Ferrite Chip Bead Z1G Series 1. PART NO. EXPRESSION : Z1GC 121 -RC-10 (a) Series code (e) R : Reel (a)(b) (c) (b) Dimension code (f) Current code : C = 300mA (c) Material code (g) 10 : ROHS Copnpliant (d) (e)(f) (g) (d) Impedance code : 121=120Ω 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m A B C D 1.00±0.10 0.50±0.10 0.50±0.10 0.25±0.10 3. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 4. GENERAL SPECIFICATION : a) Storage temp. : -40°C to +125°C b) Operating temp. : -40°C to +125°C ( including self-temperature. rise ) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 Ferrite Chip Bead Z1G Series 5. ELECTRICAL CHARACTERISTICS : Part Number Impedance (Ω) EIA Size 100MHz 1GHz DC Resistance (Ω) Max. Rated Current ( mA ) Max. Z1GC121-RC-10 0402 120 ±25% 500±40% 0.70 300 Z1GC221-RB-10 0402 220 ±25% 900±40% 1.00 250 Z1GC601-RC-10 0402 600±25% 1400±40% 0.85 300 Z1GC102-RB-10 0402 1000 ±25% 2000±40% 1.25 250 Z1GC182-RB-10 0402 1800 ±25% 2700±40% 2.20 200 NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 Ferrite Chip Bead Z1G Series 6. IMPEDANCE VS. FREQUENCY CURVES : GHB 1005CF-121T03 Z1GC121-RC-10 Z1GC221-RB-10 GHB1005CF-221T02 1500 60 0 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 80 0 40 0 Z 20 0 1000 Z 500 X X R 0 1 10 R 10 0 0 1000 1 10 FREQ UENCY(MHz) Z1GC601-RC-10 GHB1005HF-601T03 20 00 100 1000 FREQUENCY(MHz) Z1GC102-RB-10 GHB1005HF-102T02 2400 IMPEDANCE(O hm) IMPEDANCE(Ohm) 16 00 12 00 Z 8 00 X 4 00 1800 Z 1200 600 X R 0 1 10 1 00 1000 R 0 1 FREQUENCY(MHz) 10 100 1000 FREQUENCY(MHz) GHB1005HF-182T02 Z1GC182-RB-10 5000 IMPEDANCE(Ohm) 4000 3000 Z 2000 1000 X R 0 1 10 1 00 1000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 Ferrite Chip Bead Z1G Series 7. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Impedance (Z) Refer to standard electrical characteristics list Q Factor Agilent4291 Agilent E4991 Agilent4287 Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Solder Heat Resistance Rated Current < 1A ΔT 20°C Max 1. Applied the allowed DC current. Rated Current ≧ 1A ΔT 40°C Max 2. Temperature measured by digital surface thermometer. Appearance: No significant abnormality. Impedance change: Within ± 30%. Preheat : 150°C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 260±5°C Flux for lead free: ROL0 Dip Time : 10±0.5sec. Preheating Dipping 260°C 150°C Solderability 60 seconds 10±0.5 seconds Preheat : 150°C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 245±5°C More than 95% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C Terminal Strength Natural cooling 60 seconds Natural cooling Flux for lead free: ROL0 Dip Time : 4±1sec. 4±1.0 seconds The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 20(.787) For Z Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 Time (sec) > 30 Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. The duration of the applied forces shall be 60 (+ 5) Sec. Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 Ferrite Chip Bead Z1G Series 7. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. 1.0(0.039) R0.5(0.02) Series name mm (inches) P-Kgf 2 0.80 (0.033) 0.3 3 1.40 (0.055) 1.0 2.00 (0.079) 2.5 2.70 (0.106) 2.5 4 5 Chip 6 A 7 Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Impedance: within±30% Frequency : 10-55-10Hz for 15 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 15 min. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). Life testing at High Temperature Appearance : No damage. Impedance: within±30%of initial value Temperature : 125±2°C Applied Current : rated current Duration : 1008±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity Humidity : 90~95% RH. Temperature : 40±2°C Duration : 504±8hrs Measured at room temperature after placing for 2 to 3hrs. Thermal Shock Appearance : No damage. Impedance: within±30%of initial value Condition for 1 cycle Step1 : -40±2°C 30±5 min. Step2 : +105±2°C 30±5 min. Phase Temperature (°C) Times (min.) 1 -40±2°C 30±5 Number of cycles : 500 2 room temp ≦ 0.5 Measured at room temperature after placing for 2 to 3hrs. 3 +105±2°C 30±5 Low temperature storage test Measured : 500 times Drop Drop 10 times on a concrete floor from a height of 75cm. Temperature : -40±2°C Duration : 500±8hrs Measured at room temperature after placing for 2 to 3hrs. a. No mechanical damage b. Impedance change: ±30% Derating For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) Derating Curve 6 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A 85 125 Operating Temperature(?C) Operating Temperature(℃) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 Ferrite Chip Bead Z1G Series 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern 1.50 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.55 0.40 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If Use Wave soldering is there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be unwitting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) b) 350°C tip temperature for Ferrite chip bead (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm c) Never contact the ceramic with the iron tip f) Limit soldering time to 4-5 secs. Soldering Natural cooling 20~40s TP(26 0°C/40 s max.) 217 200 150 60~150s 60~180s 25 4 80s max. Preheating TEMPERATURE °C TEMPERATURE °C Preheating Time(sec.) Soldering Natural cooling 350 150 G rad ual Cooling O ve r 60s. Figure 1. Re-flow Soldering:3 times max Within4 ~5s Figure 2. Wave Soldering:1 times max NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 Ferrite Chip Bead Z1G Series 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Minimum fillet height = soldering thickness + 25% product height Upper limit t Recommendable Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 Ferrite Chip Bead Z1G Series 9. PACKAGING INFORMATION : 9-1. Reel Dimension C(mm) D(mm) Type A(mm) B(mm) 7" x 8mm 9.0±0.5 60.0±2.0 13.5±0.5 178.0±2.0 7" x 12mm 13.5±0.5 60.0±2.0 13.5±0.5 178.0±2.0 C D B A 2±0.5 7" x 8mm 13.5±0.5 7" x 12mm R10.5 R1.9 R0.5 120° 9-2 Tape Dimension / 8mm Material of taping is paper Po:4±0.1 t Bo P W:8.0±0.3 E:1.75±0.1 +0.1 -0 .0 F:3.5±0.05 D:1.5 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) Z/L 0 0.68±0.05 0.38±0.05 0.50max 2.0±0.05 0.50max none Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 1 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.1 0.60±0.03 none 2 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.1 0.95±0.05 none 3(09) 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.1 0.95±0.05 none Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 2 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.1 0.23±0.05 none 3(09) 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.1 0.22±0.05 1.0±0.10 3(12) 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.1 0.22±0.05 1.0±0.10 4(11) 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.1 0.22±0.05 1.0±0.10 5 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.1 0.22±0.05 1.0±0.10 4(09) 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.1 0.22±0.05 1.0±0.10 Ko Ao Po:4±0.1 +0.1 -0.05 t Bo P W:8.0±0.1 D:1.56 F:3.5±0.1 E:1.75±0.1 P2:2±0.1 Z/L Ko Ao Material of taping is plastic Po:4±0.1 D:1.5+0.1 t Series P A D1:1±0.1 Ao Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 P2:2±0.05 Ko Section A-A Z/L NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 Ferrite Chip Bead Z1G Series 9-2.1 Tape Dimension / 12mm Po:4±0.1 P2:2±0.05 t A P A Ao Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 7 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 Z/L Bo W:12.0±0.1 Series F:5.5±0.05 E:1.75±0.1 D:1.5+0.1 Ko Section A-A D1:1.5±0.1 9-3. Packaging Quantity Chip Size 7 6 5 4(11) 4(09) 3(12) 3(09) 2 1 0 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner Box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle Box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 Bulk (Bags) 12000 20000 30000 50000 50000 100000 150000 200000 300000 - 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10~ 40°C and 30~70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9