NL17SV32XV5T2 Single Gate 2−Input OR Gate The NL17SV32 is an ultra−high performance 2 input OR gate manufactured in 0.35 CMOS technology with excellent performance down to 0.9 volts. This device is ideal for extremely high−speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. http://onsemi.com Features • • • • • • • Extremely High Speed: tPD = 1.0 ns (Typ) at VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation Balanced 24 mA Output Drive @ 3.3 Volts Near Zero Static Supply Current Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm All Devices in Package SOT−553 are Inherently Pb−Free** MARKING DIAGRAM 5 1 SOT−553 CASE 463B UM D UM = Specific Device Code D = Date Code Typical Applications • • • • Cellular Digital Camera PDA Digital Video PIN DIAGRAM Important Information A 1 B 2 GND 3 5 VCC 4 Y • High ESD Ratings for Handling: • Human Body Model: 2000 V Machine Model: 200 V Latchup Max Rating: 500 mA PIN ASSIGNMENT Industry Standard • Compatible with Fairchild’s NC7SV32 and TI’s SN74AUC1G32 FUNCTION TABLE Input A Input B Output Y L L H H L H L H L H H H 1 Input A 2 Input B 3 GND − 4 Output Y 5 VCC − ORDERING INFORMATION *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. Device Package Shipping† NL17SV32XV5T2 SOT−553 (Pb−Free) 4000 Tape & Reel (178 mm) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 1 1 Publication Order Number: NL17SV32XV5T2/D NL17SV32XV5T2 MAXIMUM RATINGS Symbol VCC Rating DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO Value Unit −0.5 to + 4.6 V −0.5 to + 4.6 V −0.5 to VCC +0.5 V VI < GND ±50 mA VO = GND VO = VCC −50 +50 mA DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±50 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range ±50 mA − 65 to +150 °C °C TL Lead Temperature, 1.0 mm from Case for 10 seconds 260 TJ Junction Temperature Under Bias +150 °C JA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity FR Flammability Rating Level 1 Oxygen index: 28 to 34 UL 94 V−0 @ 0125 in Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN Digital Input Voltage Vout Output Voltage IOH/IOL Output Current tA Max Unit 0.9 3.6 V 0 3.6 V 0 VCC V ±24 ±18 ±6 ±4 ±2 ±0.1 mA −40 +85 °C 0 10 nS/V VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V Operating Temperature Range. All Package Types tr, tf Min VCC = 3.3V ± 0.3 V Input Rise or Fall Time DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 2 NL17SV32XV5T2 DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND) TA = 25°C Symbol Parameter VCC Min VIH High Level Input Voltage 0.90 1.10 = VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIL Low Level Input Voltage 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = −40 to 85°C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Unit V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V IOH = −100 A 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 IOH = −2.0 mA 1.10 VCC 1.30 0.75 x VCC 0.75 x VCC IOH = −4.0 mA 1.40 VCC 1.60 0.75 x VCC 0.75 x VCC IOH = −6.0 6 0 mA 1.65 65 VCC 1.95 95 2.30 VCC 2.70 1.25 5 2.0 1.25 5 2.0 IOH = −12 mA 2.30 VCC 2.70 2.70 VCC 3.60 1.8 2.2 1.8 2.2 IOH = −18 mA 2.30 VCC 2.70 2.70 VCC 3.60 1.7 2.4 1.7 2.4 IOH = −24 mA 2.70 VCC 3.60 2.2 2.2 IOL = 100 A 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 VCC 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 VCC 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 VCC 1.95 0.3 0.3 IOL = 12 mA 2.30 VCC 2.70 2.70 VCC 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 VCC 2.70 2.70 VCC 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 VCC 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 A 0 1 5 A 0.90 to 3.60 0.9 5 A VI = VCC or GND http://onsemi.com 3 V V NL17SV32XV5T2 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C 25°C Min Typ 85°C Symbol Parameter Condition VCC Max Min Max TPHL,, TPLH Propagation Delay CL = 15 pF, RL = 1.0 M 0.90 CL = 15 pF, RL = 2.0 k 1.10 VCC 1.30 1.40 VCC 1.60 3.0 1.0 6.0 3.2 15.8 8.7 1.0 1.0 18.6 9.7 nS CL = 30 pF, RL = 500 k 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 1.0 0.8 0.7 2.0 1.2 1.0 6.0 4.1 3.3 1.0 0.7 0.6 6.8 4.7 4.0 nS 13 Unit nS CIN Input Capacitance 0 2.0 pF COUT Output Capacitance 0 4.5 pF CPD Power Dissipation Capacitance 0.90 to 3.60 20 pF VI = 0 V or VCC F = 10 MHz http://onsemi.com 4 NL17SV32XV5T2 PACKAGE DIMENSIONS SOT−553 5−LEAD PACKAGE CASE 463B−01 ISSUE A A −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. C K 4 1 2 B −Y− 3 D G S DIM A B C D G J K S J 5 PL 0.08 (0.003) M X Y MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 NL17SV32XV5T2 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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