MOLEX 51248-4782

Micro PGA Socket
478/479 Circuits
For Mobile Pentium* 4
ZIF Type, BGA Mount
INTRODUCTION
Molex's latest Micro PGA sockets are designed to
accept Mobile Pentium* 4 and Mobile Celeron*
Processor-M series for applications such as thin
notebooks and blade servers. These high-density
sockets feature low profiles and proven Ball Grid
Array (BGA) soldering technology for stable PCB
processing.
The new sockets include an easy-to-use cam
mechanism and stainless steel cam retainer to
prevent wear-and-tear on the housing during use.
The terminal includes a dual-beam chamfered
contact for good electrical performance, and BGAinterface design to ensure good thermal mismatch
control between components and the PCB.
Molex's Micro PGA sockets are part of our growing
family of innovative socketing solutions for
processor, memory and test applications.
Applications:
■ Notebook PCs
■ Blade Servers
Blade Server
*Pentium and Celeron are registered trademarks of Intel
Corporation
FEATURES AND BENEFITS
Stainless steel cam retainer protects
plastic cover from wear.
Blue Color Version For
Centrino* Mobile
Technology Processors
Dual-beam chamfered
contact design provides
low insertion force and
good electrical
performance.
LCP housing and cover
with profile height of
3.30mm (.130")
Accepts energy-saving Pentium mobile processors
For notebooks, blade servers and small desktop PCs
■ 478 circuits
■ Small pin layout difference and blue color to
differentiate from standard P4-M socket
■ Same features as standard P4-M socket
■ Order No.: 500210-4784
■
■
Ball Grid Array (BGA) solder balls are
self-centering and avoid the problem of
bent tails.
* Centrino is a trademark of Intel Corporation
SPECIFICATIONS
Physical
Housing
Black LCP, UL 94V-0
Voltage
Contact
Copper Alloy
Current
0.5A
Solder Ball
Tin/Lead, 0.76mm (.030") dia.
Contact Resistance
25 milliohms max.
CAM
Stainless Steel
Dielectric Withstanding Voltage
AC 360V
CAM Holder
Stainless Steel
Insulation Resistance
800 Megohms min.
Plating—Contact Area
Gold
Underplating
Nickel
Operating Temperature
-20 to +90˚C
Electrical
Mechanical
Reference
100V
Durability
50 cycles
Product Specification
PS-51248-005
Packaging
Hard Tray/ Embossed Tape
Designed In
Millimeters
Micro PGA Socket
478/479 Circuits
For Mobile Pentium* 4
ZIF Type, BGA Mount
MICRO PGA DRAWING
ORDERING INFORMATION
Circuits
478
479
Order No.
Hard Tray
51248-4782
51248-4792
Embossed Tape
51248-4784
51248-4794
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
Tel: 1-800-78MOLEX
[email protected]
Far East North Headquarters
Yamato, Kanagawa, Japan
Tel: 81-462-65-2324
[email protected]
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Jurong, Singapore
Tel: 65-6268-6868
[email protected]
European Headquarters
Munich, Germany
Tel: 49-89-413092-0
[email protected]
Corporate Headquarters
2222 Wellington Court
Lisle, Illinois 60532 U.S.A.
Tel: 630-969-4550
[email protected]
Visit our Web site at http: // www.molex.com
Order No. JPN-034
Printed in Japan/3K/MXJ/Brain House/2003.03
©2003, Molex Japan