Ordering number : EN6030 Infrared LED SPI-336-99-T1 SPI-336-99-T1 Ultraminiature photoreflector supporting reflow soldering (Single transistor type) Features • Infrared LED plus Phototransistor (single) • DIP type • Compact type : 3.4 (L) ✕ 2.7 (W) ✕ 1.5 (H) mm • Visible light cut type • Taping type Absolute Maximum Ratings at Ta=25°C, 65%RH (as per JIS C7032) Input LED Output Phototransistor Parameter Forward Current Reverse Voltage Power Dissipation Collector-Emitter Voltage Emitter-Collector Voltage Collector Curren Power Dissipation Operating Temperature Storage Temperature Symbol IF VR PD VCEO VECO IC PC Topr Tstg Rating 50 5 70 20 5 20 70 --20 to +80 --30 to +100 Unit mA V mW V V mA mW °C °C Electro-Optical Characteristics at Ta=25°C, 65%RH Parameter Symbol Forward Voltage VF Input Reverse Current IR Output Dark Current ICEO Collector Output IC Leakage Current ILEAK Collector Emitter V CE(sat) Coupled Rise Time tr Fall Time tf *1 Location of reflector is shown in Fig. 1. Condition IF=10mA VR=5V IF=0mA, VCE=10V IF=10mA,VCE=5V *1 IF=10mA,VCE=5V *2 IF=10mA, IC=50µA VCC=5V, RL=100Ω IC=1mA Min. 1.0 --80 ----- Typ. 1.2 -----5 5 Max. 1.6 10 200 1100 1 0.5 --- Unit V µA nA µA µA V µs µs AL V.E. film Glass plate (t=1mm) Fig. 1 *2 No reflector *3 Table of Classification of Collector Output Class Ic (µA) A 1100 to 450 B 600 to 260 C 350 to 150 Location of Reflector D 200 to 80 SANYO Electric Co.,Ltd. Semiconductor Company TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN 72199 GI, (MI) No.6030 1/6 SPI-336-99-T1 Typical Characteristics CAUTION These numerical value show the electrical and optical characteristics of this product, and not assure this contents. Forward Current vs. Ambient Temperature 60 120 (Rating) Power Dissipation P (mW) 50 Forward Current IF (mA) Power Dissipation vs. Ambient Temperature 40 30 20 10 (Rating) 100 80 60 40 20 0 0 --25 0 25 50 75 100 --25 Ambient Temperature Ta (°C) Forward Current vs. Forward Voltage 25 50 75 100 Collector vs. Forward Current 500 500 VCE=5V Ta=25°C Ta=75°C 50°C 100 Collector Current IC (µA) Forward Current IF (mA) 0 Ambient Temperature Ta (°C) 25°C 50 0°C --25°C 10 5 400 300 200 100 0 1 0 0.5 1 1.5 0 2 4 8 12 16 20 Forward Voltage VF (V) Forward Current IF (mA) Collector Current vs. Collector-emitter Voltage Relative Collector Current vs. Ambient Temperature 1000 140 Relative Collector Current (%) Collector Current IC (µA) Ta=25°C 800 IF=20mA 600 15mA 400 10mA 200 IF=10mA VCE=5V 120 100 80 60 5mA 0 0 5 Collector-emitter Voltage VCE (V) 10 40 --25 0 25 50 75 100 Ambient Temperature Ta (°C) No.6030 2/6 SPI-336-99-T1 Typical Characteristics Collector-emitter Saturation Voltage vs. Ambient Temperature Collector Dark Current vs. Ambient Temperature 10-6 5 0.24 IF=10mA IC=50µA Collector Dark Current ICEO (A) Collector-emitter Saturation Voltage VCE (sat) (V) CAUTION These numerical value show the electrical and optical characteristics of this product, and not assure this contents. 0.22 0.20 0.18 0.16 0.14 --25 0 25 50 75 10-7 5 10-8 5 10-9 5 10-10 100 VCE=10V --25 0 25 50 75 100 Ambient Temperature Ta (°C) Ambient Temperature Ta (°C) Response Time vs. Load Resistance Test Circuit for Response Time 1000 IFP=20mA VCC=5V Ta=25°C Response (µS) 500 tf IFP VCC tr 100 IFP 50 Vout tf tr RL RD 90% 10 Vout 5 10% 1 0.1 0.5 1 5 10 50 100 Load Resistance RL (kΩ) Relative Collector Current vs. PPC paper Moving Distance Relative Collector Current vs. Distance 120 80 60 40 20 0 0 1 2 3 4 5 Distance between sensor and Al evaporation d (mm) IF=10mA,VCE=5V Ta=25°C,d=1mm 2 100 80 – 60 1 40 0 + – 1 2 100 Relative Collector Current (%) IF=10mA VCE=5V Ta=25°C d Relative Collector Current (%) 120 0 + 20 0 --4 --2 0 2 4 6 PPC paper Moving Distance (mm) No.6030 3/6 SPI-336-99-T1 2 1 C 0. Pin connection 1. LED Anode 2. LED Cathode 3 .Ph. Tr Collector 4. Ph. Tr Emitter Pin No. 1.6 4 0.4 6 3 2 0.4 0.6 4.3 ± 0.5 (3.47) 3.4 + 0.1 -- 0.05 0.05 0.2 0.5 1 2.7 Tolerance : ±0.2 Unit : mm No.6030 4/6 SPI-336-99-T1 Package dimensions and Pin connection As stated in the sttached paper. (No.6030 4/6) Soldering conditions (1) Reflow soldering The temperature of the reflow furnace is to be set in accordance with the following temperature profile. Soldering must be done only two time. Temperature : On the topsurface of product Reflow type : Hot air Max 240°C 200°C Max 165°C Max 10sec Max 120sec (2) Manusl soldering Temperature Time Clearance : Max. 290°C (Soldering iron tip temperature) : Max. 3 sec : Min. 0.5mm from package Max 60sec 0.5mm 0.5mm PRECAUTIONS (1) Bending a lead should avoid. However, when bending is necessary, take care the next items. q Bending a lead must be done before soldering. w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that stress for the regin part cause troubles such as gold wire breaking and so on. e A lead must be bend at intervals of 0.5mm from the case edge. r Do not bend the same position of leads more than twice. (2) The hole pitch of a circuit board must fit to the lead pitch. (3) Take core the following when soldering. q Do not heat a product under any stress (a twist and so on) to leads. w Do not heat a product in the states of operating force to the regin part. (4) Use the flux which contain no chlorine, have no corrosion and do not need washing. (5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface. (6) Precautions of the product after the open dry packing q The product after the open dry packing should be stored in the dry packing again. The product should be kept under the conditions below, if the product is not stored in the dry paking. Temperature : 5 to 30°C Humidity : Max 70%RH Term : Max 7days w The product to be out the term without dry packing must be practiced baking. Baking conditions : +60±5°C, 10 to 20Hr (7) The reflow conditions must be confirmed that no problem by your reflow furnace. No.6030 5/6 SPI-336-99-T1 CAUTION 1. No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or the like, and the failure of which may directly or indirectly cause injury, death or property loss. 2. Anyone purchasing any products described or contained herein for an above-mentioned use shall: 1) Accept full responsibility and indemnify and defend SANYO ELECTRIC CO.,LTD., it’s affiliates, subsidiaries and distributors or any of their officers and employees, jointly and severally, against any and all claims and litigation and all damages, costs and expenses associated with such use. 2) Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., it’s affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. 3. Information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not guaranteed for mass production, SANYO believes the information disclosed herein is accurate and reliable, but no guarantees are made or implied regarding it’s use or any infringements of intellectual property rights or other rights of third parties. Precautionary instructions in handling gallium arsenic products Special precautions must be taken in handling this product because it contains, gallium arsenic, which is designated as a toxic substance by law. Be sure to adhere strictly to all applicable laws and regulations enacted for this substance, particularly when it comes to disposal. Manufactured by ; Tottori SANYO Electric Co., Ltd. LED Division 5-318, Tachikawa-cho, Tottori City, 680-8634 Japan TEL: +81-857-21-2137 FAX: +81-857-21-2161 PS No.6030 6/6