INDEX MX27C8000 8M-BIT [1M x8] CMOS EPROM FEATURES • • • • • • • Operating current: 60mA • Standby current: 100uA • Package type: 1M x 8 organization Single +5V power supply +12.5V programming voltage Fast access time: 100/120/150 ns Totally static operation Completely TTL compatible - 32 pin ceramic DIP, plastic DIP - 32 pin PLCC/SOP GENERAL DESCRIPTION The MX27C8000 is a 5V only, 8M-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 1M words by 8 bits per word, operates from a single +5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27C8000 supports a intelligent fast programming algorithm which can result in programming time of less than two minutes. This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead PLCC , and 32 lead SOP packages. PIN CONFIGURATIONS A7 A0~A19 ADDRESS INPUTS . . . . . . . . Y-DECODER X-DECODER A17 32 A18 VCC 1 30 29 A14 A6 A13 A5 A8 A9 A3 9 MX27C8000 25 A11 A2 OE/VPP A1 A10 CE A0 21 20 Q5 Q4 Q3 Q2 17 Q7 Q6 13 14 GND Q0 PIN DESCRIPTION CONTROL LOGIC OE/VPP 4 A4 BLOCK DIAGRAM CE 5 A19 VCC A18 A17 A14 A13 A8 A9 A11 OE/VPP A10 CE Q7 Q6 Q5 Q4 Q3 A16 A12 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 Q1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27C8000 A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND A15 32 PLCC 32 CDIP/PDIP/SOP OUTPUT BUFFERS . . . . . . . . Q0~Q7 Y-SELECT SYMBOL PIN NAME A0~A19 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE/VPP Output Enable Input/Program Supply Voltage 8M BIT CELL VCC Power Supply Pin (+5V) MAXTRIX GND Ground Pin VCC GND P/N: PM00259 1 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 FUNCTIONAL DESCRIPTION the data in all address is verified at VCC = 5V ± 10%. THE ERASURE OF THE MX27C8000 PROGRAM INHIBIT MODE The MX27C8000 is erased by exposing the chip to an ultraviolet light source. A dosage of 15 W seconds/cm2 is required to completely erase a MX27C8000. This dosage can be obtained by exposure to an ultraviolet lamp - wavelength of 2537 Angstroms (A) - with intensity of 12,000 uW/cm2 for 15 to 20 minutes. The MX27C8000 should be directly under and about one inch from the source and all filters should be removed from the UV light source prior to erasure. Programming of multiple MX27C8000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C8000 may be common. A TTL low-level program pulse applied to an MX27C8000 CE input with OE/VPP = 12.5 ± 0.5 Vwill program that MX27C8000. A high-level CE input inhibits the other MX27C8000s from being programmed. PROGRAM VERIFY MODE It is important to note that the MX27C8000, and similar devices, will be cleared for all bits of their programmed states with light sources having wavelengths shorter than 4000 A. Although erasure times will be much longer than that with UV sources at 2537 A, nevertheless the exposure to fluorescent light and sunlight will eventually erase the MX27C8000 and exposure to them should be prevented to realize maximum system reliability. If used in such an environment, the package window should be covered by an opaque label or substance. Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE /VPPand CE, at VIL, data should be verified tDV after the falling edge of CE. AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C8000. THE PROGRAMMING OF THE MX27C8000 When the MX27C8000 is delivered, or it is erased, the chip has all 8M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C8000 through the procedure of programming. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C8000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage OE/VPP = 12.75V is applied, with VCC = 6.25 V (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 50us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, P/N: PM00259 READ MODE The MX27C8000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the 2 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE's, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE. STANDBY MODE SYSTEM CONSIDERATIONS The MX27C8000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C8000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. MODE SELECT TABLE PINS MODE CE OE/VPP A0 A9 OUTPUTS Read VIL VIL X X DOUT Output Disable VIL VIH X X High Z Standby (TTL) VIH X X X High Z Standby (CMOS) VCC±0.3V X X X High Z Program VIL VPP X X DIN Program Verify VIL VIL X X DOUT Program Inhibit VIH VPP X X High Z Manufacturer Code(3) VIL VIL VIL VH C2H Device Code(3) VIL VIL VIH VH 80H 3. A1 - A8 = A10 - A19 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL P/N: PM00259 3 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 FIigure 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V OE/VPP = 12.75V PROGRAM ONE 50 us PULSE LAST NO INCREMENT ADDRESS ADDRESS ? YES ADDRESS = FIRST LOCATION X=0 INCREMENT ADDRESS NO LAST PASS VERIFY BYTE ADDRESS ? FAIL INCREMENT X YES NO PROGRAM ONE 50us PULSE YES VCC = 5.25V OE/VPP = VIL COMPARE ALL BYTES TO ORIGINAL DATA X = 25 ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM00259 4 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V CL 6.2K ohm DIODES = IN3064 OR EQUIVALENT CL = 100 pF including jig capacitance(60pF for 100ns parts) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade. Input pulse rise and fall times are < 10ns. P/N: PM00259 5 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature 0oC to 70oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V V9 & VPP -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Condition for Read Operation MX27C8000 Operationg Temperature Commercial Vcc Power Supply -10 -12 -15 0°C to 55°C 0°C to 70°C 0°C to 70°C 5V ± 10% 5V ± 10% 5V ± 10% DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 60 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = 5.5V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V P/N: PM00259 6 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 AC CHARACTERISTICS 27C8000-10 27C8000-12 27C8000-15 MIN. MIN. MIN. SYMBOL PARAMETER tACC Address to Output Delay 100 tCE Chip Enable to Output Delay 100 tOE tDF Output Enable to Output Delay OE High to Output Float, tOH or CE High to Output Float Output Hold from Address, CE or OE which ever occurred first 0 MAX. 40 30 0 0 MAX. MAX. UNIT CONDITIONS 120 150 ns CE = OE = VIL 120 150 ns OE = VIL 65 50 ns ns CE = VIL 50 35 0 0 0 ns DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V VIN = 0 to 5.5V CE = VIL AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC SYMBOL PARAMETER MIN. tAS Address Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Chip Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW CE Program Pulse Width tVCS VCC Setup Time tDV Data Valid from CE tOEH OE/VPP Hold Time 2.0 us tVR OE/VPP Recovery Time 2.0 us P/N: PM00259 TYP. MAX. 130 CONDITIONS ns us 50 us 2.0 us 150 7 UNIT ns REV. 3.1, Dec 19, 1997 INDEX MX27C8000 WAVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGORITHM WAVEFORMS PROGRAM PROGRAM VERIFY VIH Addresses VIL Hi-z tAS DATA OUT VALID DATA tDV tDS tDH tDFP VPP1 OE/VPP VIL tVPS tVR tPW VIH CE tVPS tAH VIL tVCS VCC1 VCC P/N: PM00259 VCC 8 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 ORDERING INFORMATION CERAMIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) STANDBY CURRENT MAX.(uA) PACKAGE MX27C8000DC-10 100 60 100 32 Pin DIP MX27C8000DC-12 120 60 100 32 Pin DIP MX27C8000DC-15 150 60 100 32 Pin DIP PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) STANDBY CURRENT MAX.(uA) PACKAGE MX27C8000PC-10 100 60 100 32 Pin DIP MX27C8000QC-10 100 60 100 32 Pin PLCC MX27C8000MC-10 100 60 100 32 Pin SOP MX27C8000PC-12 120 60 100 32 Pin DIP MX27C8000QC-12 120 60 100 32 Pin PLCC MX27C8000MC-12 120 60 100 32 Pin SOP MX27C8000PC-15 150 60 100 32 Pin DIP MX27C8000QC-15 150 60 100 32 Pin PLCC MX27C8000MC-15 150 60 100 32 Pin SOP P/N: PM00259 9 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 PACKAGE INFORMATION 32-PIN CERDIP(MSI) WITH WINDOW (600mil) ITEM MILLIMETERS INCHES A 42.26 max 1.665 max B 1.90 ± .38 .075 ± .015 C 2.54 [TP] .100 [TP] D .46 [REF] .018 [REF] E 38.07 1.500 F 1.42 [REF] .056 [REF] G 3.43 ± .38 .135 ± .015 H .96 ± .43 .038 ± .017 I 4.06 .160 J 5.00 .203 K 15.58 ± .13 .614 ± .005 L 13.20 ± .38 .520 ± .015 M .25 [REF] .010 [REF] ø8.12 ø.320 N NOTE: 32 17 N 1 16 K L A I J H G F D Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. C B M 0.15¡ E 32-PIN PLASTIC DIP(600 mil) ITEM MILLIMETERS INCHES A 42.13 max. 1.660 max. B 1.90 [REF] .075 [REF] C 2.54 [TP] .100 [TP] D .46 [Typ.] .018 [Typ.] E 38.07 1.500 F 1.27 [Typ.] .050 [Typ.] G 3.30 ± .25 .130 ± .010 H .51 [REF] .020 [REF] I 3.94 ± .25 .155 ± .010 J 5.33 max. .210 max. K 15.22 ± .25 .600 ± .010 L 13.97 ± .25 .550 ± .010 M .25 [Typ.] .010 [Typ.] NOTE: P/N: PM00259 32 17 16 1 A F D Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. K L C B I J H G M 0~15¡ E 10 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 PACKAGE INFORMATION 32-PIN PLASTIC LEADED CHIP CARRIER (PLCC) A ITEM MILLIMETERS INCHES A 12.44 ± .13 .490 ± .005 B 11.50 ± .13 .453 ± .005 C 14.04 ± .13 .553 ± .005 D 14.98 ± .13 .590 ± .005 E 1.93 .076 F 3.30 ±.25 .130 ± .010 G 2.03 ± .13 .080 ± .005 H .51 ± .13 .020 ± .005 I 1.27 [Typ.] .050 [Typ.] J .71[REF] .028[REF] K L .46 [REF] 10.40/12.94 (W) (L) .018 [REF] .410/.510 (W) (L) M .89 R .035 R N .25 (TYP.) .010 (TYP.) NOTE: B 1 4 32 30 5 29 9 25 13 C D 21 14 20 17 E F Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. N G H M I J K L 32-PIN PLASTIC SOP(450 mil) ITEM MILLIMETERS A 20.95 max. .825 max. B 1.00 [REF] .039 [REF] C 1.27 [TP] .050 [TP] D .40 [Typ.] .016 [Typ.] E .05 min. .002 min. F 3.05 max. .120 max. G 2.69 ± .13 .106 ± .005 H 14.12 ± .25 .556 ± .010 I 11.30 ± .13 .445 ± .005 J 1.42 .056 K .20 [Typ.] .008 [Typ.] L .79 .031 NOTE: P/N: PM00259 INCHES Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32 17 1 16 H A I G J F K E D C 11 B L REV. 3.1, Dec 19, 1997 INDEX MX27C8000 Revision History Revision No. Description 2.0 1) Eliminate Interactive Programming Mode. 2) Programming pulse change from 100us to 50us. 3.0 1)Partial specification change for 100ns speed grade 1-1) SWITCHING TEST Condition CL = 100pF---> CL = 60pF 1-2) Operating Temperature 0°C to 70°C ----> 0°C to 55°C 1-3) Vcc, 5V ± 10%----> 5V ± 5% 2)IPP1 100uA ----> 10uA. 3.1 1)Partial specification change for 100ns speed grade, VCC:5V ± 5% ----->5V ± 10% P/N: PM00259 12 Date 5/30/1997 7/18/1997 12/19/1997 REV. 3.1, Dec 19, 1997 INDEX MX27C8000 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-8888 FAX:+886-3-578-8887 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-747-2309 FAX:+65-748-4090 TAIPEI OFFICE: TEL:+886-3-509-3300 FAX:+886-3-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice. 13