SEMTECH EVM118AHF

Edge118
Low Skew
Clock Spreader
EDGE HIGH-PERFORMANCE PRODUCTS
Description
Features
The Edge118 is a fully differential 1:18 clock spreader.
Manufactured in a high performance bipolar process,
the Edge118 is designed to accurately fan out a multitude
of clock signals with low channel to channel skew.
• Low Timing Error vs. Duty Cycle & Frequency
• Low Channel to Channel Skew
• Small Footprint (64 MQFP Package,
14 mm X 14 mm Body)
Functional Block Diagram
Applications
• Test Equipment
OUT / OUT* 0
OUT / OUT* 1
OUT / OUT* 2
OUT / OUT* 3
OUT / OUT* 4
OUT / OUT* 5
OUT / OUT* 6
OUT / OUT* 7
OUT / OUT* 8
IN / IN*
OUT / OUT* 9
OUT / OUT* 10
OUT / OUT* 11
OUT / OUT* 12
OUT / OUT* 13
OUT / OUT* 14
OUT / OUT* 15
OUT / OUT* 16
OUT / OUT* 17
Revision 1/August 15, 2000
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
PIN Description
Pin Name
Pin #
IN, IN*
6, 8
OUT0, OUT0*
OUT1, OUT1*
OUT2, OUT2*
OUT3, OUT3*
OUT4, OUT4*
OUT5, OUT5*
OUT6, OUT6*
OUT7, OUT7*
OUT8, OUT8*
OUT9, OUT9*
OUT10, OUT10*
OUT11, OUT11*
OUT12, OUT12*
OUT13, OUT13*
OUT14, OUT14*
OUT15, OUT15*
OUT16, OUT16*
OUT17, OUT17*
1, 3
63, 61
58, 60
57, 55
52, 54
51, 49
45, 47
44, 42
39, 41
38, 36
33, 35
31, 29
26, 28
25, 23
20, 22
19, 17
13, 15
12, 10
Description
Differential input signal.
Differential ECL output signals.
Power Supplies
GND
2, 7, 11, 14, 18, 21,
24, 27, 30, 34, 37,
40, 43, 46, 50, 53,
56, 59, 62
Positive Power Supply
VEE
9, 16, 32, 48, 64
Negative Power Supply
TDP, TDN
4, 5
 2000 Semtech Corp.
Thermal Diode Connections
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Edge118
64
OUT0
GND
GND
OUT5*
OUT1*
OUT2*
GND
OUT2
OUT3
GND
OUT3*
OUT4*
GND
OUT4
OUT5
VEE
OUT1
GND
EDGE HIGH-PERFORMANCE PRODUCTS
PIN Description (continued)
49
1
VEE
OUT6*
OUT0*
TDP
GND
OUT6
TDN
IN
GND
OUT7
GND
OUT7*
IN*
VEE
OUT17*
OUT8*
GND
OUT8
GND
OUT9
OUT17
OUT16
GND
OUT9*
GND
OUT10*
OUT16*
VEE
33
GND
OUT10
 2000 Semtech Corp.
3
OUT11
VEE
OUT14
GND
OUT14*
OUT13*
GND
OUT13
OUT12
GND
OUT12*
OUT11*
GND
OUT15*
GND
OUT15
17
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
Circuit Description
Chip Overview
OUT 0
OUT 0*
The Edge118 is a clock distribution chip designed to
take one input signal (IN / IN*) and fan it out 18 times
to identical outputs (OUT / OUT*). The chip is designed
to minimize channel to channel skew and any timing jitter.
OUT 1
OUT 1*
OUT 2
OUT 2*
The part’s wide fanout is extremely useful in applications
where many distinct copies of a signal are required on
one PC Board, and these signals must all be aligned.
This signal can be distributed without creating a
distribution tree using multiple devices.
OUT 3
OUT 3*
OUT 4
OUT 4*
Inputs
OUT 5
OUT 5*
The input signal is differential, requiring 250 mV swings
for full performance operation. The inputs are ECL
compatible, but may also be operated over a common
mode voltage range between VEE + 1.3V and VCC – .5V.
OUT 6
OUT 6*
OUT 7
OUT 7*
Outputs
The outputs are ECL compatible differential signals with
800 mV voltage swings centered around 1.3V below GND.
IN
IN*
OUT 8
OUT 8*
OUT 9
OUT 9*
OUT 10
OUT 10*
Operating Frequency
The Edge118 is designed to maintain full performance
up to at least 1000 MHz and pass 500 ps pulses.
OUT 11
OUT 11*
OUT 12
OUT 12*
OUT 13
OUT 13*
OUT 14
OUT 14*
OUT 15
OUT 15*
OUT 16
OUT 16*
OUT 17
OUT 17*
 2000 Semtech Corp.
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
Application Information
Power Supplies Decoupling
A .1 µF or .01 µF capacitor (with excellent high frequency
characteristics, is recommended between GND and VEE.
In addition, solid GND and VEE planes are recommended
to provide a low inductance path for the power supply
currents.
Output Terminations
For optimal results, all output pairs (used or unused)
should be terminated, and terminated in the same
manner.
Thermal Information
Parameter
Symbol
Value
Units
θJA
~25
˚C/W
Thermal Resistance
(300 LFM, par t soldered to a PC Board)
Junction to Air
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
Package Information
Top View
4
PIN Descriptions
4X
0.25 C A – B D
D
D2
3 –A–
e
SEE DETAIL "A"
Bottom View
2
4X
5
5
7
0.20 C A – B D
7
D1
COO
ZD
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
Package Information (continued)
0.40 MIN.
˚
0 MIN.
e/2
A2
–A, B, D–
–
0.10 S
0.13 / 0.30 R.
0.13
R. MIN.
3
C
GAGE PLANE
0.25
DETAIL "A"
C
A1
˚
0–7
L
1.60 REF.
DETAIL "B"
8
SEE DETAIL "B"
˚
12 – 16
ccc
M C A–B S D S
WITH LEAD FINISH
b
1.41 REF.
A
H
2
12 0.13 / 0.23
0.13 / 0.17
0.076
C
b
1
˚
12 – 16
BASE METAL
SECTION C-C
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident with lead,
where lead exits plastic body at bottom of parting line.
3. Datums A-B and -D- to be determined at centerline between leads where
leads exit plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold
protrusion is 0.254 mm per side. Dimensions D1 and E1 do
include mold mismatch and are determined at datum plane -H.-.
6. N” is the total # of terminals.
7. Package top dimensions are smaller than bottom dimensions by
0.20 mm, and top of package will not overhang bottom of package.
8. Dimension b does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm total in excess of the b dimension at
maximum material condition. Dambar cannot be located on the lower
radius or the foot.
9. All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled in this package family
is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outlines MO-108 and
MS-022.
12. These dimensions apply to the flat section of the lead between 0.10 mm
and 0.25 mm from the lead tip.
JEDEC Variation
All Dimensions in Millimeters
AC
Min.
A
7
Max.
2.82
3.00
A1
0.10
0.15
0.25
A2
2.55
2.67
2.75
Note
D
17.20 BSC.
4
D1
14.00 BSC.
5
D2
12.00 BSC.
Z0
1.00 REF.
E
17.20 BSC.
4
E1
14.00 BSC.
5
E2
12.00 BSC.
ZE
1.00 REF.
L
0.73
.088
N
64
e
0.80 BSC.
b
0.30
b1
0.30
ccc
 2000 Semtech Corp.
Nom.
1.03
6
0.45
0.35
0.40
0.16
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Units
Positive Analog Power Supply
GND
0
0
0
V
Negative Analog Power Supply
VEE
– 5.5
– 4.2
V
+125
˚C
Junction Temperature
TJ
Absolute Maximum Ratings
Parameter
Total Analog Power Supply
Digital Inputs
Ambient Operating Temperature
Symbol
Min
GND – VEE
IN / IN*
Storage Temperature
Junction Temperature
Max
Units
– 7.0
0
V
VEE – .5
GND + .5
V
+125
˚C
– 55
+150
˚C
– 65
+150
˚C
260
˚C
TA
TJ
Soldering Temperature
Typ
Stresses above listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above
those listed in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
 2000 Semtech Corp.
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
DC Characteristics
Parameter
Symbol
Min
IN – IN*
IN* – IN
Iin
IN, IN*
200
200
– 250
VEE + 1.3
Iout DC
OUT – OUT*
OUT* – OUT
OUT – OUT*
2
600
600
– 1.5
225
Typ
Max
Units
250
GND – .5
mV
mV
µA
V
800
800
– 1.3
– 1.1
mV
mV
V
275
325
mA
IN / IN*
Input
Input
Input
Input
High Voltage
Low Voltage
Bias Current
Common Mode Range
OUT / OUT*
Output
Output
Output
Output
Current
High Voltage
Low Voltage
Common Mode Range
Supply Current
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
AC Characteristics
Parameter
Propagation Delay
IN / IN* to OUT / OUT* (Notes 1, 5)
Channel-to-Channel Skew (Note 6)
Maximum Operating Frequency (Notes 1, 2, 3, 4)
Symbol
Min
Typ
Max
Units
Tpd
450
550
<25
650
100
ps
ps
Fmax
1000
>1200
Minimum Pulse Width (Notes 1, 2, 3, 4)
PW min
400
500
ps
Output Rise and Fall Times (Notes 1, 4)
20% - 80%, 50Ω Load
10% - 90%, 50Ω Load
Tr / Tf
Tr / Tf
260
400
400
500
ps
ps
<.1
1
ps
Jitter (Notes 1, 4)
Peak-to-Peak
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
MHz
∆Tpd vs. Duty Cycle, T = 100 ns (Notes 1, 4)
3.0% <= Duty Cycle <= 97%
0.5% <= Duty Cycle <= 99.5%
∆Tpd
∆Tpd
<10
<25
ps
ps
∆Tpd vs. Frequency (Notes 1, 4)
10 MHz <= Frequency <= 1.0 GHz
∆Tpd
<30
ps
Temperature Coefficient (Notes 1, 4)
∆Tpd
1
ps / ˚ C
Measured in a terminated 50Ω transmission line environment.
And still maintain 80% amplitude.
And still maintain a propagation delay variation (measured at the differential crossing points) of
TPD ± 30 ps.
This parameter is guaranteed by characterization. It is not production tested against the
specification limit.
This parameter is guaranteed by design and characterization. It is production tested against
tester limits of Tpd = 550 ps ± 200 ps.
This parameter is guaranteed by design and characterization. It is production tested against
a tester limit of 160 ps.
 2000 Semtech Corp.
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Edge118
EDGE HIGH-PERFORMANCE PRODUCTS
Ordering Information
Model Number
Package
E118AHF
64-pin MQFP
14 mm x 14 mm Body
w/Internal Spreader
D118
Die Form
EVM118AHF
Edge118 Evaluation Module
Contact Information
Semtech Corporation
Edge High-Performance Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1808 FAX (858)695-2633
 2000 Semtech Corp.
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