SANYO SPI-335-34

Ordering number : EN6029
Infrared LED
SPI-335-34
SPI-335-34
Ultraminiature photoreflector
(single-transistor type)
Features
• Infrared LED plus Phototransistor (single)
• DIP type
• Compact type : 3.4 (L) ✕ 2.7 (W) ✕ 1.5 (H) mm
• Visible light cut type
• Lead length : (L=3.5mm)
Absolute Maximum Ratings at Ta=25°C, 65%RH
Input LED
Output
Phototransistor
*1
Parameter
Forward Current
Reverse Voltage
Power Dissipation
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Curren
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature *1
Symbol
IF
VR
PD
VCEO
VECO
IC
PC
Topr
Tstg
Tsol
Rating
50
5
70
20
5
20
70
--20 to +80
--40 to +100
260
Unit
mA
V
mW
V
V
mA
mW
°C
°C
°C
Soldering conditions : time : max. 3sec; clearance : min. 1mm from lower case edge.
Electro-Optical Characteristics at Ta=25°C, 65%RH
Input
Output
Coupled
Parameter
Forward Voltage
Reverse Current
Dark Current
Collector Output Current
Leakage Current
Symbol
VF
IR
ICEO
IC
ILEAK
Condition
IF=10mA
VR=5V
IF=0mA, VCE=10V
IF=4mA,VCE=5V *1
IF=10mA,VCE=5V *2
Min.
1.0
--33
--
Typ.
1.2
-10
---
Max.
1.6
10
200
180
1
Unit
V
µA
nA
µA
µA
Collector Emitter
Saturation Voltage
VCE(sat)
IF=10mA, IC=50µA
--
--
0.5
V
VCC=5V, RL=100Ω
IC=1mA
---
5
5
---
µs
µs
Rise Time
Fall Time
*1 Location of reflector is show in Fig. 1.
*2 No reflector
*3
tr
tf
AL V.E. film
Table of Classification of Collector Output
Class
E
Ic (µA)
180 to 110
Marking color
Orange
F
140 to 80
Green
G
100 to 50
White
H
65 to 33
Silver
Glass plate (t : 1mm)
Fig. 1
Location of Reflector
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI) No.6029 1/6
SPI-335-34
Package dimensions and Pin connection
As stated in the sttached paper. (No.6029 5/6)
Rank marking of collector output
The bottom of the package is colored following the table of classification of collector output.
A
Lot marking
Color division shall be done as shown in the drawing. (Fig. 2)
B
Year of even number : Front side
Year of odd number : Back side
Color
Part ‘A’
Part ‘B’
Black
January
July
Blue
February
August
Front side
Fig. 2
Red
March
September
Green
April
October
Orange
May
November
(1) Temperature
(2) Time
(3) Clearance
1mm
Soldering conditions
Brown
June
December
: Max. 260°C
: Max. 3sec
: Min. 1mm from the case edge. (Fig. 3)
Fig. 3
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 2mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
No.6029 2/6
SPI-335-34
Pin Connection
1. Ph. Tr Emitter
2. Ph. Tr Collector
3. LED Cathode
4. LED Anode
Pin No.
C 0.6
1
4
0.4
1.6
2
3
4
3
2
1
4.0
3.4
1.5
0.5
2.7
0.5
3.3
4 -- 0.4
3.5 ± 0.5
0.6
2.6
M
4 -- 0.2
2.0
± 10°
0 to 20°
0 to 20°
± 10°
❈ M : Color marking of Ic class
Tolerance : ± 0.2
Unit
: mm
No.6029 3/6
SPI-335-34
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Power Dissipation vs. Ambient Temperature
Forward Current vs. Ambient Temperature
(Rating)
60
Power Dissipation P (mW)
Forward Current IF (mA)
50
40
30
20
10
100
80
60
40
20
0
0
--25
0
25
50
75
100
--25
0
25
50
75
100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Forward Current vs. Forward Voltage
Collector vs. Forward Current
500
500
VCE=5V
Ta=25°C
Ta=75°C
50°C
100
Collector Current IC (µA)
Forward Current IF (mA)
(Rating)
120
25°C
50
0°C
--25°C
10
5
400
300
200
100
1
0
0
0.5
1
1.5
2
0
4
8
12
16
20
Forward Voltage VF (V)
Forward Current IF (mA)
Collector Current vs. Collector-emitter Voltage
Relative Collector Current vs. Ambient Temperature
140
1000
Relative Collector Current (%)
Collector Current IC (µA)
Ta=25°C
800
IF=20mA
600
15mA
400
10mA
200
5mA
0
0
5
Collector-emitter Voltage VCE (V)
10
IF=10mA
VCE=5V
120
100
80
60
40
--25
0
25
50
75
100
Ambient Temperature Ta (°C)
No.6029 4/6
SPI-335-34
Typical Characteristics
Collector-emitter Saturation Voltage vs.
Ambient Temperature
Collector Dark Current vs. Ambient Temperature
10-6
0.24
0.22
VCE=10V
5
IF=10mA
IC=50µA
Collector Dark Current ICEO (A)
Collector-emitter Saturation Voltage VCE (sat) (V)
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
0.20
0.18
0.16
10-7
5
10-8
5
10-9
5
10-10
0.14
--25
0
25
50
75
--25
100
0
25
50
75
100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Response Time vs. Load Resistance
Test Circuit for Response Time
1000
500
IFP=20mA
VCC=5V
Ta=25°C
tf
IFP
VCC
Response (µS)
tr
100
IFP
50
Vout
tf
tr
RL
RD
90%
10
Vout
5
1
0.1
10%
0.5
1
5
10
50
100
Load Resistance RL (kΩ)
Relative Collector Current vs.
PPC paper Moving Distance
Relative Collector Current vs. Distance
120
100
80
d
60
40
20
0
0
1
2
3
4
5
Distance between sensor and Ar evaporation d (mm)
IF=10mA,VCE=5V
Ta=25°C,d=1mm
r2
100
–
80
+
r1
60
40
0
r2
IF=10mA
VCE=5V
Ta=25°C
Relative Collector Current (%)
Relative Collector Current (%)
120
–
r1
0
+
20
0
--4
--2
0
2
4
6
PPC paper Moving Distance r (mm)
No.6029 5/6
SPI-335-34
CAUTION
1. No products described or contained herein are intended for use in surgical implants, life-support systems,
aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or
the like, and the failure of which may directly or indirectly cause injury, death or property loss.
2. Anyone purchasing any products described or contained herein for an above-mentioned use shall:
1) Accept full responsibility and indemnify and defend SANYO ELECTRIC CO.,LTD., it’s affiliates,
subsidiaries and distributors or any of their officers and employees, jointly and severally, against any
and all claims and litigation and all damages, costs and expenses associated with such use.
2) Not impose any responsibility for any fault or negligence which may be cited in any such claim or
litigation on SANYO ELECTRIC CO., LTD., it’s affiliates, subsidiaries and distributors or any of
their officers and employees jointly or severally.
3. Information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not
guaranteed for mass production, SANYO believes the information disclosed herein is accurate and reliable,
but no guarantees are made or implied regarding it’s use or any infringements of intellectual property rights
or other rights of third parties.
Precautionary instructions in handling gallium arsenic products
Special precautions must be taken in handling this product because it contains, gallium arsenic, which is
designated as a toxic substance by law. Be sure to adhere strictly to all applicable laws and regulations
enacted for this substance, particularly when it comes to disposal.
Manufactured by ; Tottori SANYO Electric Co., Ltd.
LED Division
5-318, Tachikawa-cho, Tottori City, 680-8634 Japan
TEL: +81-857-21-2137 FAX: +81-857-21-2161
PS No.6029 6/6