STMICROELECTRONICS FLC10-200H

FLC10-200H/B
®
Application Specific Discretes
A.S.D.™
FIRE LIGHTER CIRCUIT
FEATURES
■
■
■
■
Dedicated thyristor structure for capacitance
discharge ignition operation
High pulse current capability
240A @ tp= 10µs
Fast turn-on operation
Designed for high ambient temperature (up to
120°C)
TAB
3
2
TAB
1
IPAK
FLC10-200H
BENEFITS
■
■
2
Space saving thanks to monolithic function
integration
High reliability with planar technology
DESCRIPTION
The FLC10 series has been especially developed
for high power capacitance discharge operation.
The main applications are gas lighters or ignitors
such as :
cookers / gas boilers / gas hobs...
Based on ST’s ASD™ technology, it provides a
fully integrated function, with high performance
and reliability levels, adapted to severe and hot
temperature environment.
Th: Thyristor for switching operation.
Z: Zener diode to set the threshold voltage.
D: Diode for reverse conduction.
R: 2 kΩ resistor.
3
1
DPAK
FLC10-200B
FUNCTIONAL DIAGRAM
pin 2 or Tab
Z
Th
D
R
pin 1/3 (*)
(*) Pin1 and Pin3 must be shorted together in
the application circuit layout.
October 2001 - Ed: 7E
1/8
FLC10-200H/B
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
ITRM
Repetitive surge peak on state current for thyristor
-30°C ≤ Tamb ≤ 120°C
IFRM
Repetitive surge peak on state current for diode
-30°C ≤ Tamb ≤ 120°C
dI/dt
Critical rate of rise time on state current -30°C ≤ Tamb ≤ 120°C
Tstg
Tj
Storage junction temperature range
Maximum junction temperature
Toper
Value
Unit
240
A
200
A/µs
- 40 to + 150
+ 125
°C
-30 + 120
°C
260
°C
tp = 10µs
( note 1)
Operating temperature range
Maximum lead temperature for soldering during 10s
TL
Note 1 : Test current waveform
10µs
200ms
THERMAL RESISTANCE
Symbol
Parameter
Value
Unit
Rth(j-a)
IPAK thermal resistance junction to ambient
100
°C/W
Rth(j-a)
DPAK thermal resistance junction to ambient S = 0.5cm2
70
°C/W
S = Copper Surface under Tab
ORDERING INFORMATION
FLC
FIRE LIGHTER CIRCUIT
10
-
x
200: VBO min = 20V
CIRCUIT NUMBER
SCR + Diode + Zener + Resistance
High Power Version
2/8
200
Package:H: IPAK
B: DPAK
FLC10-200H/B
ELECTRICAL CHARACTERISTICS
Symbol
I
IF
Parameters
VRM
Stand-off voltage
VBO
Breakover voltage
VT
On-state voltage
VF
Diode forward voltage drop
IRM
IBO
Breakover current
I BO
IRM
Leakage current
αT
Temperature coefficient for VBO
V
BO
VRM
V
T
VF
V
IT
DIODE (D) PARAMETER
Symbol
VF
Test Conditions
IF = 2A
tp ≤ 500µs
Tj = 25°C
Value
Unit
1.7
V
Max.
THYRISTOR (Th) and ZENER (Z) PARAMETERS
Symbol
IRM
Test conditions
VRM = 200 V
Min
Typ
Max
Unit
Tj = 25°C
10
µA
Tj = 125°C
100
µA
250
V
VBO
at IBO
Tj = 25°C
IBO
at VBO
Tj = 25°C
0.5
mA
VT
IT = 2A
Tj = 25°C
1.7
V
tp ≤ 500µs
αT
200
225
13
10-4/°C
Fig. 1: Relative variation of breakover current
versus junction temperature.
k = IBO(Tj) / IBO(25°C)
2.5
2
1.5
1
0.5
0
-20
0
20
40
60
80
100
Tj (°C)
3/8
FLC10-200H/B
Fig. 2: BASIC APPLICATION
Ic
Ic
t
Rs
c
Ds
Th
Z
AC
MAINS
D
R
The applications of the lighter using the capacitance discharge topology operate in 2 phases :
PHASE 1
The energy coming from the mains is stored into
the capacitor C. For that, the AC voltage is rectified
by the diode Ds.
PHASE 2
At the end of the phase 1, the voltage across the
capacitor C reaches the avalanche threshold of
the zener. Then a current flows through the gate of
the thyristor Th which fires.
The firing of the thyristor causes an alternating
current to flow through the capacitor C.
The positive parts of this current flow through C,
Th and the primary of the HV transformer.
The negative parts of the current flow through C,
D and the primaty of the HV transformer.
COMPONENT CHOICE
RS RESISTOR CALCULATION
The Rs resistor allows, in addition with the capacitor C, the spark frequency to be adjusted and the current from the mains to be limited. Its value shall allow the thyristor Th to fire even in worst case conditions. In this borderline case, the system must fire with the lowest value of RMS mains voltage while
the breakdown voltage and current of the FLC are at the maximum.
The maximum Rs value is equal to :
Rs max =
(V AC min. 2 ) − [V BO max .(1 + α T .( Tamb − 25 ))]
k . I BO *
* : see fig 1
4/8
FLC10-200H/B
Fig. 3: Spark frequency versus Rs and C
F (Hz)
Vac=220Vrms, Vbo=225V, Tamb=25°C
20
C=0
.47µ
F
C=1
10
C=1
C=2
.2µF
C=2
.7µF
5
µF
.5µF
C=3
.3µF
3
2
1
4.7
6.8
10
12
Rs (k Ω )
The couple Rs/C can be chosen with the previous
curve. Keep in mind the Rs maximum limit for
which the system would not work when the AC
15
18
22
27 30
mains is minimum. The next curve shows the behavior with Rs=15kΩ and C=1µF.
Fig. 4: Voltage across the capacitance with Rs = 15kΩ, C = 1µF and VBO = 225V.
5/8
FLC10-200H/B
PEAK CURRENT LIMIT
This component is designed to withstand
ITRM = 240A for a pulse duration of 10µs for an
ambient temperature of 120°C in repetitive surge
(see note 1, page 2).
The curve of peak current versus the pulse
duration allows us to verify if the application
is within the FLC operating limit.
Fig. 5: Peak current limit versus pulse duration.
ITRM(A)
Tj max : 120°C
300
280
260
240
220
200
180
6
8
10
tp (µs)
POWER LOSSES (For 10µs, see note 1)
To evaluate the power losses, please use the following equations :
For the thyristor : P = 1.18 x IT(AV) + 0.035 I2T(RMS)
For the diode : P = 0.67 x IF(AV) + 0.106 I2F(RMS)
6/8
12
14
FLC10-200H/B
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
L2
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
FOOTPRINT
6.7
6.7
3
3
1.6
1.6
2.3
2.3
7/8
FLC10-200H/B
PACKAGE MECHANICAL DATA
IPAK
DIMENSIONS
REF.
Millimeters
Min.
A
E
C2
B2
L2
L
L1
B3
B6
A1
B
V1
B5
C
G
A3
Min.
Typ. Max.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A3
0.7
1.3
0.027
0.051
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
0.85
B5
H
Typ. Max.
B3
D
Inches
0.033
0.3
B6
0.035
0.95
0.037
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
15.9
16.3 0.626
0.641
L
9
9.4
0.354
0.370
L1
0.8
1.2
0.031
0.047
L2
0.8
V1
10°
1
0.031 0.039
10°
OTHER INFORMATION
Type
Marking
Package
Weight
Base qty
Delivery mode
FLC10-200H
FLC10-200H
IPAK
0.40 g
75
Tube
FLC10-200B
FLC10-200B
DPAK
0.3 g
75
Tube
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2001 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
8/8