PSL22 thru PSL24 SILICON EPITAXIAL PLANER TYPE Low VF Chip Schottky Diodes SMA/DO-214AC 0.189(4.8) 0.165(4.2) 0.012(0.3) Typ . 0.106(2.7) 0.091(2.3) 0.165(4.2) 0.150(3.8) 0.071(1.8 ) 0.055(1.4) 0.040(1.0) Typ . 0.040 (1.0) Typ . Dimensions in inches and (millimeters) FEATURES MECHANICAL DATA Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Ufizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of ML-S-19500/228 Low leakage current Case JEDEC D0-214AC/SMA molded plastic Terminals Solder plated, solderable per MIL-STD-750, Method 2026 Polarity Indicated by cathode band Mounting Position Any Weight 0.05gram MAXIMUM RATINGS (at TA=25 C unless otherwise noted) o PARAMETER CONDITIONS SYMBOL Forward rectified current See Fig.1 Forward surge current 8.3ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method) Reverse current VR=VRRM TA=250C Typ. Max. UNITS IO 2.0 A IFSM 50 A 1.0 mA Min. IR 0 VR=VRRM TA=100 C 10 RJA Thermal resistance Junction to ambient Diode junction capacitance F=1MHz and applied 4vDC reverse voltage Storage temperature *2 *3 -55 *4 MARKING CODE VRRM (V) VRMS (V) VR (V) PSL22 SL22 20 14 20 0.38 PSL23 SL23 30 21 30 0.40 PSL24 SL24 40 28 40 0.40 www.paceleader.tw 1 pF +150 SYMBOLS *1 Repetitive peak reverse peak reverse *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage C/W 160 CJ TSTG *1 mA 0 70 VF (V) 0 C Operating Temperature (0C) -55 to + 125 PSL22 thru PSL24 SILICON EPITAXIAL PLANER TYPE Crownpo Technology www.paceleader.tw 2