Chip Ferrite Bead SCGB-S Series Features u Monolithic inorganic material construction u Closed magnetic circuit avoids crosstalk u SMD Type & suitable for reflow and wave soldering u Available in various sizes u Excellent solderability and heat resistance u High reliability u Effectively filtering capability over a wide range of frequency Applications Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry, high frequency EMI prevention of computer, printers, VCRs, TVs and portable telephones. General Technical Data Operating temperature range -40 ~ +125ºC Storage Condition Less than 40℃ and 70% RH Storage Time 6 months(Size:1005), 12 months(Size:1608 above) Soldering method Reflow or Wave Soldering Part Numbering SCGB 1608 S 60 1 E P F (1) (2) (3) (4) (5) (6) (7) (8) 1 Series Name 2 Size Code: the first two digitals : length(mm), the last two digitals : width(mm) 3 Material Code 4 Impedance(Ω), ±25% 5 Fixed Decimal Point 6 Rated Current Cod e.g.: 600=60 Ω, 121=120Ω A=50mA B=80mA C=100mA D=150mA E=200mA G=400mA H=500mA I=600mA J=700mA K=800mA 7 Packaging: P - Embossed paper tape, 7" reel 8 Soldering : Green Parts: S- Soldering Lead-Free F=300mA T - Embossed plastic tape, 7" reel F- Lead-Free for whole chip SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 1/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-S Series Electrical Characteristics SCGB1005-S Series Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB1005S100FPF 10 100 0.10 300 SCGB1005S200FPF 20 100 0.20 300 SCGB1005S300FPF 30 100 0.25 300 SCGB1005S400FPF 40 100 0.30 300 SCGB1005S600FPF 60 100 0.35 300 SCGB1005S700FPF 70 100 0.35 300 SCGB1005S121FPF 120 100 0.40 300 SCGB1005S241EPF 240 100 0.70 200 SCGB1005S301EPF 300 100 0.80 200 SCGB1005S471EPF 470 100 1.00 200 SCGB1005S601EPF 600 100 1.00 300 SCGB1005S102EPF 1000 100 1.50 200 Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB1608S100IPF 10 100 0.05 600 SCGB1608S300IPF 30 100 0.08 600 SCGB1608S600IPF 60 100 0.10 600 SCGB1608S800IPF 80 100 0.10 600 SCGB1608S121IPF 120 100 0.15 600 SCGB1608S181FPF 180 100 0.30 300 SCGB1608S221FPF 220 100 0.30 300 SCGB1608S301FPF 300 100 0.35 300 SCGB1608S471FPF 470 100 0.40 300 SCGB1608S601EPF 600 100 0.45 200 SCGB1608S102CPF 1000 100 0.60 100 SCGB1608-S Series SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 2/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-S Series Electrical Characteristics (Continue) SCGB2012-S Series Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB2012S300KPF 30 100 0.05 800 SCGB2012S400KPF 40 100 0.05 800 SCGB2012S600KPF 60 100 0.15 800 SCGB2012S800KPF 80 100 0.15 800 SCGB2012S121KPF 120 100 0.15 800 SCGB2012S221HPF 220 100 0.20 500 SCGB2012S301HPF 300 100 0.20 500 SCGB2012S601HPF 600 100 0.30 500 SCGB2012S102FPF 1000 100 0.35 300 SCGB2012S202EPF 2000 100 0.50 200 Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB3216S310KTF 31 100 0.05 800 SCGB3216S500KTF 50 100 0.08 800 SCGB3216S700KTF 70 100 0.10 800 SCGB3216S121ITF 120 100 0.15 600 SCGB3216S601HTF 600 100 0.30 500 SCGB3216S102HTF 1000 100 0.40 500 SCGB3216S122HTF 1200 100 0.40 500 SCGB3216S152ETF 1500 50 0.50 200 SCGB3216S202ETF 2000 30 0.50 200 Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB3225S600KTF 60 100 0.30 800 SCGB3225S900KTF 90 100 0.30 800 SCGB3216-S Series SCGB3225-S Series SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 3/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-S Series Electrical Characteristics (Continue) SCGB4516-S Series Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB4516S800KTF 80 100 0.10 800 SCGB4516S151KTF 150 100 0.30 800 Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB4532S700KTF 70 100 0.40 800 SCGB4532S800KTF 80 100 0.40 800 SCGB4532S121KTF 120 100 0.40 800 SCGB4532-S Series Test Level：250 mV l HP4291B RF IMPEDANCE / MATERIAL ANALYZER Test Instruments： l HP4338A/B MILLIOHM METER l Agilent 8720ES S-PARAMETER NETWORK ANALYZER l HP6632B SYSTEM DC POWER SUPPLY ** For special part number which is not shown in the above table, please refer to appendix. SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 4/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-S Series Recommended Soldering Conditions Pre-heating Soldering 60~120 Second ≥30 Second Temperature (℃) 260 217 200 150 25 Time (sec.) 60~150 Second For lead free solder Construction & Dimensions Unit: mm Symbol 1005 1608 2012 3216 3225 4516 4532 (EIA 0402) (EIA 0603) (EIA 0805) (EIA 1206) (EIA 1210) (EIA 1806) (EIA 1812) L 1.00±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.25 4.50±0.25 W 0.50±0.10 0.80±0.15 1.25±0.20 1.60±0.20 2.50±0.20 1.60±0.20 3.20±0.25 T 0.50±0.10 0.80±0.15 0.90±0.20 1.10±0.20 1.30±0.20 E 0.25±0.10 0.30±0.20 0.50±0.30 0.50±0.30 0.50±0.30 0.60±0.40 0.60±0.40 L W T E 1.0±0.20 1.50±0.25 E Recommended Pad Layout Unit: mm Size A B C 1005 0.40~0.60 1.60~2.60 0.40~0.70 1608 0.50~0.70 2.10~3.10 0.65~0.95 2012 1.00~1.20 3.00~4.00 0.80~1.10 3216 2.00~2.40 4.20~5.20 1.00~1.40 3225 2.10~2.30 4.20~5.20 2.20~2.50 4516 3.40~3.70 6.30~7.30 1.30~1.70 4532 3.40~3.70 6.30~7.30 2.90~3.20 SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 5/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-S Series Tape Specifications PLASTIC CARRIER Direction of Feed PAPER CARRIER Unit: mm 1005 1608 2012 3216 3225 4516 4532 Paper Paper Paper Plastic Plastic Plastic Plastic W 8.00±0.10 8.00±0.10 8.00±0.10 7.90~8.30 7.90~8.30 11.7~12.3 12.00±0.10 P 2.00±0.05 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 8.00±0.10 E 1.75±0.05 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 F 3.50±0.05 3.50±0.10 3.50±0.10 3.50±0.05 3.50±0.05 5.50±0.05 5.50±0.05 D 1.55±0.05 1.56±0.10 1.56±0.10 1.55±0.05 1.55±0.05 1.55±0.05 1.55±0.05 D1 NA NA NA 0.95~1.20 0.95~1.20 1.50~1.75 1.50~1.75 P 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 P010 NA NA 40.0±0.20 40.0±0.20 40.0±0.20 40.0±0.20 40.0±0.20 P2 2.00±0.05 2.00±0.10 2.00±0.10 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 A0 0.62±0.03 1.05±0.05 1.50±0.05 1.85±0.10 2.57±0.10 1.83±0.10 3.66±0.10 B0 1.12±0.03 1.85±0.05 2.30±0.05 3.43±0.10 3.40±0.10 4.85±0.10 4.95±0.10 K0(T) 0.60±0.03 0.95±0.05 0.95±0.05 1.22±0.10 1.32±0.10 1.83±0.10 1.83±0.10 t NA NA NA 0.25±0.10 0.25±0.10 0.29±0.10 0.23±0.10 Symbol SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 6/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-S Series Reel Specifications & Packaging Unit: mm Part Size(EIA Size) Packaging Option Quantity 1005 (0402) 7″Reel 10,000 1608 (0603) 7″Reel 4,000 2012 (0805) 7″Reel 4,000 3216 (1206) 7″Reel 3,000 3225 (1210) 7″Reel 2,000 4516 (1806) 7″Reel 2,000 4532 (1812) 7″Reel 1,000 The Contents of a box： 1005 (0402): 6 reels / inner box 1608 (0603): 6 reels / inner box 2012 (0805): 6 reels / inner box 3216 (1206): 6 reels / inner box 3225 (1210): 6 reels / inner box 4516 (1806): 4 reels / inner box 4532 (1812): 4 reels / inner box Reliability and Test Condition Test item Temperature Cycle Operational Life Biased Humidity Resistance to Solder Heat Adhesive Test Rated Current Test Steam Aging Test Test condition a. Temperature : -40 ~ +85℃ b. Cycle : 100 cycles c. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion a. Temperature : 125℃±5℃ b. Test time : 1000 hrs c. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion a. Temperature : 40℃±2℃ b. Humidity : 90 ~ 95 % RH c. Test time : 1000 hrs d. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value a. No mechanical damage b. Induction value should be within ±20 % of the initial value a. No mechanical damage b. Induction value should be within ±20 % of the initial value a. Solder temperature : 260±5℃ b. Flux : Rosin c. DIP time : 10±1 sec a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Induction value should be within ±20 % of the initial value a. Reflow temperature : 245℃ It shall be Soldered on the substrate applying direction parallel to the substrate b. Apply force(F) : 5 N Test time : 10 sec a. No mechanical damage b. Soldering the products on PCB after the pulling test force > 5 N a. Temperature rise should be less than 25℃ Apply current : full rated current / 5min a. Temperature : 93℃ b. Test time : 4hrs Others: 8hrs c. Solder temperature : 235±5℃ d. Flux : Rosin e. DIP time : 5±1 sec SOCAY Electronics Co., Ltd. Revision February 13, 2014 Criteria More than 95 % of terminal electrode should be covered with new solder www.socay.com 7/7 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information.