74LX1G04 LOW VOLTAGE CMOS SINGLE INVERTER WITH 5V TOLERANT INPUT ■ ■ ■ ■ ■ ■ ■ ■ 5V TOLERANT INPUTS HIGH SPEED: tPD = 4.2ns (MAX.) at VCC = 3V LOW POWER DISSIPATION: ICC = 1µA (MAX.) at TA = 25°C POWER DOWN PROTECTION ON INPUTS AND OUTPUTS SYMMETRICAL OUTPUT IMPEDANCE: |IOH| = IOL = 24mA (MIN) at VCC = 3V BALANCED PROPAGATION DELAYS: tPLH ≅ tPHL OPERATING VOLTAGE RANGE: VCC(OPR) = 1.65V to 5.5V (1.2V Data Retention) IMPROVED LATCH-UP IMMUNITY DESCRIPTION The 74LX1G04 is a low voltage CMOS SINGLE INVERTER fabricated with sub-micron silicon gate and double-layer metal wiring C2MOS technology. It is ideal for 1.65 to 5.5 VCC operations and low power and low noise applications. The internal circuit is composed of 3 stages including buffer output, which provide high noise immunity and stable output. Power down protection is provided on input and output and 0 to 7V can be accepted on inputs with SOT23-5 SOT323-5 Flip-Chip4 ORDER CODES PACKAGE T&R SOT23-5L SOT323-5L Flip-Chip 74LX1G04STR 74LX1G04CTR 74LX1G04BJR no regard to the supply voltage. It can be interfaced to 5V signal environment for inputs in mixed 3.3/5V system. All inputs and outputs are equipped with protection circuits against static discharge. PIN CONNECTION AND IEC LOGIC SYMBOLS (top view for SOT, top through view for Flip-Chip) April 2004 1/13 74LX1G04 INPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION PIN for SOT PIN for Flip-Chip SYMBOL 1 2 4 3 1 3 2 5 4 N.C. 1A 1Y GND VCC NAME AND FUNCTION Not connected Data Input Data Output Ground (0V) Positive Supply Voltage TRUTH TABLE A Y L H H L ABSOLUTE MAXIMUM RATINGS Symbol VCC Parameter Value Unit Supply Voltage -0.5 to +7.0 V VI DC Input Voltage -0.5 to +7.0 V VO DC Output Voltage (VCC = 0V) -0.5 to +7.0 V VO DC Output Voltage (High or Low State) (note 1) IIK DC Input Diode Current IOK IO -0.5 to VCC + 0.5 V - 50 mA DC Output Diode Current (note 2) - 50 mA DC Output Current ± 50 mA ICC or IGND DC VCC or Ground Current per Supply Pin Tstg Storage Temperature TL Lead Temperature (10 sec) ± 50 mA -65 to +150 °C 260 °C Absolute Maximum Rating are those value beyond which damage to the device may occur. Functional operation under these condition is not implied 1) IO absolute maximum rating must be observed 2) VO < GND 2/13 74LX1G04 RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Value Supply Voltage (note 1) Unit 1.65 to 5.5 V 0 to 5.5 V Output Voltage (VCC = 0V) 0 to 5.5 V Output Voltage (High or Low State) 0 to VCC V VI Input Voltage VO VO IOH, IOL High or Low Level Output Current (VCC = 4.5 to 5.5V) ± 32 mA IOH, IOL High or Low Level Output Current (VCC = 3.0 to 3.6V) ± 24 mA IOH, IOL High or Low Level Output Current (VCC = 2.7 to 3.0V) ± 16 mA IOH, IOL High or Low Level Output Current (VCC = 2.3 to 2.7V) ±8 mA IOH, IOL High or Low Level Output Current (VCC = 1.65 to 2.3V) Top dt/dv Operating Temperature Input Rise and Fall Time (note 2) ±4 mA -55 to 125 °C 0 to 10 ns/V 1) Truth Table guaranteed: 1.2V to 3.6V 2) VIN from 0.8V to 2V at VCC = 3.0V DC SPECIFICATION Test Condition Symbol VIH VIL Parameter High Level Input Voltage Value -40 to 85 °C Min. 1.65 to 1.95 0.75VCC 0.75VCC 2.3 to 2.7 0.7VCC 0.7VCC 3.0 to 5.5 0.7VCC 0.7VCC Ioff ICC V 0.25VCC 2.3 to 2.7 0.3VCC 0.3VCC High Level Output Voltage 1.65 to 4.5 Low Level Output Voltage Input Leakage Current Power Off Leakage Current Quiescent Supply Current Unit Max. 0.25VCC V 0.3VCC 0.3VCC IO=-100 µA VCC-0.1 VCC-0.1 1.65 IO=-4 mA 1.2 1.2 2.3 IO=-8 mA 1.9 1.9 IO=-16 mA 2.4 2.4 IO=-24 mA 2.2 2.2 4.5 IO=-32 mA 3.8 1.65 to 4.5 IO=100 µA 0.1 0.1 1.65 IO=4 mA 0.45 0.45 2.3 IO=8 mA 0.3 0.3 IO=16 mA 0.4 0.4 IO=24 mA 0.55 0.55 4.5 IO=32 mA 0.55 0.55 1.65 to 5.5 VI = 0 to 5.5V ± 10 ± 10 µA 0 VI or VO = 5.5V 10 10 µA 1.65 to 5.5 VI = VCC or GND 10 10 µA 3.0 II Min. 1.65 to 1.95 3.0 VOL Max. Low Level Input Voltage 3.0 to 5.5 VOH -55 to 125 °C VCC (V) V 3.8 V 3/13 74LX1G04 AC ELECTRICAL CHARACTERISTICS Test Condition Symbol tPLH tPHL Parameter Propagation Delay Time VCC (V) 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 1.65 to 1.95 2.3 to 2.7 2.7 3.0 to 3.6 4.5 to 5.5 CL (pF) RL (Ω) Value ts = tr (ns) 15 1MΩ 2.0 30 30 50 50 50 1000 500 500 500 500 2.0 2.0 2.5 2.5 2.5 -40 to 85 °C -55 to 125 °C Min. Max. Min. Max. 2 2 1 1 2 2 1 1 1 9.5 6.5 5.5 4.1 10.5 7.5 6.1 5.5 4.2 2 2 1 1 2 2 1 1 1 10.5 7.6 6.5 5.5 11.5 8.5 7.1 6.5 5.2 Unit ns CAPACITANCE CHARACTERISTICS Test Condition Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (note 1) TA = 25 °C VCC (V) Min. 0 1.8 2.5 3.3 Value fIN = 10MHz Typ. Unit Max. 4 pF 36.8 37 38 pF 1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average current can be obtained by the following equation. ICC(opr) = CPD x VCC x fIN + ICC 4/13 74LX1G04 TEST CIRCUIT RT = ZOUT of pulse generator (typically 50Ω) TEST CIRCUIT AND WAVEFORM SYMBOL VALUE VCC Symbol 1.65 to 1.95V 2.3 to 2.7V 2.7 to 5.5V CL 15pF/30pF 15pF/30pF 15pF/50pF RL 1MΩ/1000Ω 500Ω 500Ω VIH VCC VCC VCC VM VCC/2 VCC/2 VCC/2 tr = tr <2.0ns <2.0ns <2.5ns WAVEFORM: PROPAGATION DELAY (f=1MHz; 50% duty cycle) 5/13 74LX1G04 Figure 1 : RECOMMENDED SOLDERING REFLOW PROFILE FOR LEADFREE FLIP-CHIP MOUNTING ON PCB Temperature (˚C) 260˚C max 255˚C 220˚C 180˚C 125 ˚C 2˚C/s recommended 2˚C/s recommended 6˚C/s max 6˚C/s max 3˚C/s max 3˚C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 6 7 Time (min) 90 sec max For Flip-Chip mounting on the PCB, STMicroelectronics recommends the use of a solder stencil aperture of 330 x 330 µm² maximum and a typical stencil thickness of 125µm. Flip-Chips are fully compatible with the use of near eutectic 95.5Sn 4Ag 0.5Cu solder paste with no clean flux. ST's recommendations for Flip-Chip board mounting are illustrated on the soldering reflow profile shown in figure 1 below. Dwell time in the soldering zone (with temperature higher than 220°C) has to be kept as short as possible to prevent component and substrate damages. Peak temperature must not exceed 260°C. Controlled atmosphere (N2 or N2H2) is recommended during the whole reflow, specially above 150°C. Flip-Chips are able to withstand three times the previous recommended reflow profile in order to be compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional repair. A maximum of three soldering reflows are allowed for these leadfree packages (with repair step included). The use of a no clean flux is highly recommended to avoid any cleaning operation. In order to prevent any bump cracks, ultrasonic cleaning methods are not recommended. 6/13 74LX1G04 SOT23-5L MECHANICAL DATA mm. mils DIM. MIN. TYP MAX. MIN. TYP. MAX. A 0.90 1.45 35.4 57.1 A1 0.00 0.10 0.0 3.9 A2 0.90 1.30 35.4 51.2 b 0.35 0.50 13.7 19.7 C 0.09 0.20 3.5 7.8 D 2.80 3.00 110.2 118.1 E 1.50 1.75 59.0 68.8 e 0.95 37.4 H 2.60 3.00 102.3 118.1 L 0.10 0.60 3.9 23.6 . 7049676C 7/13 74LX1G04 SOT323-5L MECHANICAL DATA mm. mils DIM. MIN. MAX. MIN. TYP. MAX. A 0.80 1.10 31.5 43.3 A1 0.00 0.10 0.0 3.9 A2 0.80 1.00 31.5 39.4 b 0.15 0.30 5.9 11.8 C 0.10 0.18 3.9 7.1 D 1.80 2.20 70.9 86.6 E 1.80 2.40 70.9 94.5 E1 1.15 1.35 45.3 53.1 e 0 .65 25.6 e1 1.3 51.2 L 8/13 TYP 0.10 0.30 3.9 11.8 74LX1G04 Flip-Chip4 MECHANICAL DATA mm. mils DIM. MIN. TYP MAX. MIN. TYP. MAX. A 0.585 0.65 0.715 23.03 25.59 28.15 A1 0.21 0.25 0.29 8.27 9.84 11.42 A2 0.40 15.75 b 0.265 0.315 0.365 10.43 12.40 14.37 D 1.02 1.07 1.12 40.15 42.13 44.09 D1 E E1 0.5 1.02 1.07 0.5 19.69 1.12 40.15 42.13 44.09 19.69 7224716/D 9/13 74LX1G04 Tape & Reel SOT23-xL MECHANICAL DATA mm. inch DIM. MIN. TYP A MIN. TYP. 180 13.0 13.2 MAX. 7.086 C 12.8 D 20.2 0.795 N 60 2.362 T 10/13 MAX. 0.504 0.512 14.4 0.519 0.567 Ao 3.13 3.23 3.33 0.123 0.127 0.131 Bo 3.07 3.17 3.27 0.120 0.124 0.128 Ko 1.27 1.37 1.47 0.050 0.054 0.0.58 Po 3.9 4.0 4.1 0.153 0.157 0.161 P 3.9 4.0 4.1 0.153 0.157 0.161 74LX1G04 Tape & Reel SOT323-xL MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 175 180 185 6.889 7.086 7.283 C 12.8 13 13.2 0.504 0.512 0.519 D 20.2 N 59.5 0.795 60 T 60.5 2.362 14.4 0.567 Ao 2.25 0.088 Bo 2.7 0.106 Ko 1.2 0.047 Po 3.9 4 4.1 0.153 0.157 0.161 P 3.8 4 4.2 0.149 0.157 0.165 11/13 74LX1G04 Tape & Reel Flip-Chip 4 MECHANICAL DATA mm. inch DIM. MIN. TYP A MIN. TYP. 178 C 12.8 D 20.2 N 59 13.2 MAX. 6.926 0.504 0.519 0.795 60 T 12/13 MAX. 61 2.323 2.362 8.4 2.401 0.331 Ao 1.12 1.17 1.22 0.044 0.046 0.048 Bo 1.12 1.17 1.22 0.044 0.046 0.048 Ko 0.68 0.73 0.78 0.027 0.029 0.031 Po 3.9 4 4.1 0.153 0.157 0.161 P 3.9 4 4.1 0.153 0.157 0.161 74LX1G04 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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