SANYO LC9998G

Ordering number : EN*5219
CMOS LSI
LC9998G
1/5" Optical Size PAL Color
Solid-State Image Sensor
Preliminary
Overview
Package Dimensions
The LC9998G is a 1/5" optical size frame transfer type
CCD (charge-coupled device) solid-state image sensor
developed for use in color video cameras.
unit: mm
3217
[LC9998G]
Features
• Effective number of pixels (total pixels): 499H × 582V
(532H × 600V)
• Number of optical black pixels:
Horizontal direction: Front: 7 pixels
Back: 26 pixels
Vertical direction:
Front: 14 pixels
Back: 4 pixels
• Dummy bits: Horizontal direction: 4 pixels
• Horizontal resolution: 220 TV lines
• Supports miniature, compact camera designs.
• Package: 20-pin half-pitch transparent DIP
• Horizontal shift register: 5 V drive
• Supports variable-speed electronic shutter operation
Device Structure
•
•
•
•
•
•
1/5" type frame transfer CCD image sensor
Unit cell size: 5.8 µm (H) × 3.75 µm (V)
Chip size: 4.18 mm (H) × 5.10 mm (V)
Parallel gate CCD sensor
Built-in high-sensitivity output amplifier
Cy-G-Ye stripe complementary color filter
Specifications
Absolute Maximum Ratings at Ta = 25°C, VSS = 0 V
Parameter
Maximum supply voltage
Horizontal clock pin
Symbol
Conditions
Ratings
Unit
VDD
VPW = 0 V
–0.3 to +18
V
VGG
VPW = 0 V
–0.3 to +5
V
NSUB-PW
–0.3 to +50
V
NSUB - ø1 to ø4,
øS1 to øS4:
–0.3 to +55
V
V
VPW = 0 V
–0.3 to +18
Other clock pins
øR
VPW = 0 V
–15 to +18
V
Other pins
VPW = 0 V
–0.3 to +10
V
Operating temperature
Topr
–10 to +60
°C
Storage temperature
Tstg
–30 to +80
°C
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
22896HA (OT) No.5219-1/11
LC9998G
Block Diagram
Pin Assignment
No.5219-2/11
LC9998G
Pixel Arrangement
Pin Functions
Pin No.
Symbol
Pin No.
Symbol
1
NSUB
N-substrate
Function
20
NSUB
P-well
2
VPW
19
øS4
3
ø4
18
øS1
4
ø3
17
øS2
5
ø2
6
ø1
7
øR
Image area clock
16
øS3
15
øH1
Reset gate
14
øH2
8
VDD
Supply voltage
13
VOG
9
VOUT
CCD output
12
VGG
10
NSUB
N-substrate
11
NSUB
Function
N-substrate
Storage area clock
Horizontal area clock
CCD output gate
Load gate
N-substrate
No.5219-3/11
LC9998G
Specifications
Clock Voltage Conditions at Frame frequency = 3.58 MHz
Parameter
Imaging block pulses
ø1, ø2, ø3, ø4
Storage block pulses
øS1, øS2
Symbol
typ
max
Unit
14.0
14.5
15.0
V
–10.0
–9.5
–9.0
V
VPSL
14.0
14.5
15.0
V
Pulse amplitude
VPIF
Low level
VLIF
Pulse amplitude
Conditions
*1
min
Low level
VLSL
–7.0
–6.5
–6.0
V
Storage block pulses
øS3, øS4
Pulse amplitude
VPSL
14.0
14.5
15.0
V
Low level
VLSL
–8.0
–7.5
–7.0
V
Horizontal transfer pulses
øH1, øH2
Pulse amplitude
VPH
4.5
5.0
5.5
V
Low level
VLH
0
0
0.5
V
Reset gate
øR
Pulse amplitude
VPR
4.5
5.0
5.5
V
4.5
4.8
V
Substrate pulse
øNSUB
Low level
VLR
4.2
High level
VHSUB*2
30.0
Low level
VLSUB
See Figure 1.
17.5
18.0
40.0
V
18.5
V
Note: 1. Insert 47 pF capacitors as shown in Figure 2.
2. Adjust VHSUB within the range where image degradation does not occur so that the saturated output level is maximized.
Figure 1
Figure 2
No.5219-4/11
LC9998G
Bias Conditions
Parameter
Symbol
P-well
Conditions
min
typ
VPW
Output circuit voltage
OG bias
max
Unit
0
V
VDD
*1
14.5
15.0
15.5
V
VGG
*2
1.2
1.5
1.8
V
VOG
*2
4.5
5.0
5.5
V
max
Unit
Note: 1. Design applications so that this level never exceeds the substrate pulse low level VLSUB.
2. These are high-impedance inputs.
DC Characteristics
Parameter
Symbol
DC operating current
Conditions
IDD
min
typ
4.5
7.0
11.0
mA
DC operating current
Note: VP: pulse amplitude
VL: low level
Figure 3 Pulse Waveform
tWH
tWL
tr
tf
typ
typ
typ
typ
ø1
167
102
6.5
ø2
143
117
11
11
ø3
167
102
6.5
6.5
Symbol
Conditions
Unit
6.5
ø4
143
117
11
11
øS1
143
117
11
11
øS2
143
117
11
11
øS3
143
117
11
11
øS4
143
117
11
11
øS1
1.4
62.5
30
30
øS2
1.4
62.5
30
30
øS3
62.5
1.4
30
30
øS4
62.5
1.4
30
30
øR
10
88
4
4
øH1
50
50
3
3
øH2
50
50
3
3
During frame drive
When the frame shift frequency is 3.55 MHz
ns
During frame drive
When the frame shift frequency is 3.55 MHz
ns
The values enclosed in dark lines are in µs units and apply
during 1H line transfers.
ns
Reset pulse
During horizontal transfers
ns
øNSUB
9.9
19.99*
0.07
1
The slice pulse values marked * are in ms units.
µs
øNSUB
4.2
19.99*
0.07
1
The shutter pulse values marked * are in ms units.
µs
No.5219-5/11
LC9998G
Imaging Characteristics at Ta = 25°C
Parameter
Symbol
Test method
S
1
VF
2
Vsat
3
Smear
SM
4
*1
Dark signal
Vdrk
5
Ta = 55°C
Color unevenness
Vcs
6
Sensitivity
Video signal imbalance
Saturated signal
Gamma characteristics
Conditions
min
typ
max
Unit
175
200
265
mV
15
%
500
γ
mV
0.04
%
7
mV
40
mV
1
—
Note: 1. When the frame shift frequency is 3.55 MHz and the storage time is 1/50 second.
Test Procedures
The Sanyo evaluation board must be used for the following tests.
1. Sensitivity
Use a CCV31F pattern box (manufactured by Dai Nippon Printing Co., Ltd.) set up at a brightness of 1500 NT and
color temperature of 5100°K with no pattern. Image the pattern box with an HF16A lens (manufactured by Fujinon)
with a 1 mm thick C-500 IR cut filter in front of that lens.
Set the lens f-stop to f8 and set the lens to be 50 cm from the pattern box. Measure the CCD output signal from the
center of the image with this setup.
2. Uniformity of Output Signal
Measure under the following conditions.
• Standard drive conditions (See the specifications document.)
• Use a 3200°K color temperature halogen lamp as the light source.
• Use a 1 mm thick C-500 IR cut filter.
Set the CCD surface illumination to 7 lux, and divide the image into 45 areas as shown in Figure 4.
Measure the average value for each block, and determine the maximum, minimum, and mean of those values.
Determine the ratio of the range of the block average values to the mean of the block average values.
VF =
maximum block average value – minimum block average value
mean block average value
Figure 4
3. Saturated Signal
Saturate the output signal by removing the lens in the test setup for item 1. Measure the CCD output signal from the
center of the image in this state.
No.5219-6/11
LC9998G
4. Smear
• Place a 1/10 V chart in front of the halogen light source as shown in the figure and image that chart.
• Adjust the amount of light entering the CCD with ND filters so that the CCD output signal at point A becomes
250 mV.
• Remove the ND filter(s) and measure the output value of the CCD output signal from the first line (point B).
SM =
VB · TND
× 100 [%]
250
VB: The amount of smear at point B [mV]
TND: The ND filter transmissivity
Figure 5
5. Dark Signal
Completely block all light from falling on the CCD element surface and measure the CCD output signal at the center
of the image.
Here, do not measure the difference between this signal and the optical black section level, but rather measure the
difference between this signal and the no signal level that has no pixel information. (See Figure 6.)
Figure 6 Structure of a Single Horizontal Period
No.5219-7/11
LC9998G
6. Color Uniformity
Use a CCV31F pattern box (manufactured by Dai Nippon Printing Co., Ltd.) set up at a brightness of 1500 NT and
color temperature of 5100°K with no pattern. Use the Sanyo LC9997-LE01 lens and a C-500 IR cut filter. Adjust the
exposure with ND filters so that the CCD output signal level is 500 mV. Measure the chrominance signal level and
chrominance signal phase at 16 points in the image as shown in Figure 7. Calculate the color unevenness, VCS (mV),
from these chrominance signal level and phase values.
8
∑VL(i)COSθL(i)
BL =
i=1
8
VL, VR : Chroma level (mV)
θL, θR : Chroma level (˚)
8
∑VL(i)SINθL(i)
RL =
i=1
8
8
∑VR(i)COSθR(i)
BR =
i=1
8
8
∑VR(i)SINθR(i)
RR =
i=1
8
VCS = √(BL – BR)2 + (RL – RR)2
Figure 7
No.5219-8/11
LC9998G
CCD Color Camera Block Diagram
Figure 8
Block Descriptions
Block
Vertical driver
Image sensor core LSI
Digital signalprocessing LSI
Product no.
Specifications and functions
LC89901V
• Vertical CMOS driver
• Maximum frame transfer frequency: 3.55 MHz
LC99052-V64A
•
•
•
•
•
•
•
•
CMOS standard cell
Built-in SSG (NTSC/PAL)
Electronic iris circuit that supports even long exposure times
Supports external image sensor drive control
CDS and AGC early-stage signal-processing circuits
Video bandwidth 8-bit A/D and D/A converters
Supports mirror output
Can also operate stand-alone
LC99062-W50
•
•
•
•
•
•
•
Three channel 8-bit video signal inputs
Three channel 8-bit video signal outputs
Also functions as an RGB input encoder (NTSC/PAL)
Operates on HD, VD, and CLK inputs
Simplified chrominance keying
Superimpose
Supports parameter setting in stand-alone mode
No.5219-9/11
LC9998G
Notes on Mounting and Handling
1. Preventing Electrostatic Discharge (ESD)
Since CCD sensors are easily destroyed by ESD, the antistatic measures described below should be employed when
handling this device.
• All tools and personnel must be grounded when handling CCDs. Note that a 1 MΩ resistor should be inserted in
series between personnel and ground for safety. (We recommend using wrist straps for personnel grounding.)
• Personnel should handle CCD devices with either bare hands or antistatic gloves. Use antistatic materials for work
garments. Personnel should wear conductive shoes.
• Lay conductive mats on the floor and benches in the workplace so that static charges do not accumulate.
• We recommend using ionized air blowers (or other static removal techniques) when handling CCD sensors.
• Use antistatic boxes when transporting boards that have CCD sensors mounted on them.
• Do not leave packing materials or fittings made from plastic materials (such as Styrofoam) that easily collect static
charges on or near workplace tables.
• Ground all tools, test equipment, conveyors, soldering irons, and other objects used in the workplace. Inspect
grounding regularly to assure that it is complete.
• Do not handle this IC in the vicinity of TV monitors or other equipment that generates high static voltages. If
unavoidable, install antistatic filters in front of monitor screens and take all other possible antistatic measures.
• Static charges accumulate easily in workplaces with a low relative humidity. Manufacturing operations should be
carried out in an environment with a relative humidity of at least 50%.
2. Soldering
• The CCD package temperature must not exceed 80°C.
• Since CCD sensors are sensitive to thermal stress as well as ESD, the soldering iron temperature should be under
300°C. Aim for a soldering time of 2 seconds per pin.
• Use soldering irons that include an adjustable temperature control function that holds the soldering iron tip at a
constant temperature.
• Be especially careful to assure that the device package temperature does not exceed 80°C when repairing or
redoing solder joints or when removing CCD sensors from printed circuit boards.
3. Soiling and Contamination Prevention
• CCD sensors should be handled in a clean workplace. (A class 1000 level is appropriate.)
• Do not touch the package surface and do not allow any object to contact the package surface. Use compressed air
to remove any foreign objects (such as dust) that land on the package surface. (We recommend using an ionized air
blower if possible.)
• Use a cotton swab dipped in ethyl alcohol to remove oily contamination, being especially careful not to scratch the
package surface.
• Use special-purpose cases to prevent soiling and contamination. Warm or cool CCD sensors in advance to prevent
condensation when transporting between rooms with radically differing temperatures.
• For CCD sensors that are shipped with protective tape applied, only remove that tape immediately prior to use in
an environment in which ESD prevention measures have been fully implemented. Do not reuse protective tape that
has been removed from a CCD sensor.
No.5219-10/11
LC9998G
4. Storage
• Do not allow sunlight or other bright light to fall on CCD sensors for extended periods.
• Since harsh conditions such as high temperatures or high humidities can adversely influence device characteristics,
do not use or store these devices in environments with such conditions. Samples should be stored in places where
the temperature and humidity fall in normal ranges, i.e., 5 to 35°C and 45 to 75% RH.
• Since CCD sensors are precision optical components, they should not be subjected to mechanical shocks.
• Avoid locations with corrosive atmospheres or high dust levels.
• Avoid locations subject to rapid temperature changes.
• Do not place heavy objects on top of boxes containing CCD sensors during storage.
• Use materials that cannot accumulate static charges for containers used to hold samples.
• Do not subject magazines holding CCD sensors to mechanical shocks, since this could adversely influence
reliability during mounting due to pin bending and other problems.
5. Notes on Mounting
• Flare can occur if a lens with an optical size larger than 1/5" is used. Consult your Sanyo sales representative in
advance when selecting lenses.
• This product is mounted in a fully transparent plastic package, and is easily influenced by light that passes through
the mounting board from the back to the front. Design end-products to adequately block out extraneous light.
6. Shipping
• Do not drop or throw packages containing CCD sensors.
• Do not allow packages containing CCD sensors to become wet due to rain or snow.
• Protect packages containing CCD sensors from mechanical shock and vibration as much as possible during
shipping.
■ No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace
equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of
which may directly or indirectly cause injury, death or property loss.
■ Anyone purchasing any products described or contained herein for an above-mentioned use shall:
➀ Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and
distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all
damages, cost and expenses associated with such use:
➁ Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on
SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees
jointly or severally.
■ Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for
volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
This catalog provides information as of February, 1996. Specifications and information herein are subject to
change without notice.
PS No.5219-11/11