst stop command is valid at every burst length. 8. DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0). 9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM. Rev. 0.3 May. 2002 184pin Unbuffered DDR SDRAM MODULE M368L1713CTL PACKAGE DIMENSIONS Units : Inches (Millimeters) 5.25 ± 0.005 (133.350 ± 0.13) 0.118 (3.00) 5.077 (128.950) 0.7 (17.80) 0.393 B 0.100 Min (2.30 Min) A (10.00) (4.00) (2X) 0.157 1.25 ± 0.006 (31.75 ±0.15) 2.500 0.10 M 2.55 1.95 (64.77) (49.53) C B A 0.07 Max (1.20 Max) 0.157 (4.00) 0.100 0.26 (6.62) 0.250 (6.350) (2.50 ) 0.050 ± 0.0039 (1.270 ± 0.10) 0.0787 R (2.00) 0.1496 (3.80) 2.175 0.071 (1.80) Detail A 0.118 (3.00) 0.039 ± 0.002 (1.000 ± 0. 050) 0.0078 ±0.006 (0.20 ±0.15) 0.050 (1.270) Detail B 0.1575 (4.00) 0.10 M C A M B Tolerances : ± 0.005(.13) unless otherwise specified. The used device is 16Mx8 DDR SDRAM, TSOP. SDRAM Part NO : K4H280838C. Rev. 0.3 May. 2002