MCNIX MX27L1000PC-25

MX27L1000
1M-BIT [128Kx8] LOW VOLTAGE OPERATION
CMOS EPROM
FEATURES
•
•
•
•
•
•
• Operating current: 20mA @3.6V, 5MHz
• Standby current: 10uA
• Package type:
128K x 8 organization
Wide power supply range, 2.7V DC to 3.6VDC
+12.5V programming voltage
Fast access time:90/120/150/200/250 ns
Totally static operation
Completely TTL compatible
-
32 pin plastic DIP
32 pin SOP
32 pin TSOP
32 pin PLCC
GENERAL DESCRIPTION
may be used. The MX27L1000 supports a intelligent fast
programming algorithm which can result in programming
time of less than thirty seconds.
The MX27L1000 is a 1M-bit, One Time Programmable
Read Only Memory. It isorganized as 128K words by 8
bits per word, opeates from a single 2.7 to 3.6 volt supply,
has a static standby mode, and features fast single
address location programming. All programming signals
are TTL levels, requirin a single pulse. For programming
outside from the system, existing EPROM programmers
This EPROM is packaged in industry standard 32 pin
dual-in-line packages,32 lead SOP , 32 lead PLCC, and
32 lead TSOP packages.
PIN CONFIGURATIONS
32 PDIP/SOP
A7
32
CE
PGM
OE
NC
1
PGM
VCC
A16
A15
4
VPP
5
30
29
A13
A5
A8
A4
A9
A3
9
25
MX27L1000
.
.
.
A11
A2
OE
A1
A10
21
20
Q5
Q4
Q3
17
OUTPUT
BUFFERS
Q0~Q17
.
.
.
.
.
Y-DECODER
X-DECODER
.
.
.
.
.
.
.
.
Y-SELECT
1M BIT
CELL
MAXTRIX
Q7
VCC
GND
Q6
13
14
GND
Q0
A0~A16
ADDRESS
INPUTS
CE
A0
CONTROL
LOGIC
A14
A6
Q2
VCC
PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
Q1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX27L1000
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
BLOCK DIAGRAM
32 PLCC
VPP
PIN DESCRIPTION
32 TSOP
A11
A9
A8
A13
A14
NC
PGM
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P/N: PM0238
MX27L1000
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
1
SYMBOL
PIN NAME
A0~A16
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
PGM
Programmable Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin
GND
Ground Pin
REV. 3.8, AUG. 26, 2003
MX27L1000
FUNCTIONAL
DESCRIPTION
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25°C ± 5°C ambient temperature range
that is required when programming the MX27L1000.
THE PROGRAMMING OF THE MX27L1000
When the MX27L1000 is delivered, or it is erased,
the chip has all 1M bits in the "ONE" or HIGH state.
"ZERO" are loaded into the MX27L1000 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
To activate this mode, the programming equipment must
force 12.0 ± 0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
VCC must be applied simultaneously or before VPP, and
removed simultaneously or after VPP.
When
programming an MXIC EPROM, a 0.1uF capacitor is
required across VPP and ground to suppress spurious
voltage transients which may damage the device.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX27L1000, these two identifier bytes are given
in the Mode Select Table. All identifiers for manufacturer
and device codes will possess odd parity, with the MSB
(Q7) defined as the parity bit.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm
is shown in Figure 1). The programming is achieved
by applying a single TTL low level 100us pulse to the
PGM input after addresses and data line are stable. If
the data is not verified, an additional pulse is applied
for a maximum of 25 pulses. This process is repeated
while sequencing through each address of the device.
When the programming mode is completed, the data in
all address is verified at VCC = VPP = 5V ± 10%.
READ MODE
The MX27L1000 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data
to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tQE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
PROGRAM INHIBIT MODE
Programming of multiple MX27L1000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L1000 may be common. A
TTL low-level program pulse applied to an MX27L1000
CE input with VPP = 12.5 ± 0.5 V and PGM LOW will
program that MX27L1000. A high-level CE input inhibits
the other MX27L1000s from being programmed.
STANDBY MODE
The MX27L1000 has a CMOS standby mode which
reduces the maximum VCC current to 10 uA. It is placed
in CMOS standby when CE is at VCC ± 0.3 V. The
MX27L1000 also has a TTL-standby mode which
reduces the maximum VCC current to 0.25mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.
P/N: PM0238
2
REV. 3.8 , AUG. 26, 2003
MX27L1000
TWO-LINE OUTPUT CONTROL FUNCTION
SYSTEM CONSIDERATIONS
To accommodate multiple memory connections, a twoline control function is provided to allow for:
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
Vcc and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between Vcc and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as
the primary device-selecting function, while OE be made
a common connection to all devices in the array and
connected to the READ line from the system control
bus. This assures that all deselected memory devices
are in their low-power standby mode and that the output
pins are only active when data is desired from a particular
memory device.
MODE SELECT TABLE
PINS
MODE
CE
OE
PGM
A0
A9
VPP
OUTPUTS
Read
VIL
VIL
X
X
X
VCC
DOUT
Output Disable
VIL
VIH
X
X
X
VCC
High Z
Standby (TTL)
VIH
X
X
X
X
VCC
High Z
Standby (CMOS)
VCC ± 0.3V
X
X
X
X
VCC
High Z
Program
VIL
VIH
VIL
X
X
VPP
DIN
Program Verify
VIL
VIL
VIH
X
X
VPP
DOUT
Program Inhibit
VIH
X
X
X
X
VPP
High Z
Manufacturer Code(3)
VIL
VIL
X
VIL
VH
VCC
C2H
Device Code(3)
VIL
VIL
X
VIH
VH
VCC
0EH
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A16 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
P/N: PM0238
3
REV. 3.8 , AUG. 26, 2003
MX27L1000
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X=0
PROGRAM ONE 100us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N: PM0238
4
REV. 3.8 , AUG. 26, 2003
MX27L1000
SWITCHING TEST CIRCUITS
1.8K ohm
DEVICE
UNDER
TEST
+5V
CL
6.2K ohm
DIODES = IN3064
OR EQUIVALENT
CL = 100 pF including jig capacitance
CL = 30 pF including jig capacitance for 90/120ns
SWITCHING TEST WAVEFORMS
2.0V
2.0V
TEST POINTS
AC driving levels
0.8V
0.8V
OUTPUT
INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
SWITCHING TEST WAVEFORMS (For Speed 90/120ns)
1.5V
AC driving levels
TEST POINTS
1.5V
OUTPUT
INPUT
AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
P/N: PM0238
5
REV. 3.8 , AUG. 26, 2003
MX27L1000
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating
conditions for extended period may affect reliability.
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature -40oC to 85oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC+0.5V
VCC to Ground Potential
-0.5V to 7.0V
V9 & VPP
-0.5V to 13.5V
NOTICE:
Specifications contained within the following tables are
subject to change.
DC/AC Operating Conditions for Read Operation
MX27L1000
Operating Temperature
Commercial
Industrial
-90
-12
-15
-20
-25
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
-40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
Vcc Power Supply
2.7V to 3.6V
2.7V to 3.6V
2.7V to 3.6V
2.7V to 3.6V
2.7V to 3.6V
DC CHARACTERISTICS
SYMBOL PARAMETER
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MIN.
MAX.
UNIT
VCC - 0.3
CONDITIONS
V
IOH = -100uA VCC=3.0V
0.3
V
IOL = 2.1mA, VCC = 3.0V
2.0
Vcc + 0.5
V
Input Low Voltage
-0.3
0.6
V
2.7V < VCC < 3.6V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 3.6V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 3.6V
ICC3
VCC Power-Down Current
10
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
0.25
mA
CE = VIH
ICC1
VCC Active Current
20
mA
CE = VIH, f=5MHz, lout = OmA,
Vcc=3.6V
IPP
Supply Current Read
10
uA
CE = OE = VIL, VPP = VCC
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL PARAMETER
TYP.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
CVPP
VPP Capacitance
18
25
pF
VPP = 0V
P/N: PM0238
6
REV. 3.8 , AUG. 26, 2003
MX27L1000
AC CHARACTERISTICS
27L1000-90 27L1000-12 27L1000-15 27L1000-20 27L1000-25
Symbol PARAMETER
tACC
MIN.
Address to Output Delay
MAX. MIN.
MAX. MIN.
MAX. MIN.
MAX. MIN.
MAX. UNIT CONDITIONS
90
120
150
200
250
ns
CE = OE = VIL
tCE
Chip Enable to Output Delay
90
120
150
200
250
ns
OE = VIL
tOE
Output Enable to Output Delay
40
50
70
100
120
ns
CE = VIL
tDF
OE High to Output Float,
70
ns
0
30
0
40
0
50
0
60
0
or CE High to Output Float
tOH
Output Hold from Address,
0
0
0
0
0
ns
CE or OE which ever occurred first
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MIN.
MAX.
UNIT
CONDITIONS
V
IOH = -0.10mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current (Program & Verify)
50
mA
IPP2
VPP Supply Current(Program)
30
mA
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
2.4
VIN = 0 to 3.6V
CE = VIL, OE = VIH
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
Out put Enable to Output Float Delay
0
tVPS
VPP Setup Time
2.0
tPW
PGM Program Pulse Width
95
tVCS
VCC Setup Time
2.0
us
tCES
CE Setup Time
2.0
us
tOE
Data valid from OE
P/N: PM0238
MAX.
130
ns
us
105
150
7
UNIT
us
ns
REV. 3.8 , AUG. 26, 2003
MX27L1000
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
tOH
FAST PROGRAMMING ALGORIHTM WAVEFORMS
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
DATA
tAH
Hi-z
tAS
DATA OUT VALID
DATA IN STABLE
tDS
tDFP
tDH
VPP1
VPP
VCC
tVPS
VCC1
VCC
tVCS
VCC
VIH
CE
VIL
tCES
VIH
PGM
VIL
tOES
tPW
tOE
Max
VIH
OE
P/N: PM0238
VIL
8
REV. 3.8 , AUG. 26, 2003
MX27L1000
ORDER INFORMATION
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
CURRENT MAX.(mA) CURRENT MAX.(uA)
OPERATING
PACKAGE
TEMPERATURE
MX27L1000PC-25
250
30
10
0°C to 70°C
32 Pin DIP
MX27L1000QC-25
250
20
10
0°C to 70°C
32 Pin PLCC
MX27L1000MC-25
250
30
10
0°C to 70°C
32 Pin SOP
MX27L1000TC-25
250
30
10
0°C to 70°C
32 Pin TSOP
MX27L1000PC-20
200
30
10
0°C to 70°C
32 Pin DIP
MX27L1000QC-20
200
20
10
0°C to 70°C
32 Pin PLCC
MX27L1000MC-20
200
30
10
0°C to 70°C
32 Pin SOP
MX27L1000TC-20
200
30
10
0°C to 70°C
32 Pin TSOP
MX27L1000PC-15
150
30
10
0°C to 70°C
32 Pin DIP
MX27L1000QC-15
150
20
10
0°C to 70°C
32 Pin PLCC
MX27L1000MC-15
150
30
10
0°C to 70°C
32 Pin SOP
MX27L1000TC-15
150
30
10
0°C to 70°C
32 Pin TSOP
MX27L1000PC-12
120
30
10
0°C to 70°C
32 Pin DIP
MX27L1000QC-12
120
20
10
0°C to 70°C
32 Pin PLCC
MX27L1000MC-12
120
30
10
0°C to 70°C
32 Pin SOP
MX27L1000TC-12
120
30
10
0°C to 70°C
32 Pin TSOP
MX27L1000PC-90
90
30
10
0°C to 70°C
32 Pin DIP
MX27L1000QC-90
90
20
10
0°C to 70°C
32 Pin PLCC
MX27L1000MC-90
90
30
10
0°C to 70°C
32 Pin SOP
MX27L1000TC-90
90
30
10
0°C to 70°C
32 Pin TSOP
MX27L1000PI-25
250
30
10
-40°C to 85°C
32 Pin DIP
MX27L1000QI-25
250
20
10
-40°C to 85°C
32 Pin PLCC
MX27L1000MI-25
250
30
10
-40°C to 85°C
32 Pin SOP
MX27L1000TI-25
250
30
10
-40°C to 85°C
32 Pin TSOP
MX27L1000PI-20
200
30
10
-40°C to 85°C
32 Pin DIP
MX27L1000QI-20
200
20
10
-40°C to 85°C
32 Pin PLCC
MX27L1000MI-20
200
30
10
-40°C to 85°C
32 Pin SOP
MX27L1000TI-20
200
30
10
-40°C to 85°C
32 Pin TSOP
MX27L1000PI-15
150
30
10
-40°C to 85°C
32 Pin DIP
MX27L1000QI-15
150
20
10
-40°C to 85°C
32 Pin PLCC
MX27L1000MI-15
150
30
10
-40°C to 85°C
32 Pin SOP
MX27L1000TI-15
150
30
10
-40°C to 85°C
32 Pin TSOP
MX27L1000PI-12
120
30
10
-40°C to 85°C
32 Pin DIP
MX27L1000QI-12
120
20
10
-40°C to 85°C
32 Pin PLCC
MX27L1000MI-12
120
30
10
-40°C to 85°C
32 Pin SOP
MX27L1000TI-12
120
30
10
-40°C to 85°C
32 Pin TSOP
MX27L1000PI-90
90
30
10
-40°C to 85°C
32 Pin DIP
MX27L1000QI-90
90
20
10
-40°C to 85°C
32 Pin PLCC
MX27L1000MI-90
90
30
10
-40°C to 85°C
32 Pin SOP
MX27L1000TI-90
90
30
10
-40°C to 85°C
32 Pin TSOP
P/N: PM0238
9
REV. 3.8 , AUG. 26, 2003
MX27L1000
PACKAGE INFORMATION
P/N: PM0238
10
REV. 3.8 , AUG. 26, 2003
MX27L1000
P/N: PM0238
11
REV. 3.8 , AUG. 26, 2003
MX27L1000
P/N: PM0238
12
REV. 3.8 , AUG. 26, 2003
MX27L1000
P/N: PM0238
13
REV. 3.8 , AUG. 26, 2003
MX27L1000
REVISION HISTORY
Revision No. Description
2.4
Page 3:Mode Select Table : VPP pin-"VCC" instead of " X".
Revise SWITCHING TEST WAVEFORM, VOL=0.6V to VOL=0.8V.
3.0
Eliminate Interactive Programming Mode.
3.1
IPP 100uA --> 10uA
3.2
Change TSOP Orientation
3.3
Add speed 90/120ns
Change VIH/VIL, VOH/VOL for 90/120ns
Change CL to 30pF for 90/120ns
3.4
Cancel 32pin ceramic DIP Package
3.5
To modify Package Information
3.6
Cancel "Ultraviolet Erasable" wording in General Description
3.7
To modify Package Information
3.8
To modify 32-PLCC package information
A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom.
from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.
P/N: PM0238
14
Page
Date
9/24/1996
P1,9,10
P5
P5
P1,2,9,11
P10~13
P1
P10~13
P12
6/18/1997
8/07/1997
4/09/1998
OCT/13/1999
FEB/25/2000
JUL/19/2001
AUG/20/2001
NOV/19/2002
AUG/26/2003
REV. 3.8 , AUG. 26, 2003
MX27L1000
MACRONIX INTERNATIONAL CO., LTD.
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