PACELEADER PSL24

PSL22 thru PSL24
SILICON EPITAXIAL PLANER TYPE
Low VF Chip Schottky Diodes
SMA/DO-214AC
0.189(4.8)
0.165(4.2)
0.012(0.3) Typ .
0.106(2.7)
0.091(2.3)
0.165(4.2)
0.150(3.8)
0.071(1.8 )
0.055(1.4)
0.040(1.0) Typ .
0.040 (1.0) Typ .
Dimensions in inches and (millimeters)
FEATURES
MECHANICAL DATA
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0 Ufizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of ML-S-19500/228
Low leakage current
Case JEDEC D0-214AC/SMA molded plastic
Terminals Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity Indicated by cathode band
Mounting Position Any
Weight 0.05gram
MAXIMUM RATINGS (at TA=25 C unless otherwise noted)
o
PARAMETER
CONDITIONS
SYMBOL
Forward rectified current
See Fig.1
Forward surge current
8.3ms Single Half Sine-Wave Superimposed
on Rated Load (JEDEC Method)
Reverse current
VR=VRRM TA=250C
Typ.
Max.
UNITS
IO
2.0
A
IFSM
50
A
1.0
mA
Min.
IR
0
VR=VRRM TA=100 C
10
RJA
Thermal resistance
Junction to ambient
Diode junction capacitance
F=1MHz and applied 4vDC reverse voltage
Storage temperature
*2
*3
-55
*4
MARKING CODE
VRRM
(V)
VRMS
(V)
VR
(V)
PSL22
SL22
20
14
20
0.38
PSL23
SL23
30
21
30
0.40
PSL24
SL24
40
28
40
0.40
www.paceleader.tw
1
pF
+150
SYMBOLS
*1 Repetitive peak reverse peak reverse
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
C/W
160
CJ
TSTG
*1
mA
0
70
VF
(V)
0
C
Operating Temperature
(0C)
-55 to + 125
PSL22 thru PSL24
SILICON EPITAXIAL PLANER TYPE
Crownpo Technology
www.paceleader.tw
2