SMARTCARD MCU Ordering Information For Package And Delivery DATA BRIEFING INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – micromodules, – flat packages, – wafers. MICROMODULES Dedicated package for Smartcard products, the micromodule type depends on the size of the product and on the application. Table 1 lists all available micromodules. ■ FLAT PACKAGES For applications which require surface mount technology, suitable for PC cards, or other security modules, STMicroelectronics offers flat packages listed In Table 2. ■ WAFERS For issuer production need, ST offers sawn and unsawn wafers deliveries, listed in Table 3. Figure 1. Delivery form ■ Table 1. Micromodules in super 35 standard tape Type Description D1, D2 8 contacts for memory cards D15 6 contacts for memory cards D3, D4 8 contacts with ring MCU cards D5 8 contacts for dual contact contactless MCU cards D68 8 contacts for MCU cards D7 6 contacts for dual contact contactless MCU cards C7 Full contactless for MCU cards D8 8 contacts for MCU cards Table 2. Flat Packages Description O20 SO20 for MCU products QF4 TQFP44 for MCU products R20 SO20 on tape and reel for MCU products 4 4 Type SO20 4 4 Table 3. Wafers 261a.ai Type Description W00 Unsawn wafers, 750 µm thickness W20 Unsawn wafers, 275 µm thickness W40 Unsawn wafers, 180 µm thickness S2x 280 µm sawn wafers on UV tape R4x 180 µm sawn wafers on insolated UV tape S4x 180 µm sawn wafers on UV tape T4x 180 µm sawn wafers on blue tape Micromodule Notch 8” Wafer September 2001 This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29. 1/2 SMARTCARD MCU Table 4. Ordering Information Scheme Example: ST19SF08C D45 XXX Product name Z Pre-personalization name “+” if no pre-personalization Delivery Form Customer ROM code name Dxx: Module contact or dual Cxx: Contactless modules Oxx: SO package Wxx: Unsawn wafer Sxy*: Sawn wafer (std UV tape) Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel Note: *where “y” indicates the sawing orientation as shown in Figure 2 Figure 2. Sawing orientation VIEW: WAFER FRONT SIDE GND GND GND ORIENTATION 1 2 GND 3 4 AI02171 Sawn wafers are scribed and mounted in a frame on adhesive tape. The orientation is defined by the position of the GND pad on the die, viewed with active area of product visible, relative to the notches of the frame (as shown in Figure 2). The orientation of the die with respect to the plastic frame notches is specified by the Customer. 2/2 One further concern, when specifying devices to be delivered in this form, is that wafers mounted on adhesive tape must be used within a limited period from the mounting date: – two months, if wafers are stored at 25°C, 55% relative humidity – six months, if wafers are stored at 4°C, 55% relative humidity