ST6215L/25L R LOW VOLTAGE 8-BIT ROM MCUs WITH A/D CONVERTER AND 28 PINS ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 2.4 to 3.9V Supply Operating Range 4 MHz Maximum Clock Frequency 0 to +70°C Operating Temperature Range Run, Wait and Stop Modes 5 Interrupt Vectors Look-up Table capability in Program Memory Data Storage in Program Memory: User selectable size Data RAM: 64bytes 20 I/O pins, fully programmable as: – Input with pull-up resistor – Input without pull-up resistor – Input with interrupt generation – Open-drain or push-pull output – Analog Input 8 I/O lines can sink up to 12mA to drive LEDs 8-bit Timer/ Counter with 7-bit programmable prescaler Digital Watchdog 8-bit A/D Converter with 16 analog inputs On-chip Clock oscillator can be driven by Quartz Crystal Ceramic resonator or RC network Power-on Reset One external Non-Maskable Interrupt ST626x-EMU2 Emulation and Development System (connects to an MS-DOS PC via an RS232 serial line) PDIP28 PSO28 DEVICE SUMMARY DEVICE ROM (Bytes) ST6215L 1836 ST6225L 3884 Rev. 1.0 November 1997 1/10 1 ST6215L/25L 1 GENERAL DESCRIPTION 1.1 INTRODUCTION 1.2 ROM READOUT PROTECTION The ST6215L/25L are low voltage mask programmed ROM version of ST62T15C,T25C OTP devices. They offer the same functionality as OTP devices, selecting as ROM options the options defined in the programmable option byte of the OTP version, with the exception of the LVD Reset that is not available. If the ROM READOUT PROTECTION option is selected, a protection fuse can be blown to prevent any access to the program memory content. In case the user wants to blow this fuse, high voltage must be applied on the TEST pin. Figure 2. Programming Circuit Figure 1. Programming wave form TES T 0 .5s m in 100 s max 5V 15 1 4V typ 10 47 m F 100nF 5 VS S t VDD TES T 150 s typ P ROTE CT TE S T 100mA max 14V 100nF ZP D15 15V VR02003 4mA typ t VR02001 Note: ZPD15 is used for overvoltage protection 2/10 1 ST6215L/25L ST6215L/25L MICROCONTROLLER OPTION LIST Customer Address .................. .................. .................. Contact .................. Phone No . . . . . . . . . . . . . . . . . . Reference . . . . . . . . . . . . . . . . . . .... .... .... .... .... .... ....... ....... ....... ....... ....... ....... SGS-THOMSON Microelectronics references Device: [ ] ST6215L [ ] ST6225L Package: [ ] Dual in Line Plastic [ ] Small Outline Plastic with conditionning: [ ] Standard (Stick) [ ] Tape & Reel Temperature Range: [ ] 0°C to + 70°C Special Marking: [ ] No [ ] Yes ”_ _ _ _ _ _ _ _ _ _ _ ” Authorized characters are letters, digits, ’.’, ’-’, ’/’ and spaces only. Maximum character count: DIP28: 10 SO28: 8 Oscillator Source Selection: [ ] Crystal Quartz/Ceramic resonator [ ] RC Network Watchdog Selection: [ ] Software Activation [ ] Hardware Activation ROM Readout Protection: [ ] Disabled (Fuse cannot be blown) [ ] Enabled (Fuse can be blown by the customer) Note: No part is delivered with protected ROM. The fuse must be blown for protection to be effective. External STOP Mode Control[ ] Enabled TIMER pin pull-up [ ] Enabled NMI pin pull-up [ ] Enabled [ ] Disabled [ ] Disabled [ ] Disabled Comments : Supply Operating Range in the application: Oscillator Fequency in the application: Notes ............................. Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Date ............................. 3/10 1 ST6215L/25L 1.3 ORDERING INFORMATION The following section deals with the procedure for transfer of customer codes to SGS-THOMSON. 1.3.1 Transfer of Customer Code Customer code is made up of the ROM contents and the list of the selected mask options. The ROM contents are to be sent on diskette, or by electronic means, with the hexadecimal file generated by the development tool. All unused bytes must be set to FFh. The selected mask options are communicated to SGS-THOMSON using the correctly filled OPTION LIST appended. 1.3.2 Listing Generation and Verification When SGS-THOMSON receives the user’s ROM contents, a computer listing is generated from it. This listing refers exactly to the mask which will be used to produce the specified MCU. The listing is then returned to the customer who must thoroughly check, complete, sign and return it to SGS-THOMSON. The signed listing forms a part of the contractual agreement for the creation of the specific customer mask. The SGS-THOMSON Sales Organization will be pleased to provide detailed information on contractual points. Table 1. ROM Memory Map for ST6215L Device Address Description 0000h-087Fh 0880h-0F9Fh 0FA0h-0FEFh 0FF0h-0FF7h 0FF8h-0FFBh 0FFCh-0FFDh 0FFEh-0FFFh Reserved User ROM Reserved Interrupt Vectors Reserved NMI Interrupt Vector Reset Vector Table 2. ROM Memory Map for ST6225L Device Address Description 0000h-007Fh 0080h-0F9Fh 0FA0h-0FEFh 0FF0h-0FF7h 0FF8h-0FFBh 0FFCh-0FFDh 0FFEh-0FFFh Reserved User ROM Reserved Interrupt Vectors Reserved NMI Interrupt Vector Reset Vector Table 3. ROM version Ordering Information Sales Type ST6215LB1/XXX ROM Temperature Range PDIP28 1836 Bytes ST6215LM1/XXX ST6225LB1/XXX ST6225LM1/XXX 4/10 1 Package PSO28 0 to +70°C 3884 Bytes PDIP28 PSO28 ST6215L/25L 2 ELECTRICAL CHARACTERISTICS 2.1 ABSOLUTE MAXIMUM RATINGS This product contains devices to protect the inputs against damage due to high static voltages, however it is advisable to take normal precaution to avoid application of any voltage higher than the specified maximum rated voltages. For proper operation it is recommended that VI and VO be higher than VSS and lower than VDD. Reliability is enhanced if unused inputs are connected to an appropriate logic voltage level (VDD or VSS). Symbol VDD Parameter Supply Voltage Power Considerations.The average chip-junction temperature, Tj, in Celsius can be obtained from: Tj=TA + PD x RthJA Where:TA = Ambient Temperature. RthJA =Package thermal resistance (junction-to ambient). PD = Pint + Pport. Pint =IDD x VDD (chip internal power). Pport =Port power dissipation (determined by the user). Value Unit -0.3 to 7.0 V (1) VI Input Voltage VSS - 0.3 to VDD + 0.3 V VO Output Voltage V IO Current Drain per Pin Excluding VDD, V SS VSS - 0.3 to VDD + 0.3(1) ±10 mA 50 mA 50 mA IVDD IVSS Total Current into VDD (source) Total Current out of VSS (sink) Tj Junction Temperature 150 °C TSTG Storage Temperature -60 to 150 °C Notes: - Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended period s may affect device reliability. - (1) Within these limits , clamping diodes are guarantee to be not conductive. Voltages outside these limits are authorised as long as injection current is kept within the specification. 5/10 1 ST6215L/25L 2.2 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Test Conditions Min. Typ. Max. Unit 0 70 °C 2.4 3 3.9 3.9 V 0 0 2.0 4.0 MHz VDD = 2.4 to 3.9V +5 mA Pin Injection Current (negative) VDD = 2.4 to 3.9V -5 mA TA Operating Temperature 1 Suffix Version VDD Operating Supply Voltage fOSC = 2MHz fOSC = 4MHz fOSC Oscillator Frequency 2) VDD = 2.4V VDD = 3.0V IINJ+ Pin Injection Current (positive) IINJ- Notes: 1. Care must be taken in case of negative current injection, where adapted impedance must be respected on analog sources to not affect the A/D conversion. For a -1mA injection, a maximum 10 KΩ is recommended. 2.An oscillator frequency above 1MHz is recommended for reliable A/D results Figure 3. Maximum Operating FREQUENCY (Fmax) Versus SUPPLY VOLTAGE (VDD) Maximum FREQU ENCY (MHz) 4.0 FUNCTION ALITY IS NOT GUARANTEED IN 3.5 THIS AREA 3.0 2.5 2.0 1.5 1 0.5 2.1 2.4 2.7 3.0 3.3 3.6 3.9 SUPPLY VOLTAGE (VDD) The shaded area is outside the recommended operating range; device functionality is not guaranteed under these conditions. 6/10 1 ST6215L/25L 2.3 DC ELECTRICAL CHARACTERISTICS (TA = 0 to +70°C unless otherwise specified) Symbol VIL VIH VHys Parameter Input Low Level Voltage All Input pins Input High Level Voltage All Input pins Hysteresis Voltage (1) All Input pins Low Level Output Voltage All Output pins VOL Low Level Output Voltage 20 mA Sink I/O pins VOH High Level Output Voltage All Output pins R PU Pull-up Resistance IIL IIH IDD Input Leakage Current All Input pins but RESET Input Leakage Current RESET pin Supply Current in RESET Mode Supply Current in RUN Mode (2) Supply Current in WAIT Mode (3) Supply Current in STOP Mode(3) Notes: (1) Hysteresis voltage between switching levels (2) All peripherals running (3) All peripherals in stand-by 7/10 1 Test Conditions Value Min. Typ. Max. V DD x 0.2 VDD= 3V VDD= 3.0V; I OL = +10µA VDD= 3.0V; I OL = + 3.0mA VDD= 2.4V; I OL = + 1.5mA VDD= 3.0V; I OL = +10µA VDD= 3.0V; I OL = + 8mA VDD= 3.0V; I OL = +12mA VDD= 2.4V; I OL = + 5mA VDD= 3.0V; I OH = -10µA VDD= 3.0V; I OH = -1.5mA VDD= 2.4V; I OH = -10µA All Input pins RESET pin VIN = VSS (No Pull-Up configured) VIN = VDD VIN = VSS VIN = VDD VRESET=VSS fOSC=4MHz Unit V V DD x 0.8 V 0.2 V 0.1 0.8 0.8 0.1 0.8 1.3 0.8 2.9 2.0 2.3 100 400 -8 V V 250 600 600 1200 0.1 1.0 -16 -30 10 ΚΩ µA 1.5 mA VDD=3.0V fINT=4MHz 1.5 mA VDD=3.0V 0.5 mA 2 µA ILOAD=0mA VDD=3.0V fINT=4MHz ST6215L/25L DC ELECTRICAL CHARACTERISTICS(Cont’d) 2.4 AC ELECTRICAL CHARACTERISTICS ((TA = 0 to +70°C unless otherwise specified Symbol tREC Parameter Test Conditions Supply Recovery Time (1) Value Min. 100 Unit ms fRC Internal frequency with RC oscillator 2) 3) CIN Input Capacitance All Inputs Pins 10 pF Output Capacitance All Outputs Pins 10 pF 2.5 1.4 450 Notes: 1. Period for which VDD has to be connected at 0V to allow internal Reset function at next power-up. 2 An oscillator frequency above 1MHz is recommended for reliable A/D results. 3. Measure performed with OSCin pin soldered on PCB, with an around 2pF equivalent capacitance. 1 Max. VDD=3.0V R=47kΩ R=100kΩ R=470kΩ C OUT 8/10 Typ. 3 1.7 520 3.5 2.1 600 MHz MHz kHz ST6215L/25L 2.5 A/D CONVERTER CHARACTERISTICS (TA = 0 to +70°C unless otherwise specified) Symbol Parameter Res Resolution ATOT Total Accuracy (1) (2) tC Conversion Time ZIR Zero Input Reading FSR Full Scale Reading AD I AC IN Test Conditions fOSC fOSC fOSC fOSC fOSC Value Typ. 8 Min. Unit Bit ±25 ±35 ±50 > 1.2MHz, VDD=3.0V > 1.2MHz, VDD=2.4V > 32kHz, VDD=3.0V = 2MHz = 4 MHz Conversion result when VIN = VSS Conversion result when VIN = VDD Max. 280 140 mV µs 00 Hex Analog Input Current During VDD= 4.0V Conversion Analog Input Capacitance 2 FF Hex 1.0 µA 5 pF Notes: 1. Noise at VDD, VSS <10mV 2. Wit h oscillator frequencies less than 1MHz, the A/D Converter accuracy is decreased. 2.6 TIMER CHARACTERISTICS ((TA = 0 to +70°C unless otherwise specified) Symbol . 9/10 1 Parameter f IN Input Frequency on TIMER Pin tW Pulse Width at TIMER Pin Test Condi tions Min. Value Typ. Max. Unit MHz VDD = 2.4V 250 ns ST6215L/25L Notes: Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMS ON Microelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in lif e support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1997 SGS-THOMSON Microelectronics -Printed in Italy - All Rights Reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Swit zerland - Taiwan - Thailand - United Kingdom - U.S.A. 10/10 1