Intel approved CoolFin™ heat sink from Molex achieves high performance and low noise with innovative design. Introducing the newest style of Molex heat sinks, CoolFin. CoolFin heat sinks are made from stamped fins soldered to base plates. CoolFin technology allows for variable fin pitch, geometry, material type and thickness. They are designed to maximize thermal efficiency in the smallest and lightest weight package possible. CoolFin™ Heat Sink with Integrated Heat Pipes 37717 For use with Intel* Pentium*4 “Prescott” Processor Socket 478 The 37717 series CoolFin heat sink has been designed to offer superior cooling for the Intel Pentium “Prescott” microprocessor. It is available in different speeds or can be fitted with a thermistor controlled fan for motherboards without variable speed fan technology. These fan options help the customer match cooling requirements with acoustic goals. The 37717 series fin package has been maximized to meet thermal performance and weight requirements. In the center fin group, copper is used directly above the heat source to maximize thermal efficiency. The outer fins are made up of lighter aluminum material to save weight. The two heat pipes further increase efficiency and create 16-17% margin at the highest fan speed; this allows customers to explore lower speed fans for better acoustics. The innovative “half-moon” base design leaves tradition behind and saves weight, while achieving high performance to meet the needs of Intel’s hottest new processor. The standard heat sink comes with a 70,000 hour MTFB dual ball bearing fan, and ShinEtsu G-751 thermal interface material. Custom fans and interface are available on request. *Intel and Pentium are registered trademarks of Intel Corporation Features and Benefits ■ Intel approved allows customers with limited testing capability to specify part with confidence ■ Meets Intel .330° C/W thermal resistance target which ensures reliable system at any usage level ■ At .275°C/W the 6000 RPM version offers 17% margin over Intel specification which gives customer ability to scale up to higher speed processor without upgrading heat sink ■ ■ ■ ■ At 31 dB-A the medium speed version meets thermal spec which offers excellent acoustics for sensitive environments Dual ball fan provides much higher reliability than ball/sleeve, up to 70,000 hrs MTBF Low weight: 435 grams (Intel max spec.= 450g) applies less stress on socket or board Easy to use, robust clip design is easy to assemble, ensures proper application force SPECIFICATIONS Reference Packaging: Tray/Box Fan UL File No.: Various Fan CSA File No : Various Mates With: Socket 478 Designed In: mm Electrical: 37717-0001 Fan min. starting Voltage: 4 VDC Operational voltage range: 4–12.5 VDC Current: .35A Connector: Molex 3 Pin 2695-03-22-01-3037 Thermal Efficiency (°C/W) 37717-0001: .275 °C/W Mechanical Retention Clip mating Force: 55-65 lbs total Physical Weight: 435g Fan size: 70x15mm Fan bearing type: Dual ball Heat sink: Copper base, Copper/Aluminum fins, Copper heat pipes Operating temp: 0 to + 85°C Thermal Interface Material options: ShinEtsu – G-751 Note: Custom interface or fan options available on request. CoolFin™ Heat Sink with Integrated Heat Pipes APPLICATIONS ■ ■ ■ Desktop Workstation Distribution: wherever tray processors are sold 37717 For use with Intel* Pentium*4 “Prescott” Processor Socket 478 ORDERING INFORMATION Fan Speed (°C/W) Θ CASE-TO-AMBIENT 37717-0001 37717-1001 RPM CFM Fan Noise (dBA) Power (W) T CASE (°C) TAMBIENT (°C) T CASE-T0-AMBIENT (°C) T CASE-T0-AMBIENT (°C/W) 6000 3300 41.95 28.80 46.5 31.0 75.0 75.0 53.6 56.8 33.0 33.0 20.6 23.8 0.275 0.317 0.330 0.320 0.310 0.300 0.290 0.280 0.270 0.260 0.250 50.0 .315 °C/W 45.0 46.5 dB-A 40.0 35.0 30.0 .275 °C/W 31.0 dB-A 25.0 Fan Noise (dBA) Order No. 20.0 37717-0001 37717-1001 Molex Order Number Thermal Resistance Fan Noise *Thermal efficiency or thermal resistance, expressed as “Degrees Celsius per watt (°C/W)”, is an industry standard measure of heat sink performance. Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 V isit o u r W e b si t e at www.mo l e x .co m/ h e at si n k .h t ml Order No. USA-221 Printed in USA/JI/2004.02 2004, Molex ©